Introduction
1 Scope and object
2 Normative references
3 Terms and definitions
4 General requirements
4.1 Order of precedence
4.2 Process control
4.3 Facilities
4.4 Process identification
5 Pre-process activities
5.1 Design checks
5.2 Specification and procurement of components
5.3 Specification and procurement of printed boards
5.4 Specification and procurement of process materials
5.5 Inspection plan, inspection facilities and handling
5.6 Storage and kitting of components, boards and materials
5.7 Handling during assembly, packaging and shipping
5.8 Electrical testing
6 Component preparation
6.1 Lead and termination solderability
6.2 Lead forming
6.3 Lead flattering
6.4 Lead cropping
6.5 Lead coplanarity
6.6 Thermal shock during re-tinning
6.7 Moisture and gas traps
7 Mounting structure and printed board preparation
7.1 Surface preparation
7.2 Temporary masking requirements
7.3 Gold on printed surface-mount lands
7.4 Printed board condition
8 Surface-mount solder paste deposition
8.1 Description of process
8.2 Storage and handling of solder paste
8.3 Screen (off-contact) printing
8.4 Stencil (in-contact) printing
8.5 Syringe dispensing
8.6 Transfer deposition of solder performs
9 Non-conductive adhesive deposition and curing
9.1 Stencil printing
9.2 Syringe dispensing
9.3 Pin transfer printing
9.4 Adhesive curing
10 Surface-mounted component placement
10.1 Leadless discrete components with metallized
terminations
10.2 Leadless circular cylinder components, for example,
metal electrode leadless faces (MELFs)
10.3 Leaded discrete small component packages
10.4 Leaded integrated circuit packages
10.5 Leaded 'fine-pitch' integrated circuit packages
10.6 Modified leaded through-hole packages
10.7 Leadless chip carrier packages
10.8 Placement equipment
11 Through-hole component insertion
11.1 General
11.2 Axial lead components (two-leads)
11.3 Radial lead components (two-leads)
11.4 Radial lead components (three or more leads)
11.5 Multilead integrated circuit packages
11.6 Pin grid array (PGA) components
11.7 Surface mount packages modified for insertion
11.8 Large components
11.9 Insertion methods and equipment
11.10 Cutting and clinching leads
12 Placement of terminals and press-fit pins
12.1 Attachment of terminals to printed boards
12.2 Solderability wires and component leads to terminals
13 Reflow soldering
13.1 Infrared reflow soldering in pass-through equipment
13.2 Convection reflow solderability in pass-through equipment
13.3 Mixed infrared and convection reflow soldering in
pass-through equipment
13.4 Vapour phase reflow soldering
13.5 Laser scan reflow soldering
13.6 Thermode (hot bar) reflow soldering
13.7 Hot gas multijet reflow soldering
13.8 Focused infrared multi-point reflow soldering
14 Immersion soldering
14.1 General requirements
14.2 Wave soldering
14.3 Drag soldering
14.4 Hot dip soldering
15 Individual point soldering
15.1 Manual soldering with an iron
15.2 Hot gas pencil reflow soldering
16 Cleanliness/cleaning
16.1 Use of 'no clean' fluxes
16.2 Cleaning materials
16.3 Cleaning processes
16.4 Cleanliness assessment
17 Electrical test
17.1 In-circuit test
17.2 Functional test
17.3 Test probes and probe lands
18 Rework and repair
18.1 General
18.2 Unmarked components
18.3 Pre-heating printed boards and sensitive components
18.4 Re-use of removed components
18.5 Selection of rework tools and equipment
18.6 Surface-mounted component realignment
18.7 Adding solder to existing joints
18.8 Removing excess solder
18.9 Component removal
18.10 Component replacement
18.11 Repair of assemblies returned from the field
19 Conformal coatings, including solder resist
19.1 General
19.2 Conformal protective coating
19.3 Solder mask coating
20 Packaging and shipping
20.1 Materials
20.2 Mechanical protection
20.3 Marking/labelling
20.4 Handling
21 Training
21.1 Training of designers, engineers and senior line
management
21.2 Training production line personnel
Figures
Tables