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    I.S. EN 61249-3-5:1999

    Current The latest, up-to-date edition.

    MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS) - TRANSFER ADHESIVE FILMS

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-1999

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Materials and construction
    4 Internal marking
    5 Designation
    6 Properties of adhesive films
    7 Dimensions and tolerances
    8 Packaging and marking
    9 Acceptance testing
    Annex A (informative) Conversion table for test method
            reference numbers
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Covers requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 60249-2-15 : 1994 AMD 1 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY
    EN 60249-2-8 : 1994 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM
    IEC 60249-2-8:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film
    EN 60249-1 : 1993 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS
    EN 60249-2-13 : 1994 AMD 1 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 13: FLEXIBLE COPPER CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE
    IEC 60249-2-15:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability
    IEC 60249-2-13:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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