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    I.S. EN 61190-1-3:2007

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  17-01-2021

    Language(s):  English

    Published date:  01-01-2007

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Classification
      4.1 Alloy composition
      4.2 Solder form
      4.3 Flux type
      4.4 Flux percentage and metal content
      4.5 Other characteristics
    5 Requirements
      5.1 Materials
      5.2 Alloys
      5.3 Solder forms
      5.4 Flux type and form
      5.5 Flux residue dryness
      5.6 Spitting
      5.7 Solder pool
      5.8 Labelling for product identification
      5.9 Workmanship
    6 Quality assurance provisions
      6.1 Responsibility for inspection and compliance
      6.2 Classification of inspections
      6.3 Materials inspection
      6.4 Qualification inspections
      6.5 Quality conformance
      6.6 Preparation of solder alloy for test
    7 Preparation for delivery - Preservation, packing and
      packaging
    Annex A (informative) Selection of various alloys and
            fluxes for use in electronic soldering - General
            information concerning IEC 61190-1-3
    Annex B (normative) Lead-free solder alloys tests
    Annex C (informative) Marking method of solder designation
            for mounted board, used in electronic equipment
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications and for 'special' electronic grade solders.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Withdrawn

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    ISO 9454-2:1998 Soft soldering fluxes Classification and requirements Part 2: Performance requirements
    EN ISO 9454-2:2000 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
    IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
    EN ISO 9001:2015 Quality management systems - Requirements (ISO 9001:2015)
    EN ISO 9453:2014 Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    EN 29454-1:1993 Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:1990)
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    EN 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
    ISO 9001:2015 Quality management systems — Requirements
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
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