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  • EN 62878-1-1:2015

    Current The latest, up-to-date edition.

    Device embedded substrate - Part 1-1: Generic specification - Test methods

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    Published date:  10-07-2015

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms, definitions and abbreviations
    4 Test methods
    5 Shipping inspection
    Annex A (informative) - Related test methods
    Bibliography
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    IEC 62878-1-1:2015 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

    General Product Information - (Show below) - (Hide below)

    Committee CLC/SR 91
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    I.S. EN 62326-20:2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
    BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
    EN 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
    EN ISO 15184:2012 Paints and varnishes - Determination of film hardness by pencil test (ISO 15184:2012)
    IEC 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
    IEC 62421:2007 Electronics assembly technology - Electronic modules
    IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
    EN 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    EN ISO 9445-1:2010 Continuously cold-rolled stainless steel - Tolerances on dimensions and form - Part 1: Narrow strip and cut lengths (ISO 9445-1:2009)
    EN 60068-2-64:2008 ENVIRONMENTAL TESTING - PART 2-64: TESTS - TEST FH: VIBRATION, BROADBAND RANDOM AND GUIDANCE
    EN ISO 2409:2013 Paints and varnishes - Cross-cut test (ISO 2409:2013)
    ISO 3366:1999 Coated abrasives Abrasive rolls
    IEC 62137-1-3:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
    IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    ISO 4957:1999 Tool steels
    EN 61189-11 : 2013 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS
    IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    IEC 60068-2-64:2008 Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance
    IEC 60068-2-53:2010 Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests
    ISO 15184:2012 Paints and varnishes Determination of film hardness by pencil test
    EN ISO 4957:1999 Tool steels (ISO 4957:1999)
    IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
    EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    ISO 6906:1984 Vernier callipers reading to 0,02 mm
    ISO 29864:2007 Self adhesive tapes Measurement of breaking strength and elongation at break
    ISO 9180:1988 Black leads for wood-cased pencils Classification and diameters
    EN ISO 9453:2014 Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
    EN 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
    ISO 6353-3:1987 Reagents for chemical analysis — Part 3: Specifications — Second series
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    ISO 29863:2007 Self adhesive tapes Measurement of static shear adhesion
    IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
    ISO 29862:2007 Self adhesive tapes Determination of peel adhesion properties
    ISO 3599:1976 Vernier callipers reading to 0,1 and 0,05 mm
    EN 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    ISO 8512-1:1990 Surface plates — Part 1: Cast iron
    ISO 291:2008 Plastics Standard atmospheres for conditioning and testing
    EN ISO 3611:2010 Geometrical product specifications (GPS) - Dimensional measuring equipment: Micrometers for external measurements - Design and metrological characteristics (ISO 3611:2010)
    IEC 60068-2-80:2005 Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode
    ISO 3611:2010 Geometrical product specifications (GPS) — Dimensional measuring equipment: Micrometers for external measurements — Design and metrological characteristics
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    EN 60068-2-78:2013 Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
    EN ISO 291:2008 Plastics - Standard atmospheres for conditioning and testing (ISO 291:2008)
    EN 60068-2-6:2008 Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal)
    EN 61189-1 : 97 AMD 1 2001 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
    EN 62137-1-3:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
    ISO 8512-2:1990 Surface plates — Part 2: Granite
    EN 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
    EN 60068-2-66:1994 Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    ISO 21948:2001 Coated abrasives Plain sheets
    IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    EN 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
    ISO 2409:2013 Paints and varnishes Cross-cut test
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    ISO 9445-1:2009 Continuously cold-rolled stainless steel Tolerances on dimensions and form Part 1: Narrow strip and cut lengths
    EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    EN 60068-2-53:2010 Environmental testing - Part 2-53: Tests and guidance: Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests
    EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    EN 62421:2007 Electronics assembly technology - Electronic modules
    IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
    EN 60068-2-80:2005 Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode
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