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  • GEIA HB 0005-3 : 2008

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS

    Available format(s):  Hardcopy, PDF

    Superseded date:  25-03-2022

    Language(s):  English

    Published date:  01-01-2008

    Publisher:  Government Electronics & Information Technology Association

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Introduction
    1.0 Scope
    2.0 References
    3.0 Terms and Definitions
    4.0 Symbols and Abbreviated Terms
    5.0 Pb-Free Concerns
    6.0 Materials
    7.0 Soldering Equipment
    8.0 General Rework/Repair Considerations
    9.0 Pre-Rework/Repair Processes
    10.0 Rework/Repair Processes
    11.0 Post-Rework/Repair Processes
    Annex A - Termination Finishes
    Annex B - Tin Whiskers

    Abstract - (Show below) - (Hide below)

    Describes technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes.

    General Product Information - (Show below) - (Hide below)

    Committee G-24
    Document Type Standard
    Publisher Government Electronics & Information Technology Association
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
    GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
    IEC TS 62239-1:2015 Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    NASA JSC 66491 : 2013 STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    17/30365636 DC : 0 BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
    PD IEC/TS 62239-1:2015 Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    IPC 7721 : 1998 REPAIR AND MODIFICATION OF PRINTED BOARDS AND ELECTRONIC ASSEMBLIES
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    GEIA STD 0005-3 : 2013 PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES
    IPC 7711 : 1998 REWORK OF ELECTRONIC ASSEMBLIES
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    GEIA STD 0005-2 : 2012 MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    ARINC 671 : 2006 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
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