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  • CEI EN 61240 : 2013

    Current The latest, up-to-date edition.

    PIEZOELECTRIC DEVICES - PREPARATION OF OUTLINE DRAWINGS OF SURFACE-MOUNTED DEVICES (SMD) FOR FREQUENCY CONTROL AND SELECTION - GENERAL RULES

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2013

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Classification of SMD
    4 Title of the outline drawing
    5 Composition of the outline drawing
    6 Requirements for terminal leads
    7 Requirements for the terminal land area
    8 Connections of terminal leads
    9 Descriptive notes
    Annex A (informative) - Miniaturized leadless ceramic enclosures
            of piezoelectric devices (SMD) for frequency control
            and selection
    Annex B (informative) - Example of terminal connections for
            surface-mounted piezoelectric devices (SMD) for frequency
            control and selection
    Bibliography
    Annex ZA (normative) - Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Describes general rules for drawing all dimensional and geometrical characteristics of a surface-mounted piezoelectric device package (referred to in this document as SMD) in order to ensure mechanical inter-changeability of all outline drawings of the SMDs for frequency control and selection.

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    Committee CT 309
    Development Note Classificazione CEI 309-37. (07/2013) 2ED 2013 Edition is valid until 28-11-2019. (06/2017)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
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