EN 61188-5-4 : 2007

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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES

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Published date: 23-11-2007

Publisher: European Committee for Standards - Electrical

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Table of Contents - (Show below) - (Hide below)

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Packaging
  3.4 Process considerations
4 Small outlined J packages (SOJ)
  4.1 Component description
  4.2 Component dimensions
  4.3 Solder joint fillet design
  4.4 Land pattern dimensions
Annex ZA (normative) - Normative references to international
                       publications with their corresponding
                       European publications
Bibliography

Abstract - (Show below) - (Hide below)

Provides the component and land pattern dimensions for small outline integrated circuits with 'J' leads on two sides (SOJ components) used in the reflow soldering process.

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Committee	SR 91
Development Note	To be read in conjunction with EN 61188-5-1. (12/2007)
Document Type	Standard
ISBN
Pages
Published
Publisher	European Committee for Standards - Electrical
Status	Current

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Equivalent Standard(s)	Relationship
NF EN 61188-5-4 : 2016	Identical
IEC 61188-5-4:2007	Identical
NBN EN 61188-5-4 : 2008	Identical
NEN EN IEC 61188-5-4 : 2007	Identical
I.S. EN 61188-5-4:2007	Identical
PN EN 61188-5-4 : 2008	Identical
UNE-EN 61188-5-4:2007	Identical
BS EN 61188-5-4:2007	Identical
CEI EN 61188-5-4 : 2008	Identical
DIN EN 61188-5-4:2008-07	Identical

Standards Referencing This Book - (Show below) - (Hide below)

EN 60286-5:2004/A1:2009	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
EN 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 60286-5:2003+AMD1:2009 CSV	Packaging of components for automatic handling - Part 5: Matrixtrays
EN 60286-3:2013/AC:2013	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IEC 60286-3:2013	Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
EN 60286-4:2013	Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
IEC 60286-4:2013	Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms

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