DIN EN 61190-1-2:2014-11

Current

Current The latest, up-to-date edition.

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY (IEC 61190-1-2:2014)

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Published date: 12-01-2013

Publisher: German Institute for Standardisation (Deutsches Institut für Normung)

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Development Note	Supersedes DIN IEC 91-142-CD. (01/2003) Supersedes DIN IEC 61190-1-2. (11/2007)
Document Type	Standard
ISBN
Pages
Published
Publisher	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current
Supersedes	DIN IEC 61190-1-2:2005-09 (Draft)

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Equivalent Standard(s)	Relationship
BS EN 61190-1-2:2014	Identical
EN 61190-1-2:2014	Identical
I.S. EN 61190-1-2:2014	Identical
NF EN 61190-1-2 : 2014	Identical
IEC 61190-1-2:2014	Identical

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