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  • CLC/TR 62258-8:2008

    Current The latest, up-to-date edition.

    Semiconductor die products - Part 8: EXPRESS model schema for data exchange

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    Language(s): 

    Published date:  22-08-2008

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General
    5 Data exchange
    Annex A (normative) EXPRESS model schema
    Annex B (informative) STEP physical file example
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    IEC/TR 62258-8:2008(E), which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This Technical Report contains an EXPRESS model schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of the IEC 62258-1, IEC 62258-5 and IEC 62258-6 standards, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC 62258-4.

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    Committee CLC/SR 47
    Document Type Technical Report
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    I.S. EN 62258-1:2010 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
    EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
    BS EN 62258-1:2010 Semiconductor die products Procurement and use
    CEI EN 62258-1 : 2011 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
    IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
    IEC 62258-5:2006 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
    EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
    ISO 10303-11:2004 Industrial automation systems and integration Product data representation and exchange Part 11: Description methods: The EXPRESS language reference manual
    EN 62258-6 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
    EN 62258-5 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
    IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
    ISO 10303-21:2002 Industrial automation systems and integration Product data representation and exchange Part 21: Implementation methods: Clear text encoding of the exchange structure
    IEC 62258-6:2006 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
    CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
    IEC TR 62258-4:2012 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
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