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  • GEIA STD 0006 : 2008

    Current The latest, up-to-date edition.

    REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2008

    Publisher:  Government Electronics & Information Technology Association

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    Table of Contents - (Show below) - (Hide below)

    1. SCOPE
    2. REFERENCES
    3. DEFINITIONS AND ACRONYMS
    4. TYPES AND CATEGORIES
    5. GENERAL REQUIREMENTS
    6. DOCUMENTATION
    7. EQUIPMENT, TOOLS, AND MATERIALS
    8. OVERALL PROCESS FLOW
    9. PROCESS QUALIFICATION
    10. PRODUCTION LOT TEST REQUIREMENTS
    11. TEST METHODS
    12. NOTES
    ADDENDUM A - REQUIREMENTS FOR SERVICE FORM
    ADDENDUM B - PROCESS COMPLIANCE MATRIX

    Abstract - (Show below) - (Hide below)

    Describes the requirements for fully replacing undesirable surface finishes using robotic hot solder dip.

    General Product Information - (Show below) - (Hide below)

    Committee G-24
    Document Type Standard
    Publisher Government Electronics & Information Technology Association
    Status Current

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    IEC TS 62647-21:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
    GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
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    PD IEC/TS 62647-21:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Program management. Systems engineering guidelines for managing the transition to lead-free electronics
    PD IEC/TS 62647-2:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
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    Standards Referencing This Book - (Show below) - (Hide below)

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    IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    GEIA STD 0005-2 : 2012 MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
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    IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
    ISO 10012:2003 Measurement management systems — Requirements for measurement processes and measuring equipment
    MIL-PRF-38535 Revision K:2013 Integrated Circuits (Microcircuits) Manufacturing, General Specification for
    IPC J STD 075 : 0 CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
    FED-STD-595 Revision C:2008 COLORS USED IN GOVERNMENT PROCUREMENT
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