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  • EN ISO 9453:2014

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)

    Available format(s): 

    Superseded date:  21-10-2020

    Language(s): 

    Published date:  06-08-2014

    Publisher:  Comite Europeen de Normalisation

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Introduction
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Chemical composition
    5 Forms of delivery
    6 Sampling and analysis
    7 Marking, labelling and packaging
    Annex A (informative) - Comparison between alloy numbers
            in ISO 9453 and short names and chemical
            compositions according to IEC 61190-1-3
    Annex B (informative) - Patented alloys and patent holder list
    Bibliography

    Abstract - (Show below) - (Hide below)

    ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

    General Product Information - (Show below) - (Hide below)

    Committee CEN/TC 121
    Development Note Supersedes EN 29453. (11/2006) Supersedes PREN ISO 9453. (09/2014)
    Document Type Standard
    Publisher Comite Europeen de Normalisation
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    I.S. EN 13148:2010 COPPER AND COPPER ALLOYS - HOT-DIP TINNED STRIP
    EN 61189-11 : 2013 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS
    EN 60851-4:2016 Winding wires - Test methods - Part 4: Chemical properties
    EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    BS EN 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys
    BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
    I.S. EN 61189-3:2008 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
    I.S. EN 61190-1-3:2007 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    BS EN 13148:2010 Copper and copper alloys. Hot-dip tinned strip
    DIN EN 13148:2010-12 Copper and copper alloys - Hot-dip tinned strip
    UNI EN 806-4 : 2010 SPECIFICATIONS FOR INSTALLATIONS INSIDE BUILDINGS CONVEYING WATER FOR HUMAN CONSUMPTION - PART 4: INSTALLATION
    BS EN 806-4:2010 Specifications for installations inside buildings conveying water for human consumption Installation
    I.S. EN 61189-11:2013 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS (IEC 61189-11:2013 (EQV))
    EN IEC 62024-1:2018 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
    BS EN 61190-1-3 : 2007 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    NF EN 806-4 : 2010 SPECIFICATIONS FOR INSTALLATIONS INSIDE BUILDINGS CONVEYING WATER FOR HUMAN CONSUMPTION - PART 4: INSTALLATION
    UNI EN 13148 : 2010 COPPER AND COPPER ALLOYS - HOT-DIP TINNED STRIP
    BS EN 60851-4:1998 Winding Wires. Test methods Chemical properties
    DIN EN 806-4:2010-06 Specifications for installations inside buildings conveying water for human consumption - Part 4: Installation
    I.S. EN 60851-4:2016 WINDING WIRES - TEST METHODS - PART 4: CHEMICAL PROPERTIES
    I.S. EN 806-4:2010 SPECIFICATIONS FOR INSTALLATIONS INSIDE BUILDINGS CONVEYING WATER FOR HUMAN CONSUMPTION - PART 4: INSTALLATION
    UNE-EN 13148:2012 Copper and copper alloys - Hot-dip tinned strip
    EN 806-4:2010 Specifications for installations inside buildings conveying water for human consumption - Part 4: Installation
    BS EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards)
    10/30227098 DC : 0 BS EN 16125 - LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG LIQUID PHASE AND VAPOUR PRESSURE PHASE
    I.S. EN IEC 62024-1:2018 HIGH FREQUENCY INDUCTIVE COMPONENTS - ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 1: NANOHENRY RANGE CHIP INDUCTOR
    EN 13148 : 2010 COPPER AND COPPER ALLOYS - HOT-DIP TINNED STRIP
    EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

    Standards Referencing This Book - (Show below) - (Hide below)

    ISO 3677:2016 Filler metal for soldering and brazing — Designation
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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