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  • EN 61188-5-2:2003

    Current The latest, up-to-date edition.

    Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

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    Language(s): 

    Published date:  23-09-2003

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Packaging
    4 Fixed rectangular chip resistors
       4.1 Introductory remark
       4.2 Component description
       4.3 Component dimensions
       4.4 Solder joint fillet design
       4.5 Land pattern dimensions
    5 Fixed cylindrical chip resistors
       5.1 Introductory remark
       5.2 Component description
       5.3 Component dimensions
       5.4 Solder joint fillet design
       5.5 Land pattern dimensions
    6 Fixed multilayer ceramic chip capacitors
       6.1 Introductory remark
       6.2 Component description
       6.3 Component dimensions
       6.4 Solder joint fillet design
       6.5 Land pattern dimensions
    7 Fixed tantalum chip capacitors
       7.1 Introductory remark
       7.2 Component description
       7.3 Component dimensions
       7.4 Solder joint fillet design
       7.5 Land pattern dimensions
    8 Fixed aluminium electrolytic chip capacitors with non-solid
       electrolyte (vertical type)
       8.1 Introductory remark
       8.2 Component description
       8.3 Component dimensions
       8.4 Solder joint fillet design
       8.5 Land pattern dimensions
    9 Fixed aluminium electrolytic chip capacitors with non-solid
       electrolyte (horizontal type)
       9.1 Introductory remark
       9.2 Component description
       9.3 Component dimensions
       9.4 Solder joint fillet design
       9.5 Land pattern dimensions
    10 Fixed film chip capacitors
       10.1 Introductory remark
       10.2 Component description
       10.3 Component dimensions
       10.4 Solder joint fillet design
       10.5 Land pattern dimensions
    11 Fixed chip inductors (multilayer type)
       11.1 Introductory remark
       11.2 Component description
       11.3 Component dimensions
       11.4 Solder joint fillet design
       11.5 Land pattern dimensions
    12 Fixed chip inductors (wire wound type)
    13 SC-59/TO-236 - Transistors
    14 SC-62/TO-243 - Transistors
    15 SC-61/TO-253 - Transistors
    16 SC-73 - Diodes
    17 SC-63/TO-252 - Transistors
    18 SC-77 - Transistors
    Figures
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

    General Product Information - (Show below) - (Hide below)

    Committee CLC/SR 91
    Development Note To be read in conjunction with EN 61188-5-1 (09/2003)
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
    I.S. EN 62137-1-2:2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
    BS EN 62137-1-2:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
    I.S. EN 62025-2:2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
    CEI EN 62137-1-2 : 2008 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
    BS EN 62025-2:2005 High frequency inductive components. Non-electrical characteristics and measuring methods Test methods for non-electrical characteristics
    OVE/ONORM EN 62025-2 : 2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 60286-5:2004/A1:2009 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS
    EN 60384-20:2015 Fixed capacitors for use in electronic equipment - Part 20: Sectional specification - Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors
    EN 60286-6:2004 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 61605:2016 Fixed inductors for use in electronic and telecommunication equipment - Marking codes
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IEC 60384-20:2015 Fixed capacitors for use in electronic equipment - Part 20: Sectional specification - Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors
    EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    IEC 60286-6:2004 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
    IEC 60384-10:1989 Fixed capacitors for use in electronic equipment. Part 10: Sectional specification: Fixed multilayer ceramic chip capacitors
    IEC 60286-5:2003+AMD1:2009 CSV Packaging of components for automatic handling - Part 5: Matrixtrays
    EN 61605:2017 Fixed inductors for use in electronic and telecommunication equipment - Marking codes
    EN 60286-3:2013/AC:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
    IEC 60384-3:2016 Fixed capacitors for use in electronic equipment - Part 3: Sectional specification - Surface mount fixed tantalum electrolytic capacitors with solid (MnO2) electrolyte
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    EN 60115-1:2011/A11:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 60051:1973 Recommendations for direct acting indicating electrical measuring instruments and their accessories
    IEC 60384-18:2016 Fixed capacitors for use in electronic equipment - Part 18: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) and non-solid electrolyte
    IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
    EN 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
    IEC 60115-8:2009 Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
    IPC SM 782 : A1993 AMD 2 1999 SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
    IEC 60115-1:2008 Fixed resistors for use in electronic equipment - Part 1: Generic specification
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