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  • EN 60749-20-1 : 2009

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT

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    Language(s): 

    Published date:  05-06-2009

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General applicability and reliability considerations
      4.1 Assembly processes
          4.1.1 Mass reflow
          4.1.2 Localized heating
          4.1.3 Socketed components
          4.1.4 Point-to-point soldering
      4.2 Reliability
    5 Dry packing
      5.1 Requirements
      5.2 Drying of SMDs and carrier materials before being
          sealed in MBBs
          5.2.1 Drying requirements - level A2
          5.2.2 Drying requirements - levels B2a to B5a
          5.2.3 Drying requirements - carrier materials
          5.2.4 Drying requirements - other
          5.2.5 Excess time between bake and bag
      5.3 Dry pack
          5.3.1 Description
          5.3.2 Materials
          5.3.3 Labels
          5.3.4 Shelf life
    6 Drying
      6.1 Drying options
      6.2 Post exposure to factory ambient
          6.2.1 Floor life clock
          6.2.2 Any duration exposure
          6.2.3 Short duration exposure
      6.3 General considerations for baking
          6.3.1 High-temperature carriers
          6.3.2 Low-temperature carriers
          6.3.3 Paper and plastic container items
          6.3.4 Bakeout times
          6.3.5 ESD protection
          6.3.6 Reuse of carriers
          6.3.7 Solderability limitations
    7 Use
      7.1 Floor life clock start
      7.2 Incoming bag inspection
          7.2.1 Upon receipt
          7.2.2 Component inspection
      7.3 Floor life
      7.4 Safe storage
          7.4.1 Safe storage categories
          7.4.2 Dry pack
          7.4.3 Dry atmosphere cabinet
      7.5 Reflow
          7.5.1 Reflow categories
          7.5.2 Opened MBB
          7.5.3 Reflow temperature extremes
          7.5.4 Additional thermal profile parameters
          7.5.5 Multiple reflow passes
          7.5.6 Maximum reflow passes
      7.6 Drying indicators
          7.6.1 Drying requirements
          7.6.2 Excess humidity in the dry pack
          7.6.3 Floor life or ambient temperature/humidity exceeded
          7.6.4 Level B6 SMDs
    Annex A (normative) - Symbol and labels for moisture-sensitive
            devices
    Annex B (informative) - Board rework
    Annex C (informative) Derating due to factory environmental
            conditions
    Bibliography
    Annex ZA (normative) - Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Pertains to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air.

    General Product Information - (Show below) - (Hide below)

    Committee SR 47
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 62137-4:2014 Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
    EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
    EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
    I.S. EN 62435-2:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
    EN 61760-4:2015/A1:2018 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018)
    BS EN 62435-2:2017 Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms
    I.S. EN 62435-1:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
    CEI EN 62435-2 : 1ED 2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
    CEI EN 62435-1 : 1ED 2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
    BS EN 62435-5:2017 Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices
    BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices General
    BS EN 61760-4 : 2015 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
    I.S. EN 61760-4:2015 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
    EN 62137-4:2014/AC:2015 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)
    EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    IEC 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
    IEC 60749-30:2005+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
    EN 60749-30 : 2005 AMD 1 2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    IEC 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
    EN 60749-39 : 2006 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 39: MEASUREMENT OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC MATERIALS USED FOR SEMICONDUCTOR COMPONENTS
    IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    EN 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
    EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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