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  • CEI EN 61760-1 : 2007

    Current The latest, up-to-date edition.

    SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)

    Available format(s):  Hardcopy, PDF

    Language(s):  English - Italian

    Published date:  01-01-2007

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 Requirements for component design and component specifications
    5 Specification of assembly process conditions
    6 Typical process conditions
    7 Requirements for components and component specifications
      related to suitability with various mounting processes
    Bibliography
    Annex ZA (normative) - Normative references to international
             publications with their corresponding European publications

    Abstract - (Show below) - (Hide below)

    Provides a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology.

    General Product Information - (Show below) - (Hide below)

    Committee CT 309
    Development Note Classificazione CEI 91-2 (08/2001)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 60286-5:2004/A1:2009 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS
    EN 60286-6:2004 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    EN 61340-5-1:2016/AC:2017-05 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
    IEC 62090:2017 Product package labels for electronic components using bar code and two-dimensional symbologies
    IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
    CEI 40-10 : 2ED 1998 IMBALLAGGIO DI COMPONENTI PER OPERAZIONI AUTOMATIZZATE - PARTE 3: IMBALLAGGIO DI COMPONENTI SENZA REOFORI SU NASTRI CONTINUI
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 60286-6:2004 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
    EN 62090:2017 Product package labels for electronic components using bar code and two- dimensional symbologies
    IEC 60286-5:2003+AMD1:2009 CSV Packaging of components for automatic handling - Part 5: Matrixtrays
    IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
    EN 60286-3:2013/AC:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
    ISO 8601:2004 Data elements and interchange formats Information interchange Representation of dates and times
    IEC 60068-2-77:1999 Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
    EN 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 60062:2016 Marking codes for resistors and capacitors
    EN 60062:2016/AC:2016-12 MARKING CODES FOR RESISTORS AND CAPACITORS (IEC 60062:2016/COR1:2016)
    EN 60068-2-77:1999 Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
    EN 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
    IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
    EN 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
    EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
    EN 60068-2-45:1992/A1:1993 Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
    EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
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