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    I.S. EN 62258-6:2006

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2006

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General
    5 Requirements for information for thermal simulation
      5.1 Requirements for bare die with or without added connection
          structures
      5.2 Requirements for minimally-packaged die
      5.3 Information on thermal simulation model
    Annex ZA (normative) Normative references to international
             Publications with their corresponding European
             publications
    Bibliography

    Abstract - (Show below) - (Hide below)

    Ascertains the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes I.S. ES 59008-4-3. (11/2006) For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
    IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
    EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
    IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
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