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  • CEI EN 62137-1-5 : 2010

    Current The latest, up-to-date edition.

    SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST

    Available format(s):  Hardcopy, PDF

    Language(s):  English - Italian

    Published date:  01-01-2010

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Test equipment and materials
    5 Mounting
    6 Test conditions
    7 Items to be included in the test report
    8 Items to be given in the product
      specification
    Annex A (normative) - Mechanical shear
            fatigue test equipment
    Annex B (normative) - Mechanical shear
            fatigue test procedure
    Annex C (informative) - Evaluation of mechanical
            properties of a single solder joint by mechanical
            shear fatigue test
    Bibliography
    Annex ZA (normative) - Normative references to
             international publications with their corresponding
             European publications

    Abstract - (Show below) - (Hide below)

    Specifies in this part of IEC 62137 applies to area array packages, such as BGA.

    General Product Information - (Show below) - (Hide below)

    Committee CT 309
    Development Note Classificazione CEI 91-63. (05/2010)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
    IEC 61188-5-8:2007 Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    CEI 9-18 : 1ED 1997 RESISTENZE OHMICHE INSERITE NEI CIRCUITI DI POTENZA DEI ROTABILI AUTOMOTORI
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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