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  • DIN EN 61190-1-1:2003-01

    Current The latest, up-to-date edition.

    ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY

    Available format(s):  Hardcopy, PDF

    Language(s):  German

    Published date:  01-01-2003

    Publisher:  German Institute for Standardisation (Deutsches Institut für Normung)

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    Table of Contents - (Show below) - (Hide below)

    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 Requirements
      4.1 Conflict
      4.2 Flux classification and testing
    5 Quality assurance provisions
      5.1 Responsibility for inspection
      5.2 Classification of inspections
      5.3 Materials inspection
      5.4 Quality inspection
      5.5 Performance inspection
      5.6 Quality conformance
      5.7 Preparation of fluxes for testing
    6 Preparation for delivery
      6.1 Preservation-packing and packaging
    7 Additional information
      7.1 Flux activity
      7.2 Flux and cleaning relationship
      7.3 Ordering data
    Annex A (normative)
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications
    Bibliography
    Figures
    Tables

    Abstract - (Show below) - (Hide below)

    Describes general requirements for the classifications and testing of soldering fluxes for high-quality interconnections in electronics assembly.

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    Development Note Supersedes DIN IEC 91-141-CD (01/2003)
    Document Type Standard
    Publisher German Institute for Standardisation (Deutsches Institut für Normung)
    Status Current
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