EN 61191-3 : 2017

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Current The latest, up-to-date edition.

PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)

Publisher: European Committee for Standards - Electrical

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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Through-hole mounting of components
6 Acceptance requirements
7 Rework of unsatisfactory solder connections
Annex A (normative) - Placement requirements for
        through-hole mount devices
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

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Defines requirements for lead and hole solder assemblies.

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Published
Document Type	Standard
Status	Current
Publisher	European Committee for Standards - Electrical
Pages
ISBN
Committee	SR 91

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Equivalent Standard(s)	Relationship
DIN EN 61191-3:2018	Identical
CEI EN 61191-3 : 2005	Identical
SS-EN 61191-3:2018	Identical
BS EN 61191-3 : 2017	Identical
NEN EN IEC 61191-3 : 2017	Identical
DIN EN 61191-3 : 2016	Identical
DS EN 61191-3 : 2017	Identical
UNE-EN 61191-3:2017	Identical
PN EN 61191-3 : 2017	Identical
IEC 61191-3 : 2.0	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

BS EN 61193-1 : 2002	QUALITY ASSESSMENT SYSTEMS - REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
BS EN 61192-5 : 2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
BS EN 61192-2 : 2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES
BS EN 61192-1 : 2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
BS EN 61192-3 : 2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
BS EN 60068-2-20 : 2008	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
I.S. EN 61192-3:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
I.S. EN 61193-1:2002	QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
I.S. EN 61192-1:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
I.S. EN 61192-2:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES
I.S. EN 61192-5:2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
CEI EN 60068-2-20 : 2009	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
I.S. EN 60068-2-20:2008	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
BS EN 61191-1 : 2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES

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EN 61191-3 : 2017

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