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  • EN 61189-11 : 2013

    Current The latest, up-to-date edition.

    TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS

    Available format(s): 

    Language(s): 

    Published date:  28-06-2013

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Summary of measuring methods
    5 Test equipment
    6 Calibration of the temperature
    7 Procedure for the measuring method
    Annex A (normative) - Test report on melting temperatures
            of solder alloys
    Annex B (informative) - Examples of test result (Method A)
    Annex C (informative) - Example of test result (Method B)
    Annex ZA (normative) - Normative references to international
             Publications with their corresponding
             European publications
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

    General Product Information - (Show below) - (Hide below)

    Committee SR 91
    Document Type Test Method
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods

    Standards Referencing This Book - (Show below) - (Hide below)

    EN ISO 11357-1:2016 Plastics - Differential scanning calorimetry (DSC) - Part 1: General principles (ISO 11357-1:2016)
    IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
    EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    EN ISO 9453:2014 Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    ISO 11357-1:2016 Plastics — Differential scanning calorimetry (DSC) — Part 1: General principles
    EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    View more information

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