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  • EN 60068-2-66:1994

    Current The latest, up-to-date edition.

    Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)

    Available format(s): 

    Language(s): 

    Published date:  29-08-1994

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Clause
    1. Scope
    2. General description
    3. Description of test apparatus
    4. Severities
    5. Initial measurements
    6. Testing
    7. Intermediate measurements
    8. Recovery
    9. Final measurements
    10. Information to be given in the relevant specification
    Annexes
    A. Steam table
    B. Physical significance of the test
    C. Determination of humidity
    D. Test apparatus and handling

    Abstract - (Show below) - (Hide below)

    Provides a standard test procedure for the prupose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically sealed components, to the deteriorative effect of damp heat. The test is not intended to evaluate external effects, such as corrosion and deformation. Has the status of a basic safety publication in accordance with IEC Guide 104.

    General Product Information - (Show below) - (Hide below)

    Committee CLC/SR 104
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 60674-3-8 : 2011 PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION (IEC 60674-3-8:2011)
    BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
    I.S. EN 60068-2-69:2017 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
    EN 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
    EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    VDE 0468-2-69 : 2018 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
    CEI EN 60674-3-8 : 2012 PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION
    DIN EN 60068-2-69 : 2007 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
    OVE/ONORM EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
    CEI EN 61189-5-503 : 1ED 2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    BS EN 60068-2-20:2008 Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-69:2017/AC:2018-03 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018)
    I.S. EN 60068-2-20:2008 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    BS EN 60068-2-69:2017 Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    CEI EN 60068-2-69 : 2008 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
    I.S. EN 60674-3-8:2011 PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION
    I.S. EN 61189-5-503:2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    CEI EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    EN 60674-3-8:2011/A1:2017 PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION (IEC 60674-3-8:2011/A1:2016)
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