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SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
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Available format(s): Hardcopy, PDF
Language(s): English
Published date: 01-01-2007
Publisher: National Standards Authority of Ireland
FOREWORDINTRODUCTION1 Scope and object2 Normative references3 Terms and definitions4 Handling - Good practice 4.1 General 4.2 Working environmental controls 4.3 General handling precautions 4.4 Cleanroom good practice5 Process handling issues 5.1 Wafer sawing 5.2 Die sorting6 Die and wafer transport and storage media 6.1 Wafer carriers and cassettes 6.2 In-process carriers and transport systems 6.3 Packing for shipment of unsawn wafers 6.4 Packing for shipment of sawn wafers 6.5 Packing for shipment of single wafers 6.6 Packing for shipment of die using trays 6.7 Packing for shipment of die using tape-and-reel 6.8 Secondary packing for shipment7 Storage good practice 7.1 Die and wafer storage 7.2 Short-term storage environment and conditions 7.3 Storage time limitations 7.4 Sawn wafer on wafer frame or ring 7.5 Die products in the production area 7.6 Die in tape-and-reel 7.7 Dry-packed die products8 Traceability good practice 8.1 General 8.2 Wafer traceability 8.3 Die products traceability 8.4 Wafer and die back side marking9 Guidelines for long-term storage (die banking) of bare die and wafers 9.1 General 9.2 Preparing for storage 9.3 Damage to die products during long-term storage 9.4 Long-term storage environment 9.5 Recommended inert atmosphere purity 9.6 Chemical contamination 9.7 Electrical effects 9.8 Protection from radiation 9.9 Periodic qualification of stored die products10 Good practice for automated handling during assembly 10.1 Removal of die from shipping media 10.2 Equipment out of serviceAnnex A (informative) Planning checklistAnnex B (informative) Material specificationsBibliographyAnnex ZA (normative) Normative references to international publications with their corresponding European publications
Facilitates the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, and - minimally or partially encapsulated die and wafers.
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