DD IEC PAS 62647-23 : DRAFT AUG 2011

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PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES

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Withdrawn date: 27-10-2018

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Published date: 23-11-2012

Publisher: British Standards Institution

Table of Contents - (Show below) - (Hide below)

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Symbols and abbreviated terms
5 Pb-Free Concerns
6 Materials
7 Soldering equipment
8 General rework/repair considerations
9 Pre-rework/repair processes
10 Rework/repair processes
11 Post-Rework/Repair Processes
Annex A (informative) - Termination Finishes
Annex B (informative) - Tin whiskers
Bibliography

Abstract - (Show below) - (Hide below)

Gives technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-Free alloys, or a combination of both solders and surface finishes.

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Comment Closes On
Committee	GEL/107
Document Type	Draft
ISBN
Pages
Published
Publisher	British Standards Institution
Status	Withdrawn
Superseded By	PD IEC/TS 62647-23:2013

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
IEC PAS 62647-23:2011	Identical

Standards Referencing This Book - (Show below) - (Hide below)

IPC J STD 609 : A	MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
IEC PAS 62647-2:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin
GEIA HB 0005-2 : 2007	TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
IPC J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IEC PAS 62647-1:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
IPC J STD 006 : C	REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 004 : B	REQUIREMENTS FOR SOLDERING FLUXES
IPC J STD 033C-1:2014	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IEC PAS 62647-22:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IPC A 610 : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 4101 : D	SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
GEIA STD 0005-2 : 2012	MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
GEIA HB 0005-1 : 2006	PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
GEIA STD 0005-1 : 2012	PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
IPC 7711/21 : B	REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
IEC PAS 62647-21:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
ARINC 671 : 2006	GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR

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