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  • EN 60749-30 : 2005 AMD 1 2011

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING

    Available format(s): 

    Superseded date:  01-10-2020

    Language(s): 

    Published date:  12-01-2013

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 General description
    4 Test apparatus and materials
    5 Procedure
    6 Summary
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Defines a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.

    General Product Information - (Show below) - (Hide below)

    Committee SR 47
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 60749-20-1 : 2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    CEI EN 60749-20-1 : 2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    BS EN 60749-20-1:2009 Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
    I.S. EN 60749-20-1:2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    EN 60749-24:2004 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
    IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
    IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
    EN 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
    IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
    IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
    EN 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
    EN 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
    IEC 60749-33:2004 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
    IEC 60749-24:2004 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
    EN 60749-33:2004 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
    EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
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