FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Carrier packaging format
3.4 Process considerations
4 BGA (square)
4.1 Field of application
4.2 Component descriptions
4.2.1 Basic construction
4.2.2 Termination materials
4.2.3 Marking
4.2.4 Carrier package format
4.2.5 Process considerations
4.3 Component dimensions (square)
4.3.1 PBGA 1,5 mm pitch component
dimensions (square)
4.3.2 PBGA 1,27 mm pitch component
dimensions (square)
4.3.3 PBGA 1,00 mm pitch component
dimensions (square)
4.4 Solder joint fillet design
4.4.1 Solder joint fillet design - Non-collapsing,
collapsing (level 3)
4.5 Land pattern dimensions
4.5.1 PBGA 1,5 mm pitch land pattern
dimensions (square)
4.5.2 PBGA 1,27 mm pitch land pattern
dimensions (square)
4.5.3 PBGA 1,00 mm pitch land pattern
dimensions (square)
5 FBGA (square)
6 BGA (rectangular)
6.1 Field of application
6.2 Component descriptions
6.2.1 Basic construction
6.2.2 Termination materials
6.2.3 Marking
6.2.4 Carrier package format
6.2.5 Process considerations
6.3 Component dimensions (rectangular)
6.4 Solder joint fillet design
6.4.1 Solder joint fillet design - Collapsing
(level 3)
6.4.2 Land approximation
6.4.3 Total variation
6.5 Land pattern dimensions
7 FBGA (rectangular)
8 CGA
9 LGA
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Bibliography