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    I.S. EN 61188-5-3:2007

    Current The latest, up-to-date edition.

    PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2007

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 General information
      3.1 General component description
      3.2 Marking
      3.3 Carrier packaging format
      3.4 Process considerations
    4 TSOP (Type 1)
      4.1 Field of application
      4.2 Component description
      4.3 Component dimensions
      4.4 Solder joint fillet design
      4.5 Land pattern dimensions
    5 TSOP (Type 2)
      5.1 Field of application
      5.2 Component description
      5.3 Component dimensions
      5.4 Solder joint fillet design
      5.5 Land pattern dimensions
    6 SOP
      6.1 Field of application
      6.2 Component description
      6.3 Component dimensions
      6.4 Solder joint fillet design
      6.5 Land pattern dimensions
    7 SSOP
      7.1 Field of application
      7.2 Component description
      7.3 Component dimensions
      7.4 Solder joint fillet design
      7.5 Land pattern dimensions
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications
    Bibliography

    Abstract - (Show below) - (Hide below)

    Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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