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ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
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Available format(s): Hardcopy, PDF
Superseded date: 01-02-2022
Language(s): English
Published date: 01-01-2008
Publisher: National Standards Authority of Ireland
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.Only cited Standards give presumption of conformance to New Approach Directives/Regulations.Dates of withdrawal of national standards are available from NSAI.
FOREWORD1 Scope and object2 Normative references3 Terms and definitions4 Test Ta: Solderability of wire and tag terminations 4.1 Object and general description of the test 4.1.1 Test methods 4.1.2 Specimen preparation 4.1.3 Initial measurements 4.1.4 Accelerated ageing 4.2 Method 1: Solder bath 4.2.1 Description of the solder bath 4.2.2 Flux 4.2.3 Procedure 4.2.4 Test conditions 4.2.5 Final measurements and requirements 4.3 Method 2: Soldering iron at 350 degrees C 4.3.1 Description of soldering irons 4.3.2 Solder and flux 4.3.3 Procedure 4.3.4 Final measurements and requirements 4.4 Information to be given in the relevant specification5 Test Tb: Resistance to soldering heat 5.1 Object and general description of the test 5.1.1 Test methods 5.1.2 Initial measurements 5.2 Method 1: Solder bath 5.2.1 Description of the solder bath 5.2.2 Flux 5.2.3 Procedure 5.2.4 Test conditions 5.2.5 De-wetting 5.3 Method 2: Soldering iron 5.3.1 Description of soldering iron 5.3.2 Solder and flux 5.3.3 Procedure 5.4 Recovery 5.5 Final measurements and requirements 5.6 De-wetting (if applicable) 5.7 Information to be given in the relevant specificationAnnex A (informative) Example of apparatus for accelerated steam ageing processAnnex B (normative) Specification for flux constituentsAnnex ZA (normative) Normative references to international publications with their corresponding European publicationsBibliography
Provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
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