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    I.S. EN 60191-6-4:2003

    Current The latest, up-to-date edition.

    MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2003

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Reference character and drawings
      4.1 Ball grid array package (BGA) Type 1 - Ball datum
      4.2 Ball grid array package (BGA) Type 2 - Body datum
    5 Measuring method
      5.1 Datum S pertaining to ball coplanarity
      5.2 Datum A, B
      5.3 Definition of specified dimensions and measuring
           method
      5.4 Profile of a package edge surface v
      5.5 Mounting height A
      5.6 First stand-off A1
      5.7 Second stand-off A4
      5.8 Ball diameter b
      5.9 Ball center position X
      5.10 Ball coplanarity y
      5.11 Package top flatness y1
    Annex ZA: Normative references to international publications
              with their corresponding European publications

    Abstract - (Show below) - (Hide below)

    Includes requirements for the measuring methods of ball grid array (BGA) dimensions.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
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