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    I.S. EN IEC 62878-2-5:2019

    Current The latest, up-to-date edition.

    Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (IEC 62878-2-5:2019)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  25-11-2019

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Data definition
    5 Data organization and data description based on XML schema
    Bibliography

    Abstract - (Show below) - (Hide below)

    This part of IEC 62878 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Document Type Standard
    Product Note The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document.<br>
    Publisher National Standards Authority of Ireland
    Status Current
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