• I.S. EN 165000-1:1998

    Current The latest, up-to-date edition.

    FILM AND HYBRID INTEGRATED CIRCUITS - PART 1: GENERIC SPECIFICATION CAPABILITY APPROVAL PROCEDURE

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-1998

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    1 GENERAL
      1.1 Scope
      1.2 Normative references
      1.3 Units, symbols and terminology
      1.4 Standard and preferred values
      1.5 Marking of circuit and package
    2 QUALITY ASSESSMENT PROCEDURES
      2.1 General
          2.1.1 Eligibility for capability approval
          2.1.2 Primary stage of manufacture
          2.1.3 Subcontracting
          2.1.4 Control of procurement sources and incoming material
          2.1.5 Validity of release
          2.1.6 Rework
      2.2 Procedures for capability approval
          2.2.1 Application for capability approval
          2.2.2 Granting of capability approval
          2.2.3 Description of capability
          2.2.4 Capability qualifying component
          2.2.5 Demonstration and verification of capability
          2.2.6 Procedures to be followed in the event of CQC failure
          2.2.7 Abstract of description of capability
      2.3 Procedure following the granting of capability approval
          2.3.1 Maintenance of capability approval
          2.3.2 Modification likely to affect the validity of capability
                approval
      2.4 Release for delivery
          2.4.1 General
          2.4.2 Quality conformance inspection, reguirements
          2.4.3 Detail specification
                2.4.3(1) General
                2.4.3(2) Customer detail specifications
                2.4.3(3) Detail specification for standard catalogue items
                         to be included in the Qualified Products List (QPL)
    3 TEST AND MEASUREMENT PROCEDURES
      3.1 General
      3.2 Standard condition for testing
      3.3 Visual inspection and package dimensions
      3.4 Electrical measurement procedures
      3.5 Environmental test procedures
    Figures

    Abstract - (Show below) - (Hide below)

    Defines the quality assessment procedures and methods of tests to be used in the assessment of film and hybrid integrated circuits intended for use in electronic equipment, under the capability approval procedure.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    CECC 00114-3 : 94 AMD 2 CAPABILITY APPROVAL OF AN ELECTRONIC COMPONENT MANUFACTURING ACTIVITY
    HD 323.2.11 : 200S1 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST KA: SALT MIST
    HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-27:2008 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
    IEC 60134:1961 Rating systems for electronic tubes and valves and analogous semiconductor devices
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 100012 : 1995 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: X-RAY INSPECTION OF ELECTRONIC COMPONENTS
    EN 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    HD 323.2.33 : 200S1 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - GUIDANCE ON CHANGE OF TEMPERATURE TESTS
    IEC 60068-2-11:1981 Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist
    EN 60068-2-7:1993 Environmental testing - Part 2: Tests - Test Ga: Acceleration, steady state
    CECC 00114 : 93 AMD 1 QUALITY ASSESSMENT PROCEDURES - APPROVAL OF MANUFACTURERS AND OTHER ORGANIZATIONS
    HD 323.2.30 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2: TESTS - TEST DB AND GUIDANCE: DAMP HEAT, CYCLIC (12 + 12-HOUR CYCLE)
    EN 60068-2-27:2009 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
    HD 323.2.3 : 200S2 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE
    IEC 60068-2-47:2005 Environmental testing - Part 2-47: Test - Mounting of specimens for vibration, impact and similar dynamic tests
    IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
    EN 100114-1 : 1996 RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION
    EN 60068-2-17:1994 Environmental testing - Part 2: Tests - Test Q: Sealing
    IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC TR 60440:1973 Method of measurement of non-linearity in resistors
    IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
    CECC 00016 : 1990 BASIC SPECIFICATION - BASIC REQUIREMENTS FOR THE USE OF STATISTICAL PROCESS CONTROL (SPC) IN THE CECC SYSTEM
    HD 323.2.44 : 200S1 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - GUIDANCE ON TEST T : SOLDERING
    IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
    EN 60068-2-6:2008 Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal)
    IEC 60748-1:2002 Semiconductor devices - Integrated circuits - Part 1: General
    CECC 00300 : 1996 REGISTER OF CECC SPECIFICATIONS
    IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    HD 323.2.21 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
    IEC 60068-2-44:1995 Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    CECC 00007 : 1978 BASIC SPECIFICATION: SAMPLING PLANS AND PROCEDURES FOR INSPECTION BY ATTRIBUTES
    EN 60068-2-45:1992/A1:1993 Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
    CECC 00400 : 86 ERRATUM 92 HANDBOOK FOR THE PRODUCTION OF CECC DOCUMENTS
    EN 60695-2-2:1994/A1:1995 FIRE HAZARD TESTING - TEST METHODS - NEEDLE-FLAME TEST
    EN 60068-2-47:2005 Environmental testing - Part 2-47: Tests - Mounting of specimens for vibration, impact and similar dynamic tests
    IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
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