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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND)
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Available format(s): Hardcopy, PDF
Language(s): English
Published date: 01-01-2005
Publisher: Comitato Elettrotecnico Italiano
FOREWORD1 Scope2 Terms and definitions3 General remarks4 Equipment5 Test procedure6 Failure criteria7 Lot acceptance (for guidance)8 Detail specification9 SummaryBibliography
Describes to detect the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
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