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    I.S. EN 61189-6:2006

    Current The latest, up-to-date edition.

    TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2006

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Accuracy, precision and resolution
       3.1 Accuracy
       3.2 Precision
       3.3 Resolution
       3.4 Report
       3.5 Student's 't' distribution
       3.6 Suggested uncertainty limits
    4 Catalogue of approved test methods
    5 P: Preparation/conditioning test methods
    6 V: Visual test methods
    7 D: Dimensional test methods
    8 C: Chemical test methods
       8.1 Test 6C01: Determination of acid value of liquid
            soldering flux - potentiometric and visual titration
            methods
       8.2 Test 6C02: Determination of halides in fluxes,
            silver chromate method
       8.3 Test 6C03: Solids content, flux
       8.4 Test 6C04: Quantitative determination of halide
            content in fluxes (chloride and bromide)
       8.5 Test 6C05: Qualitative analysis of fluorides and
            fluxes by spot test
       8.6 Test 6C06: Quantitative determination of fluoride
            concentration in fluxes
       8.7 Test 6C07: Acid number of rosin
       8.8 Test 6C08: Specific gravity
       8.9 Test 6C09: Determination of the percentage of flux on/in
            flux-coated and/or flux-cored solder
       8.10 Test 6C10: Flux induced corrosion (copper mirror method)
    9 M: Mechanical test methods
    10 E: Electrical test methods
    11 N: Environmental test methods
    12 X: Miscellaneous test methods
       12.1 Test 6X01: Determination of solder powder particle
            size distribution - Screen method for types 1-4
       12.2 Test 6X02: Solder powder particle size
            distribution-measuring microscope method
       12.3 Test 6X03: Solder powder particle size distribution -
            Optical image analyzer method
       12.4 Test 6X04: Solder powder particle size distribution -
            Measuring laser diffraction method
       12.5 Test 6X05: Determination of maximum solder powder
            particle size
       12.6 Test 6X06: Solder paste metal content by weight
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Presents a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
    EN ISO 9001:2015 Quality management systems - Requirements (ISO 9001:2015)
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    ISO 9001:2015 Quality management systems — Requirements
    EN 61189-1 : 97 AMD 1 2001 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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