• DIN EN 61189-3:2008-06

    Current The latest, up-to-date edition.

    TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)

    Available format(s):  Hardcopy, PDF

    Language(s):  German

    Published date:  01-01-2008

    Publisher:  German Institute for Standardisation (Deutsches Institut für Normung)

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Introduction
    1 Scope and object
    2 Normative references
    3 Accuracy, precision and resolution
    4 Catalogue of approved test methods
    5 P: Preparation/conditioning test methods
    6 V: Visual test methods
    7 D: Dimensional test methods
    8 C: Chemical test methods
    9 M: Mechanical test methods
    10 E: Electrical test methods
    11 N: Environmental test methods
    12: X: Miscellaneous test methods
    Annex ZA (normative) Normative references to international
                         publications with their corresponding
                         European publications
    Annex A (informative) Worked examples
    Annex B (informative) Conversion table
    Figure 1 - Measuring equipment for peel strength of
               flexible printed boards
    Figure 2 - Plier fixture for thermal shock test, dip
               soldering
    Figure 3 - Fluidized sand bath
    Figure 4 - Figure deleted
    Figure 5 - Figure deleted
    Figure 6 - Suggested test specimen for surface mount
               features
    Figure 7 - Suggested test specimen for plated through holes
    Figure 8 - Rotary dip solderability test equipment
    Figure 9 - Effectiveness of solder wetting of plated through
               holes
    Figure 10 - Needle burner test
    Figure 11 - Pencil holder
    Figure 12 - Composite test pattern
    Figure 13 - Test specimen
    Table 1 - Student's "t" distribution
    Table 2 - Table deleted
    Table 3 - Table deleted
    Table 4 - Accelerated ageing and test requirements
    Table 5 - Maximum limits of solder bath contaminants

    Abstract - (Show below) - (Hide below)

    Describes methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes DIN IEC 61189-3. (06/2008)
    Document Type Standard
    Publisher German Institute for Standardisation (Deutsches Institut für Normung)
    Status Current
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