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  • CEI EN 62435-5 : 1ED 2017

    Current The latest, up-to-date edition.

    ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES

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    Published date:  10-10-2017

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms, definitions and abbreviated terms
    4 Storage requirements
    5 Long-term storage failure mechanisms
    6 LTS concerns, method, verification and limitations
    7 Deterioration mechanisms specific to bare die and wafers
    8 Specific handling concerns
    Annex A (informative) - Audit checklist
    Bibliography
    Annex ZA (normative) - Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Pertains to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation.

    General Product Information - (Show below) - (Hide below)

    Committee CT 309
    Development Note Classificazione CEI 47-143. (10/2017)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
    IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
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