CEI EN 60068-3-13 : 1ED 2017
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ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
CEI CLC/TS 50466 : 2006
|
LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION |
13/30294866 DC : 0
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BS EN 61058-1 - SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
NF EN 60384-26 : 2011
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FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
BS EN 62435-1 : 2017
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ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL (IEC 62435-1:2017) |
12/30268003 DC : 0
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BS EN 60939-3 - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: HARMONIZED STANDARD FOR PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE |
BS EN 61337-1 : 2004
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FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
I.S. EN IEC 60810:2018
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LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
I.S. EN 62435-2:2017
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ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
UNE EN 60400 : 2011
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LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS |
BS EN 140200 : 1997
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HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION: FIXED POWER RESISTORS |
BS EN 60068-2-58 : 2015
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
DIN EN ISO 4521 : 2009
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METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
BS EN 61811-52 : 2002
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ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 52: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 20 MM X 10 MM BASE |
14/30309692 DC : 0
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BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS |
DD IEC PAS 62435 : 2005
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ELECTRONIC COMPONENTS - LONG-DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDANCE FOR IMPLEMENTATION |
17/30340059 DC : 0
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BS EN 61076-3-119 - CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 3-119: RECTANGULAR CONNECTORS - DETAIL SPECIFICATION FOR UNSHIELDED, FREE AND FIXED 10 WAY CONNECTORS WITH PUSH-PULL COUPLING FOR INDUSTRIAL ENVIRONMENTS WITH FREQUENCIES UP TO 100 MHZ |
BS EN 60384-26 : 2010
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
BS EN 62739-3 : 2017
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS |
I.S. EN 62739-1:2013
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013 (EQV)) |
IEC 60122-1 : 3.1
|
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
02/209660 DC : DRAFT OCT 2002
|
IEC 60512-12-3, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT BASIC TESTING AND MEASUREMENTS - PART 12-3 - TEST 12C: SOLDERABILITY, DE-WETTING |
BS EN 61747-5 : 1998
|
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
04/30126718 DC : DRAFT DEC 2004
|
IEC 60189-1 ED.3 - LOW-FREQUENCY CABLES AND WIRES WITH PVC INSULATION AND PVC SHEATH - PART 1: GENERAL TEST AND MEASURING METHODS |
BS EN 61811-1 : 2015
|
ELECTROMECHANICAL TELECOM ELEMENTARY RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION |
BS EN 60512-12-4 : 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
05/30137416 DC : 0
|
|
BS EN 140100 : 2008
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SECTIONAL SPECIFICATION: FIXED LOW POWER FILM RESISTORS |
BS CECC50000(1987) : 1987
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HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: DISCRETE SEMICONDUCTOR DEVICES |
NF EN 60068 2-69 : 2017
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
NF EN 60252-1 : 2011 AMD 1 2014
|
AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION |
BS EN 62435-2 : 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
12/30260802 DC : 0
|
BS EN 62391-1 - FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
07/30149142 DC : 0
|
BS IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
NF EN 60115-8 : 2013
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
CSA C22.2 No. 60947-7-4 : 2018
|
LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS |
BS CECC64000(1990) : 1990
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION: FILM RESISTOR NETWORKS |
BS CECC41300(1979) : 1979
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. SECTIONAL SPECIFICATION: LOW POWER SINGLE-TURN ROTARY POTENTIOMETERS |
13/30287806 DC : 0
|
BS EN 60539-1 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
09/30207352 DC : 0
|
BS EN 62149-4 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
BS 2011-2.2T(1981) : 1981
|
ENVIRONMENTAL TESTING - GUIDANCE - TEST T. GUIDANCE ON TEST T: SOLDERING |
IEC 61261-1 : 1.0
|
PIEZOELECTRIC CERAMIC FILTERS FOR USE IN ELECTRONIC EQUIPMENT - A SPECIFICATION IN THE IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - PART 1: GENERIC SPECIFICATION - QUALIFICATION APPROVAL |
BS EN 61643-311 : 2013
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 311: PERFORMANCE REQUIREMENTS AND TEST CIRCUITS FOR GAS DISCHARGE TUBES (GDT) |
07/30162213 DC : 0
|
BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
BS EN 60115-2 : 2015
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
BS EN 60939-3 : 2015
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE |
06/30153438 DC : DRAFT JULY 2006
|
BS IEC 60539-1 ED.2 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORES - PART 1: GENERIC SPECIFICATION |
12/30250506 DC : DRAFT MAR 2012
|
BS EN 62739-1 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING |
BS EN 60838-2-1 : 1997
|
MISCELLANEOUS LAMPHOLDERS - PART 2: PARTICULAR REQUIREMENTS - SECTION 1: LAMPHOLDERS S14 |
13/30278343 DC : 0
|
BS EN 62246-1 - REED SWITCHES - PART 1: GENERIC SPECIFICATION |
17/30352704 DC : 0
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BS IEC 62149-10 ED1.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 10: ROF (RADIO OVER FIBER) TRANSCEIVERS FOR MOBILE FRONTHAUL |
BS IEC 61196-9 : 2014
|
COAXIAL COMMUNICATION CABLES - PART 9: SECTIONAL SPECIFICATION FOR RF FLEXIBLE CABLES |
BS EN 60068-1 : 2014
|
ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE |
BS IEC 61189-5-4 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
IEC 61076-3-119 : 1ED 2017
|
CONNECTORS FOR ELECTRICAL AND ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 3-119: RECTANGULAR CONNECTORS - DETAIL SPECIFICATION FOR SHIELDED AND - UNSHIELDED, FREE AND FIXED 10-WAY CONNECTORS WITH PUSH-PULL COUPLING FOR INDUSTRIAL ENVIRONMENTS FOR DATA TRANSMISSION WITH FREQUENCIES UP TO 100 MHZ |
ISO 2093 : 1986(R2017)
|
ELECTROPLATED COATINGS OF TIN - SPECIFICATION AND TEST METHODS |
16/30353588 DC : 0
|
BS EN 61020-1 ED 3.0 - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
UNI EN ISO 4521 : 2008
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
BS 9752(1989) : 1989
|
BLANK DETAIL SPECIFICATION FOR FIXED INSULATED (UNSHIELDED) R.F. INDUCTORS SUITABLE FOR SURFACE MOUNTING AT THE FULL ASSESSMENT LEVEL |
DD IEC PAS 60747-17 : 2011
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION |
11/30243576 DC : DRAFT FEB 2011
|
BS EN 62643-1 - ELECTROSTATIC MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 62149-9 : 2014
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS |
I.S. EN 62435-1:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
I.S. EN 143000:1994
|
THERMISTORS (GENERIC SPECIFICATION) |
BS CECC40100(1981) : 1981
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: FIXED LOW POWER NON WIREWOUND RESISTORS |
BS EN 140203 : 1997
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: FIXED POWER RESISTORS (ASSESSMENT LEVEL H) |
I.S. EN 60684-2:2011
|
FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST (IEC 60684-2:2011) |
BS EN 60169-21 : 1997
|
RADIO-FREQUENCY CONNECTORS - PART 21: TWO TYPES OF RADIO-FREQUENCY CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 9,5 MM (0,374 IN) WITH DIFFERENT VERSIONS OF SCREW COUPLING - CHARACTERISTIC IMPEDANCE 50 OHMS (TYPES SC-A AND SC-B) |
CEI EN 62421 : 2008
|
ELECTRONICS ASSEMBLY TECHNOLOGY - ELECTRONIC MODULES |
11/30252855 DC : 0
|
BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING |
CEI EN 60115-8-1 : 2016
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
CEI EN 62739-3 : 1ED 2017
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS |
09/30207299 DC : DRAFT JULY 2009
|
BS EN 60252-2 - AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS |
06/30157868 DC : 0
|
BS EN 60393-1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
NF EN 62246-1-1 : 2013
|
REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT |
09/30173454 DC : 0
|
BS EN 61881-1 - RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: REQUIREMENTS, TESTS AND GENERAL INFORMATION |
05/30138794 DC : DRAFT SEP 2005
|
|
02/209658 DC : DRAFT OCT 2002
|
IEC 60512-12-1, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-1 - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD |
I.S. EN 60384-26-1:2010
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ |
CEI EN 61071 : 2007
|
CAPACITORS FOR POWER ELECTRONICS |
CEI EN 62391-1 : 2016
|
FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
CEI EN 61270-1 : 1997
|
CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL |
BS CECC32100(1992) : 1992
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION - FIXED MULTILAYER CERAMIC CHIP CAPACITORS |
CEI EN 60068-2-82 : 2008
|
ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
CEI EN 60115-2 : 2016
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
UNI EN ISO 27874 : 2008
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
17/30349734 DC : 0
|
BS EN 60384-26 ED.2.0 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
BS EN 62326-4-1 : 1997
|
PRINTED BOARDS - RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS, A, B AND C |
CEI EN 60684-2 : 2012
|
FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST |
CEI EN 140401 : 2009
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
03/103740 DC : DRAFT FEB 2003
|
IEC 61337-1 ED.1 - FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
CEI EN 60169-21 : 1998
|
RADIO-FREQUENCY CONNECTORS - PART 21: TWO TYPES OF RADIO-FREQUENCY CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 9,5 MM (0,374 IN) WITH DIFFERENT VERSIONS OF SCREW COUPLING CHARACTERISTIC IMPEDANCE 50 OHMS (TYPES SC-A AND SC-B) |
17/30363106 DC : DRAFT SEP 2017
|
BS IEC 63138-1 ED.1.0 - MULTI-RADIO FREQUENCY CHANNEL CONNECTORS - PART 1: GENERIC SPECIFICATION-GENERAL REQUIREMENTS AND MEASURING METHODS |
CEI EN 60947-7-4 : 2014
|
LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS |
07/30168484 DC : 0
|
BS EN 60749-20 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
14/30280850 DC : 0
|
BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
08/30186808 DC : DRAFT JULY 2008
|
BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS |
DD CLC/TS 50466 : 2006
|
LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION |
BS EN 140201 : 1997
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: FIXED POWER RESISTORS (ASSESSMENT LEVEL S) |
BS 123500-003(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEXIBLE SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITH THROUGH-CONNECTIONS |
BS CECC40301(1988) : 1988
|
SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - FIXED PRECISION RESISTORS |
BS EN 61189-5-4 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
97/231700 DC : DRAFT DEC 1997
|
IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
12/30252220 DC : DRAFT MAR 2012
|
BS EN 62604-1 - SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS - PART 1: GENERIC SPECIFICATION |
I.S. EN 60238:2004
|
EDISON SCREW LAMPHOLDERS (IEC 60238:2004 (EQV)) |
BS CECC30000(1984) : 1984
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION: FIXED CAPACITORS |
UTEC 96 029 : 2011
|
ELECTRONIC COMPONENTS - LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDE FOR IMPLEMENTATION |
03/101947 DC : DRAFT FEB 2003
|
IEC 60939-1 ED.2.0 - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
BS EN 62326-20 : 2016
|
PRINTED BOARDS - PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS |
BS EN 60512-12-7 : 2001
|
ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT - BASIC TESTING PROCEDURES AND MEASURING METHODS - SOLDERING TESTS - TEST 12G: SOLDERABILITY, WETTING BALANCE METHOD |
10/30235845 DC : 0
|
BS EN 61881-3 - RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITOR FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS |
BS EN 61643-312 : 2013
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES |
11/30253626 DC : 0
|
BS EN 61196-2 ED.3 - COAXIAL COMMUNICATION CABLES - PART 2: SECTIONAL SPECIFICATION FOR SEMI-RIGID CABLES WITH POLYTERAFLUOROETHYLENE (PTFE) DIELECTRIC |
13/30294204 DC : 0
|
BS EN 60238 - EDISON SCREW LAMPHOLDERS |
BS EN 61189-3 : 2008
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
BS EN 60393-1 : 2009
|
POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 60115-8 : 2012
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
CEI EN 138000 : 1996
|
GENERIC SPECIFICATION: FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (INDUCTORS FOR WHICH SAFETY TESTS ARE REQUIRED) |
BS 6201-2(1982) : 1982
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - SPECIFICATION FOR FIXED CAPACITORS OF CERAMIC DIELECTRIC CLASS 2 SELECTION OF METHODS OF TEST AND GENERAL REQUIREMENTS |
BS CECC43002(1984) : 1984 AMD 7379
|
SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
03/308375 DC : DRAFT JUNE 2003
|
IEC 61196-1 - COAXIAL COMMUNICATION CABLES - PART 1: GENERIC SPECIFICATION - GENERAL, DEFINITIONS AND REQUIREMENTS |
CEI EN 60115-8 : 2013
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
BS EN 61020-1 : 2009
|
ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
13/30277857 DC : 0
|
BS EN 62149-9 ED 1.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS |
BS EN 60068-3-13 : 2016
|
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
BS EN 140401-802 : 2007
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
12/30259014 DC : 0
|
BS EN 60127-6 - MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE FUSE-LINKS |
CEI EN 60512-12-6 : 1997
|
ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT/ BASIC TESTING PROCEDURES AND MEASURING METHODS - PART 12: SOLDERING TESTS - SECTION 6: TEST 12F: SEALING AGAINST FLUX AND CLEANING SOLVENTS IN MACHINE SOLDERING |
BS EN 61189-5-2 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
BS EN 140000 : 1995
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: FIXED RESISTORS |
11/30252972 DC : 0
|
BS EN 61747-10-1 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL |
BS IEC 61189-5-3 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
BS EN 61747-10-1 : 2013
|
LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL |
NF EN 60068-2-83 : 2012
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
16/30338981 DC : 0
|
BS EN 60934 - CIRCUIT-BREAKERS FOR EQUIPMENT (CBE) |
BS EN 62922 : 2017
|
ORGANIC LIGHT EMITTING DIODE (OLED) PANELS FOR GENERAL LIGHTING - PERFORMANCE REQUIREMENTS |
15/30332490 DC : 0
|
BS EN 62211 - INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
02/203604 DC : DRAFT MAR 2002
|
IEC 61810-1. ED.2 - ELEMENTARY RELAYS - PART 1: SAFETY-RELATED AND GENERAL REQUIREMENTS |
BS EN 61189-5 : 2006
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
10/30211766 DC : 0
|
BS EN 61881-3 - RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITOR |
BS IEC 60748-23-3 : 2002
|
SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 23-3: HYBRID INTEGRATED CIRCUITS AND FILM STRUCTURES - MANUFACTURING LINE CERTIFICATION - MANUFACTURERS' SELF-AUDIT CHECKLIST AND REPORT |
BS CECC40200(1981) : 1981
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATIONS: FIXED POWER RESISTORS |
BS EN 61051-1 : 2008
|
VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
13/30279642 DC : 0
|
BS EN 61811-1 - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION |
BS CECC16000-1(1992) : 1992
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION: ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 1: GENERAL |
08/30192301 DC : 0
|
BS EN 60384-26 ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
13/30264596 DC : 0
|
BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
I.S. EN 61810-1:2015
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
CEI EN 60512-12-2 : 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-2: SOLDERING TESTS - TEST 12B: SOLDERABILITY, WETTING, SOLDERING IRON METHOD |
IEEE C62.33 : 1982
|
TEST METHODS AND PERFORMANCE VALUES FOR METAL-OXIDE VARISTOR SURGE PROTECTIVE COMPONENTS |
10/30184598 DC : 0
|
BS EN 61643-312 ED 1.0 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: PERFORMANCE SPECIFICATION FOR GAS DISCHARGE TUBES (GDT) |
BS ISO 9455-17 : 2002 AMD 16425
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
BS EN 62246-1 : 2015
|
REED SWITCHES - PART 1: GENERIC SPECIFICATION |
BS CECC43004(1984) : 1984 AMD 1992
|
SPEC FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS (ROD TYPE) |
BS EN 61270-1 : 1998
|
CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL |
BS EN 60512-12-2 : 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-2: SOLDERING TESTS - TEST 12B: SOLDERABILITY, WETTING, SOLDERING IRON METHOD |
10/30234015 DC : 0
|
BS EN 62246-1-1 ED.1 - REED SWITCHES - PART 1-1: QUALITY ASSESSMENT SPECIFICATION |
NBR IEC 61189-5 : 2012
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTIONS STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
UNE EN 60947-7-4 : 2014
|
LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS |
IEC 61045-1 : 1.0
|
FIXED FILM RESISTOR NETWORKS FOR USE IN ELECTRONIC EQUIPMENT - GENERIC SPECIFICATION |
BS EN 61019-1 : 2005
|
SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION |
BS EN 61811-53 : 2002
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 53: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 14 MM X 9 MM BASE |
08/30176905 DC : DRAFT JAN 2008
|
BS EN 60684-2 - FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST |
BS EN 140401-803 : 2007
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
BS EN 61811-51 : 2002
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 51: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - NON-STANDARDIZED TYPES AND CONSTRUCTION |
I.S. EN 61337-2:2004
|
FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE |
IEC 61071 REDLINE : 2ED 2017
|
CAPACITORS FOR POWER ELECTRONICS |
07/30165180 DC : 0
|
BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE |
CEI EN 62149-4 : 2011
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
05/30129049 DC : DRAFT FEB 2005
|
IEC 62025-2 - HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
EN 60939-3 : 2015 COR 2016
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE (IEC 60939-3:2015/COR1:2016) |
BS EN 61338-1 : 2005
|
WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
BS EN 60512-12-1 : 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD |
11/30243259 DC : 0
|
BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
CEI EN 60384-26-1 : 2011
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ |
03/103741 DC : DRAFT FEB 2003
|
IEC 61338-1 ED.1 - WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
NF EN 61643-311 : 2014
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 311: PERFORMANCE REQUIREMENTS AND TEST CIRCUITS FOR GAS DISCHARGE TUBES (GDT) |
NF EN 62314 : 2006
|
SOLID-STATE RELAYS |
14/30311384 DC : 0
|
BS EN 60115-2:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
BS EN 60384-26-1 : 2010
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ |
BS 4584-1(1983) : 1983 AMD 8050
|
METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - METHODS OF TEST |
11/30258040 DC : 0
|
BS EN 61810-1 - ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL REQUIREMENTS |
BS IEC 61189-5-2 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
BS EN 62421 : 2007
|
ELECTRONICS ASSEMBLY TECHNOLOGY - ELECTRONIC MODULES |
BS 6201-3(1982) : 1982
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - SPECIFICATION FOR FIXED CAPACITORS FOR RADIO INTERFERENCE SUPPRESSION - SELECTION OF METHODS OF TEST AND GENERAL REQUIREMENTS |
BS CECC22000(1980) : 1980
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION: RADIO FREQUENCY COAXIAL CONNECTORS |
13/30286163 DC : 0
|
BS EN 62435-2 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2 - DETERIORATION MECHANISMS |
12/30265027 DC : 0
|
BS EN 61196-9 ED.1 - COAXIAL COMMUNICATION CABLES - PART 9: SECTIONAL SPECIFICATION FOR FLEXIBLE RF COAXIAL CABLES |
IEC 60068-2-69 : 3.0
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
13/30264600 DC : 0
|
BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
I.S. EN 62025-2:2005
|
HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
I.S. EN 62739-3:2017
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS |
I.S. EN 60252-1:2011
|
AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION (IEC 60252-1:2010 (EQV)) |
CEI EN 62314 : 2007
|
SOLID-STATE RELAYS |
CEI EN 61051-1 : 2010
|
VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 61071 : 2007
|
CAPACITORS FOR POWER ELECTRONICS |
BS EN 61007 : 1997
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES |
BS EN 62739-1 : 2013
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING |
BS 123400-003(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEXIBLE SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITHOUT THROUGH-CONNECTIONS |
BS EN 60068-2-54 : 2006
|
ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
02/209662 DC : DRAFT OCT 2002
|
IEC 60512-12-5, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-5 - TEST 12E: RESISTANCE TO SOLDERING HEAT, IRON METHOD |
10/30235844 DC : 0
|
BS EN 61881-2 - RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITOR FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE |
02/209661 DC : DRAFT OCT 2002
|
IEC 60512-12-4, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-4 - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
BS EN 61189-5-3 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
16/30349069 DC : 0
|
BS EN 61071 - CAPACITORS FOR POWER ELECTRONICS |
BS 4584-103.2(1990) : 1990
|
METAL-CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - SPECIAL MATERIALS USED IN CONNECTION WITH PRINTED CIRCUITS - SPECIFICATION FOR COPPER FOIL FOR USE IN THE MANUFACTURE OF COPPER-CLAD BASE MATERIALS |
04/30112673 DC : DRAFT APR 2004
|
IEC 62314 ED.1 - SOLID-STATE RELAYS |
13/30291353 DC : 0
|
BS EN 60838-1 ED 5.0 - MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS |
BS EN 62326-4 : 1997
|
PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION |
BS EN 62314 : 2006
|
SOLID-STATE RELAYS |
BS EN 60252 : 1994
|
A.C. MOTOR CAPACITORS |
BS EN 61169-1 : 2013
|
RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS |
NF EN 60068-3-13 : 2016
|
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
10/30196657 DC : 0
|
BS EN 61881-2 - RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE |
IEC 60512-12-7 : 1.0
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PT 12-7: SOLDERING TESTS - TEST 12G: SOLDERABILITY, WETTING BALANCE METHOD |
BS EN 171000 : 2001
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS |
BS EN 61338-2 : 2004
|
WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDELINES FOR OSCILLATOR AND FILTER APPLICATIONS |
BS EN ISO 4521 : 2008
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
CEI EN 61881-1 : 2012
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS |
BS EN 140202 : 1997
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: FIXED POWER RESISTORS (ASSESSMENT LEVEL M) |
BS EN 60939-1 : 2010
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
BS IEC 61196-9-1 : 2015
|
COAXIAL COMMUNICATION CABLES - PART 9-1: FLEXIBLE RF COAXIAL CABLES - BLANK DETAIL SPECIFICATION |
15/30325282 DC : 0
|
BS EN 62884-1 - MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELETIRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
PREN ISO 9455-16 : DRAFT 2011
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
10/30240248 DC : 0
|
BS EN 60862-1 - SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
CEI EN 61747-10-1 : 2014
|
LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL |
BS EN 60749 : 1999
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS |
BS EN 61248-5 : 1997
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 5: SECTIONAL SPECIFICATION FOR PULSE TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
BS EN 62025-2 : 2005
|
HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
NF EN 62326 4-1 : 1998
|
PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION PERFORMANCE LEVELS A, B AND C |
BS EN 61248-1 : 1997
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN IEC 62246-1-1 : 2018
|
REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - BLANK DETAIL SPECIFICATION (IEC 62246-1-1:2018) |
BS EN 60115-8-1 : 2015
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
DIN EN 60252 : 1994
|
CAPACITORS - MOTOR CAPACITORS |
CEI 48-15 : 1998
|
FLAT, QUICK-CONNECT TERMINATIONS |
CEI EN 60749-20 : 2010
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
09/30209389 DC : 0
|
BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E |
06/30149145 DC : DRAFT OCT 2006
|
IEC 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
CEI EN 60368-1 : 2006
|
PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 61204-6 : 2001
|
LOW VOLTAGE POWER SUPPLIES, D.C. OUTPUT - PART 6: REQUIREMENTS FOR LOW-VOLTAGE POWER SUPPLIES OF ASSESSED PERFORMANCE |
BS EN 61881-2 : 2012
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE |
BS EN 133000 : 1997
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION |
BS EN 61760-1 : 2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
BS IEC 60748-23-1 : 2002
|
SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - HYBRID INTEGRATED CIRCUITS AND FILM STRUCTURES - MANUFACTURING LINE CERTIFICATION - GENERIC SPECIFICATION |
BS EN 61760-3 : 2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
NBR IEC 61189-3 : 2012
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTIONS STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
09/30203267 DC : 0
|
BS EN 60749-15 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
BS CECC41200(1979) : 1979
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: POWER POTENTIOMETERS |
BS EN 60068-2-83 : 2011
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
NF EN 61643-331 : 2003
|
COMPOSANTS POUR PARAFOUDRES BASSE TENSION - PARTIE 331: SPECIFICATIONS POUR LES VARISTANCES A OXYDE METALLIQUE (MOV) |
17/30336631 DC : 0
|
BS EN 62246-1-1 - REED SWITCHES - PART 1-1: DETAIL SPECIFICATION - QUALITY ASSESSMENT |
CSA E60384.1 : 2014
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
13/30286159 DC : 0
|
BS EN 62435-1 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
BS EN 60512-12-5 : 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-5: SOLDERING TESTS - TEST 12E: RESISTANCE TO SOLDERING HEAT, SOLDERING IRON METHOD |
BS EN 61248-6 : 1997
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 6: SECTIONAL SPECIFICATION FOR INDUCTORS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
10/30184592 DC : 0
|
BS EN 61643-311 ED 2.0 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 311: TEST SPECIFICATION FOR GAS DISCHARGE TUBES |
BS EN 60127-2 : 2014
|
MINIATURE FUSES - PART 2: CARTRIDGE FUSE-LINKS |
04/30112662 DC : DRAFT APR 2004
|
IEC 61810-7 ED.2 - ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
BS EN 60539-1 : 2016
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016) |
IEC 61196-9 : 1ED 2014
|
COAXIAL COMMUNICATION CABLES - PART 9: SECTIONAL SPECIFICATION FOR RF FLEXIBLE CABLES |
DIN EN 138000 : 1997
|
GENERIC SPECIFICATION; FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (INDUCTORS FOR WHICH SAFETY TESTS ARE REQUIRED) |
BS EN 62884-1 : 2017
|
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT (IEC 62884-1:2017) |
BS EN ISO 27874 : 2008
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
IEC 60393-1 : 3.0
|
POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60115-2:2015
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
I.S. EN 60249-1:1994
|
BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
16/30338642 DC : 0
|
BS EN 62739-3 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHOD |
CEI EN 61643-331 : 2005
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 331: SPECIFICATION FOR METAL OXIDE VARISTORS (MOV) |
EN IEC 61076-3-119 : 2018
|
CONNECTORS FOR ELECTRICAL AND ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 3-119: RECTANGULAR CONNECTORS - DETAIL SPECIFICATION FOR SHIELDED AND UNSHIELDED, FREE AND FIXED 10-WAY CONNECTORS WITH PUSH-PULL COUPLING FOR INDUSTRIAL ENVIRONMENTS FOR DATA TRANSMISSION WITH FREQUENCIES UP TO 100 MHZ (IEC 61076-3-119:2017) |
11/30206085 DC : 0
|
BS EN 60947-7-4 - LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PRINTED BOARD TERMINAL BLOCKS FOR COPPER CONDUCTORS |
BS EN 60068-2-82 : 2007
|
ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
BS EN 61249-8-8 : 1997
|
MATERIALS FOR INTERCONNECTION STRUCTURES - SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER COATINGS |
BS EN 61337-2 : 2004
|
FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE |
08/30193715 DC : 0
|
BS EN 62246-1 ED.2 - REED SWITCHES - PART 1: GENERIC SPECIFICATION |
02/208665 DC : DRAFT SEP 2002
|
IEC 62319-1 ED.1.0 - POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
NF EN 61204-6 : 2001
|
LOW-VOLTAGE POWER SUPPLIES, DC OUTPUT - PART 6: REQUIREMENTS FOR LOW-VOLTAGE POWER SUPPLIES ASSESSED PERFORMANCE |
BS EN 123400 : 1992
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS |
BS EN 130000 : 1994
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: FIXED CAPACITORS |
BS EN 61881-1 : 2011
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS |
BS EN 120000 : 1996
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERAL SPECIFICATION: SEMICONDUCTOR OPTOELECTRONIC AND LIQUID CRYSTAL DEVICES |
BS QC 763000(1990) : AMD 6754
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION |
BIS IS/IEC 60862-1 : 2003
|
SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
06/30155922 DC : 0
|
BS EN 140100 - SECTIONAL SPECIFICATION - FIXED LOW POWER FILM RESISTORS |
BS EN 61811-55 : 2002
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 55: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 11 MM X 7,5 MM (MAX.) BASE |
IEC 62326-4 : 1.0
|
PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION |
BS EN 60252-2 : 2011
|
AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS |
10/30184605 DC : 0
|
BS EN 61643-313 ED 1.0 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 313: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (GDT) |
07/30169004 DC : 0
|
BS EN 60400 - LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS |
10/30234803 DC : 0
|
BS EN 61169-1 ED.2 - RADIO FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS |
NF EN 61020-1 : 2009
|
ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 60749-15 : 2010
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
14/30296909 DC : 0
|
BS EN 61643-331 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 331: PERFORMANCE REQUIREMENTS AND TEST METHODS FOR METAL OXIDE VARISTORS (MOV) |
BS EN 60862-1 : 2015
|
SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
CEI EN 62739-1 : 2014
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING |
I.S. EN 61249-8-7:1999
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS |
12/30274800 DC : 0
|
BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE |
09/30186180 DC : 0
|
BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
BS EN 60738-1 : 2006
|
THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
DD IEC PAS 62246-2-1 : DRAFT 2008
|
REED CONTACT UNITS - PART 2-1: HEAVY-DUTY REED SWITCHES - QUALITY ASSESSMENT SPECIFICATION |
13/30286167 DC : 0
|
BS EN 62435-5 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5 - DIE & WAFER DEVICES |
BS EN 61248-3 : 1997
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 3: SECTIONAL SPECIFICATION FOR POWER TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
NF EN 60384-1 : 2016
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
03/104227 DC : DRAFT MAY 2003
|
IEC 60393-6 ED.1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS |
CEI EN 61249-8-7 : 1997
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS |
BS EN 61248-7 : 1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATIONS EQUIPMENT - PART 7: SECTIONAL SPECIFICATION FOR HIGH-FREQUENCY INDUCTORS AND INTERMEDIATE TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
BS EN 60068-2-69 : 2017
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
11/30213136 DC : 0
|
BS EN ISO 9455-16 - SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
DIN EN ISO 27874 E : 2009
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
BS CECC17000(1992) : 1992 AMD 9626
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION - SOLID STATE ALL OR NOTHING RELAYS - GENERIC DATA AND METHODS OF TEST |
DIN EN ISO 27874 : 2009
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
11/30234673 DC : 0
|
BS EN ISO 9455-10 - SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
BS EN 62149-4 : 2010
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
BS EN 62319-1 : 2005
|
POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
NF EN 60252-2 : 2011 AMD 1 2014
|
AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS |
BS EN 60122-1 : 2002
|
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 61643-331 : 2003
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 331: SPECIFICATION FOR METAL OXIDE VARISTORS (MOV) |
08/30193881 DC : 0
|
BS EN 60939-1 ED.3 - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
BS PD6521(1988) : 1988
|
SUMMARIES OF TEST METHODS FOR ENVIRONMENTAL TESTING OF ELECTROTECHNICAL PRODUCTS |
BS EN 61196-2 : 2003
|
RADIO-FREQUENCY CABLES - PART 2: SPECIFICATIONS - SEMI-RIGID RADIO-FREQUENCY AND COAXIAL CABLES WITH POLYTETRAFLUOROETHYLENE (PTFE) INSULATION |
BS EN 168000 : 1996
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: QUARTZ CRYSTAL UNITS |
IEC 60326-9 : 1.0
|
PRINTED BOARDS - SPECIFICATION FOR FLEXIBLE MULTI-LAYER PRINTED BOARDS WITH THROUGH CONNECTIONS |
BS EN 61811-54 : 2002
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 54: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 15 MM X 7,5 MM BASE |
BS EN 62246-1-1 : 2013
|
REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT |
15/30329267 DC : 0
|
BS EN 60747-17 - SEMICONDUCTOR DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION |
BS EN 61193-3 : 2013
|
QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING |
BS EN 60684-2 : 2011
|
FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST |
CSA E691 : 0
|
THERMAL LINKS - REQUIREMENTS AND APPLICATION GUIDE |
BS CECC30000(1992) : 1992
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. GENERIC SPECIFICATION: FIXED CAPACITORS |
05/30134428 DC : DRAFT JUN 2005
|
|
09/30207307 DC : 0
|
BS EN 60115-2 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: FIXED LOW-POWER NON-WIREWOUND RESISTORS |
BS EN 60384-1 : 2016
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
05/30132097 DC : DRAFT JUNE 2005
|
IEC 60679-1 ED 3 - QUARTZ CRYSTAL CONTROLLED OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 62211 : 2004
|
INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
I.S. EN 60068-2-44:1997
|
ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING |
I.S. EN 61248-2:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 2: SECTIONAL SPECIFICATION FOR SIGNAL TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
NBR IEC 62326-4 : 2007 ERRATA 2007
|
PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION |
BS EN 62878-1-1 : 2015
|
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
BS EN 60749-20 : 2009
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
NF EN 61071 : 2007
|
CAPACITORS FOR POWER ELECTRONICS |
BS EN 61248-2 : 1997
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 2: SECTIONAL SPECIFICATION FOR SIGNAL TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
BS EN 61810-7 : 2006
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
14/30317306 DC : 0
|
BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
BS EN 60368-1 : 2000
|
PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
CSA E60127.6 : 2003 : R2012
|
MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE CARTRIDGE FUSE-LINKS |
CEI EN 62884-1 : 1ED 2018
|
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
UNE EN 61020-1 : 2011
|
ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS 2011-1.1(1989) : 1989
|
ENVIRONMENTAL TESTING - GENERAL AND GUIDANCE |
I.S. EN 61337-1:2005
|
FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
CSA E60127.6 : 2003
|
MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE CARTRIDGE FUSE-LINKS |
CSA E60127.6 : 2003 : R2017
|
MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE CARTRIDGE FUSE-LINKS |
I.S. CLC TS 50466:2006
|
LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION |
CEI EN 60393-1 : 2010
|
POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 140101 : 2008
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS |
BS EN 61169-8 : 2007
|
RADIO-FREQUENCY CONNECTORS - PART 8: SECTIONAL SPECIFICATION - RF COAXIAL CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 6,5 MM (0,256 IN) WITH BAYONET LOCK - CHARACTERISTICS IMPEDANCE 50 OHMS (TYPE BNC) |
07/30167467 DC : 0
|
BS EN ISO 27874 - METALLIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
05/30135445 DC : DRAFT JUN 2005
|
IEC 61169-8 - RADIO-FREQUENCY CONNECTORS - PART 8: SECTIONAL SPECIFICATION - RF COAXIAL CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 6,5 MM (0,256 IN) WITH BAYONET LOCK - CHARACTERISTICS IMPEDANCE 50 OHMS (TYPE BNC) |
BS CECC43003(1984) : 1984 AMD 7380
|
SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS (DISC TYPE) |
UNE EN 60252-1 : 2011
|
AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION |
BS EN 61881-3 : 2012
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS |
BS EN 61881 : 2000
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS |
BS EN 165000-1 : 1996
|
FILM AND HYBRID INTEGRATED CIRCUITS - GENERIC SPECIFICATION - PART 1: CAPABILITY APPROVAL PROCEDURE |
CEI EN 60068-2-21 : 2006
|
ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
BS EN 60127-6 : 2014
|
MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE FUSE-LINKS |
BS CECC68000(1990) : AMD 9184
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION: QUARTZ CRYSTAL UNITS |
BS EN 61248-4 : 1997
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 4: SECTIONAL SPECIFICATION FOR POWER TRANSFORMERS FOR SWITCHED MODE POWER SUPPLIES (SMPS) ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
BS CECC43001(1984) : 1984 AMD 7378
|
SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
CEI EN 60068-2-69 : 2008
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
UL 60947-7-4 : 1ED 2018
|
LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS |
NF EN 60938-1 : 2008 AMD 1 2008
|
FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
EN IEC 61058-1 : 2018
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS (IEC 61058-1:2016) |
NF EN 60684-2 : 2012
|
FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST |
DIN EN ISO 4521 E : 2009
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
DIN EN 61881 : 2000
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS |
CEI EN 60539-1 : 2009
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
NF EN 60238 : 2005 AMD 2 2011
|
|
I.S. EN 61797-1:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN TELECOMMUNICATION AND ELECTRONIC EQUIPMENT - MAIN DIMENSIONS OF COIL FORMERS - PART 1: COIL FORMERS FOR LAMINATED CORES |
I.S. EN 60169-21:1999
|
RADIO-FREQUENCY CONNECTORS - PART 21: TWO TYPES OF RADIO-FREQUENCY CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 9,5 MM (0,374 IN) WITH DIFFERENT VERSIONS OF SCREW COUPLING - CHARACTERISTIC IMPEDANCE 50 OHMS (TYPES SC-A AND SC-B) |
IEC 61178-1 : 1.0
|
|
IEC 61020-3 : 1.0
|
ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRONIC EQUIPMENT - SECTIONAL SPECIFICATION FOR IN-LINE PACKAGE SWITCHES |
IEC 61338-1-2 : 1.0
|
WAVEGUIDE TYPE DIELECTRIC RESONATORS - GENERAL INFORMATION AND TEST CONDITIONS - TEST CONDITIONS |
GOST R IEC 60252-1 : 2005
|
AC MOTOR CAPACITORS - PART 1: GENERAL. PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDE FOR INSTALLATION AND OPERATION |
BS EN 61810-1 : 2015
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
NF EN 61881-1 : 2011
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS |
IEC 60068-2-44 : 2.0
|
ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING |
CEI EN 61810-1 : 2016
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
NF EN 61249 8-8 : 1998
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS |
NF EN 62246-1 : 2015
|
REED SWITCHES - PART 1: GENERIC SPECIFICATION |
OVE/ONORM EN 61051-1 : 2009
|
VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC PAS 62435 : 1.0
|
ELECTRONIC COMPONENTS - LONG-DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDANCE FOR IMPLEMENTATION |
I.S. EN 61811-51:2002
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 51: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - NON-STANDARDIZED TYPES AND CONSTRUCTION |
I.S. EN 168000:1994
|
QUARTZ CRYSTAL UNITS (GENERIC SPECIFICATION) |
CEI EN 62319-1 : 2005
|
POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
BS EN 170000 : 1999
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: WAVEGUIDE TYPE DIELECTRIC RESONATORS |
EN 60068-2-69 : 2017 COR 2018
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018) |
BS EN 167000 : 1993
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. GENERIC SPECIFICATION: PIEZOELECTRIC FILTERS |
IEC 60400 : 8.0
|
LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS |
BS EN 138000 : 1997
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (INDUCTORS FOR WHICH SAFETY TESTS ARE REQUIRED) |
CEI EN 60384-26 : 2011
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
IEC 60810 : 5.0
|
LAMPS FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
I.S. EN 16602-70-10:2015
|
SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS |
I.S. EN 60738-1:2006
|
THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60689:2009
|
MEASUREMENT AND TEST METHODS FOR TUNING FORK QUARTZ CRYSTAL UNITS IN THE RANGE FROM 10 KHZ TO 200 KHZ AND STANDARD VALUES |
CEI EN 60689 : 2009
|
MEASUREMENT AND TEST METHODS FOR TUNING FORK QUARTZ CRYSTAL UNITS IN THE RANGE FROM 10 KHZ TO 200 KHZ AND STANDARD VALUES |
I.S. EN 61051-1:2008
|
VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60400:2017
|
LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS |
IEC 60838-1 REDLINE : 5ED 2016
|
MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS |
I.S. EN 61810-7:2006
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
CEI EN 60512-12-5 : 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-5: SOLDERING TESTS - TEST 12E: RESISTANCE TO SOLDERING HEAT, IRON METHOD |
I.S. EN 61643-311:2013
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 311: PERFORMANCE REQUIREMENTS AND TEST CIRCUITS FOR GAS DISCHARGE TUBES (GDT) (IEC 61643-311:2013 (EQV)) |
I.S. EN 140402:2015
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
I.S. EN 61881-1:2011
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS |
I.S. EN 60939-3:2015
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE |
I.S. EN 60934:2001
|
CIRCUIT BREAKERS FOR EQUIPMENT (CBE) (IEC 60934:2000 (EQV)) |
I.S. EN 61189-5-3:2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 61811-54:2002
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 54: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 15 MM X 7,5 MM BASE |
I.S. EN 61811-53:2002
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 53: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 14 MM X 9 MM BASE |
NF EN 61249 8-7 : 1997
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND LINKS |
I.S. EN IEC 61076-3-119:2018
|
CONNECTORS FOR ELECTRICAL AND ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 3-119: RECTANGULAR CONNECTORS - DETAIL SPECIFICATION FOR SHIELDED AND UNSHIELDED, FREE AND FIXED 10-WAY CONNECTORS WITH PUSH-PULL COUPLING FOR INDUSTRIAL ENVIRONMENTS FOR DATA TRANSMISSION WITH FREQUENCIES UP TO 100 MHZ |
I.S. EN 61881-2:2012
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE (IEC 61881-2:2012 (EQV)) |
IEEE C62.35 : 2010
|
STANDARD TEST METHODS FOR AVALANCHE JUNCTION SEMICONDUCTOR SURGE-PROTECTIVE DEVICE COMPONENTS |
I.S. EN 60384-26:2010
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
I.S. EN 60127-4:2005
|
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV)) |
I.S. EN 60749-20:2009
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
NF EN 62739-1 : 2014
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING |
I.S. EN 61007:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES |
NF EN ISO 4521 : 2008
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
EN 61810-1 : 2015 COR 2018
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS (IEC 61810-1:2015/COR1:2018) |
I.S. EN IEC 62246-1-1:2018
|
REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - BLANK DETAIL SPECIFICATION |
I.S. EN ISO 4521:2008
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
I.S. EN 60810:2015
|
LAMPS FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
BS EN 140402 : 2015
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
I.S. EN 61189-5:2006
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
BS EN 60934 : 2001
|
CIRCUIT-BREAKERS FOR EQUIPMENT (CBE) |
I.S. EN 140101-806:2009
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
CEI EN 60512-12-1 : 2007
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD |
I.S. EN 62435-5:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
I.S. EN 61019-1:2005
|
SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION |
I.S. EN 61071:2007
|
CAPACITORS FOR POWER ELECTRONICS |
I.S. EN 60115-8:2012
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD)) |
I.S. EN 60115-8-1:2015
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
EN 62884-1 : 2017
|
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT (IEC 62884-1:2017) |
I.S. EN 61193-3:2013
|
QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING (IEC 61193-3:2013 (EQV)) |
BS EN 61058-1 : 2002
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
BS EN 60115-1 : 2011
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60512-12-1:2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, |
I.S. EN 61058-1:2002
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
I.S. EN 60068-2-82:2007
|
ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
I.S. EN 61248-4:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 4: SECTIONAL SPECIFICATION FOR POWER TRANSFORMERS FOR SWITCHED MODE POWER SUPPLIES (SMPS) ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
I.S. EN 61248-3:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 3: SECTIONAL SPECIFICATION FOR POWER TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
BS EN 60127-4 : 2005
|
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
I.S. EN 60068-2-69:2017
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
I.S. EN 60068-1:2014
|
ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE |
I.S. EN 61248-5:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 5: SECTIONAL SPECIFICATION FOR PULSE TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
I.S. EN IEC 61643-331:2018
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTION - PART 331: PERFORMANCE REQUIREMENTS AND TEST METHODS FOR METAL OXIDE VARISTORS (MOV) |
BS EN 60838-1 : 2017
|
MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS (IEC 60838-1:2016) |
I.S. EN 140402-801:2015
|
DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
BS EN 60252-1 : 2011
|
AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION |
BS EN 60238 : 2004
|
EDISON SCREW LAMPHOLDERS |
BS EN 140101-806 : 2008
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
I.S. EN 60122-1:2002 AMD 1 2018
|
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 61270-1:1999
|
CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL |
I.S. EN 61248-6:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 6: SECTIONAL SPECIFICATION FOR INDUCTORS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
I.S. EN 60862-1:2015
|
SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 62326-20:2016
|
PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
I.S. EN 62149-9:2014
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS |
I.S. EN 61189-5-2:2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 61811-1:2015
|
ELECTROMECHANICAL TELECOM ELEMENTARY RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION |
IEC 62149-6 : 1.0
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 6: 650-NM 250-MBIT/S PLASTIC OPTICAL FIBRE TRANSCEIVERS |
NBR IEC 60238 : 2005 ERRATA 2006
|
|
I.S. EN 61760-3:2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
I.S. EN 165000-1:1998
|
FILM AND HYBRID INTEGRATED CIRCUITS - PART 1: GENERIC SPECIFICATION CAPABILITY APPROVAL PROCEDURE |
I.S. EN 138000:1998
|
FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (INDUCTORS FOR WHICH SAFETY TESTS ARE REQUIRED) (GENERIC SPECIFICATION) |
I.S. EN 61338-1:2005
|
WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
I.S. EN 61747-10-1:2013
|
LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL (IEC 61747-10-1:2013 (EQV)) |
I.S. EN 60512-12-5:2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-5: SOLDERING TESTS - TEST 12E: RESISTANCE TO SOLDERING HEAT, SOLDERING IRON METHOD |
CEI EN 60068-2-58 : 2016
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
IEC 62391-1 REDLINE : 2ED 2015
|
FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
NF EN 61249 5-4 : 1997
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS - SECTION 4: CONDUCTIVE INKS |
BS EN 60068-2-21 : 2006
|
ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
NF EN 60939-3 : 2016
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE |
IEC 61196-1 : 2.0
|
COAXIAL COMMUNICATION CABLES - PART 1: GENERIC SPECIFICATION - GENERAL, DEFINITIONS AND REQUIREMENTS |
I.S. EN 61169-8:2007
|
RADIO-FREQUENCY CONNECTORS - PART 8: SECTIONAL SPECIFICATION - RF COAXIAL CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 6,5 MM (0,256 IN) WITH BAYONET LOCK - CHARACTERISTICS IMPEDANCE 50 OHMS (TYPE BNC) |
BS CECC40103(1988) : 1988
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: FIXED LOW POWER NON-WIREWOUND RESISTORS: ASSESSMENT LEVEL P |
CEI EN 60068-2-54 : 2007
|
ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
EN IEC 60810 : 2018
|
LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS (IEC 60810:2017) |
CEI EN 60512-12-7 : 2002
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-7: SOLDERING TESTS - TEST 12G: SOLDERABILITY, WETTING BALANCE METHOD |
I.S. CECC 33000:1994
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (GENERIC SPECIFICATION) |
BS EN IEC 60810 : 2018
|
LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS (IEC 60810:2017) |
NF EN 60127-6 : 2014
|
MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE CARTRIDGE FUSE-LINKS |
BS EN 140401 : 2009
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
I.S. EN 133000:1998
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (GENERIC SPECIFICATION) |
I.S. EN 61881-3:2012
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS (IEC 61881-3:2012 (EQV)) |
I.S. EN 60068-2-83:2011
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV)) |
CSA E60127.6 : 2003
|
MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE CARTRIDGE FUSE-LINKS |
IEC 60539-1 : 3.0
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
I.S. EN 61249-5-4:1999
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS - SECTION 4: CONDUCTIVE INKS |
I.S. EN 60512-12-4:2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
CEI EN 61881-2 : 2013
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE |
I.S. EN 60512-12-2:2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-2: SOLDERING TESTS - TEST 12B: SOLDERABILITY, WETTING, SOLDERING IRON METHOD |
I.S. EN ISO 27874:2008
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
I.S. EN 61248-1:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 62246-1-1:2013
|
REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT (IEC 62246-1-1:2013 (EQV)) |
I.S. EN 60127-6:2014
|
MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE FUSE-LINKS |
I.S. EN 60252-2:2011
|
AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS (IEC 60252-2:2010 (EQV)) |
I.S. EN 60068-2-21:2006
|
ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
NF EN 62319-1 : 2005
|
POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
NF EN 60127-4 : 2005 AMD 2 2013
|
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
BS EN 60947-7-4 : 2013
|
LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS |
CSA C22.2 No. 61058.1 : 2009
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
NF EN 60939-1 : 2011
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
NF EN 61189-5 : 2008
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
CSA C22.2 No. 61058.1 : 2009 : R2014
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
IEC 61253-1 : 1.0
|
PIEZOELECTRIC CERAMIC RESONATORS - A SPECIFICATION IN THE IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - PART 1: GENERIC SPECIFICATION - QUALIFICATION APPROVAL |
NF EN 60068-2-58 : 2015
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
UNE EN ISO 27874 : 2010
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
BIS IS 15934-5 : 2011
|
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
CEI EN 60939-1 : 2011
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
CEI EN 60512-12-4 : 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS -PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
EN 60838-1 : 2017 AMD 1 2017
|
MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS (IEC 60838-1:2016/A1:2017) |
CEI EN 62246-1-1 : 2014
|
REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT |
EN 140401-802 : 2007 AMD 3 2017
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
I.S. EN 62246-1:2015
|
REED SWITCHES - PART 1: GENERIC SPECIFICATION |
CEI EN 60749-15 : 2012
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
DIN EN 60068-2-69 : 2007
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
NF EN 61760-3 : 2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
PREN ISO 9455-10 : DRAFT 2011
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
CSA C22.2 No. 61058.1 : 2009:R2014
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
I.S. EN 62884-1:2017
|
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
CSA C22.2 No. 61058.1:2009
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
IEC PAS 61811-55 : 1.0
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 55: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 11 MM X 7,5 MM (MAX) BASE |
NF EN 60115-2 : 2015
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
I.S. EN 60947-7-4:2013
|
LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS (IEC 60947-7-4:2013 (EQV)) |
CEI EN 61760-3 : 2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
NBR IEC 62326-4-1 : 2007 ERRATA 2007
|
PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B AND C |
CEI EN 61810-7 : 2006
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
CEI EN 60068-2-83 : 2012
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
I.S. EN 60368-1:2000
|
PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 61248-7:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 7: SECTIONAL SPECIFICATION FOR HIGH-FREQUENCY INDUCTORS AND INTERMEDIATE FREQUENCY TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
I.S. EN 60939-1:2010
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
IEC 60249-3-3 : 1.0
|
BASE MATERIALS FOR PRINTED CIRCUITS - SPECIAL MATERIALS USED IN CONNECTION WITH PRINTED CIRCUITS - PERMANENT POLYMER COATING MATERIALS FOR USE IN THE FABRICATION OF PRINTED BOARDS |
CSA C22.2 No. 61058.1 :2009
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
BS EN 62391-1 : 2016
|
FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 62391-1:2015) |
02/209659 DC : DRAFT OCT 2001
|
IEC 60512-12-2, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-2 - TEST 12B: SOLDERABILITY, WETTING, IRON METHOD |
BS CECC 43000(1982) : AMD 7315
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION: DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
02/206181 DC : DRAFT MAY 2002
|
IEC 61019-1. ED.1 - SURFACE ACOUSTIC WAVE RESONATORS (SAW) OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 60689 : 2009
|
MEASUREMENT AND TEST METHODS FOR TUNING FORK QUARTZ CRYSTAL UNITS IN THE RANGE FROM 10 KHZ TO 200 KHZ AND STANDARD VALUES |
BS EN 60938-1 : 2000
|
FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
12/30274796 DC : 0
|
BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX |
12/30274804 DC : 0
|
BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE |
12/30258507 DC : 0
|
BS EN 62575-1 - RADIO FREQUENCY (RF) BUK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 134000:1994
|
GENERIC SPECIFICATION: VARIABLE CAPACITORS (QUALIFICATION APPROVAL AND CAPABILITY APPROVAL) |
I.S. EN 60068-3-13:2016
|
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
I.S. EN 61643-312:2013
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (IEC 61643-312:2013 (EQV) + CORRIGENDUM JUL. 2013 (EQV)) |
I.S. EN 61189-5-4:2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 60749-15:2010
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
I.S. EN 60384-1:2016
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
CEI EN 60122-1 : 2004
|
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 62922:2017
|
ORGANIC LIGHT EMITTING DIODE (OLED) PANELS FOR GENERAL LIGHTING - PERFORMANCE REQUIREMENTS |
EN IEC 62246-1-1 : 2018
|
REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - BLANK DETAIL SPECIFICATION (IEC 62246-1-1:2018) |
CSA C22.2 No. 61058.1:2009 : INC : UPD 1 : 2013
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
EN IEC 61643-331 : 2018
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTION - PART 331: PERFORMANCE REQUIREMENTS AND TEST METHODS FOR METAL OXIDE VARISTORS (MOV) (IEC 61643-331:2017) |
VDE 0468-2-69 : 2018
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
CSA C22.2 No. 61058.1 : 2009 : INC : UPD 1 : 2013
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
UNE EN ISO 4521 : 2010
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
NF EN 60400 : 2008 AMD 2 2014
|
LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS |
BS CECC00802(1991) : 1991
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. GUIDANCE DOCUMENT: CECC STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDs) OF ASSESSED QUALITY |
IEC 60300-3-5 : 1.0
|
DEPENDABILITY MANAGEMENT - PART 3-5: APPLICATION GUIDE - RELIABILITY TEST CONDITIONS AND STATISTICAL TEST PRINCIPLES |
I.S. EN 60127-2:2014
|
MINIATURE FUSES - PART 2: CARTRIDGE FUSE-LINKS |
ISO 7587 : 1986(R2017)
|
ELECTROPLATED COATINGS OF TIN LEAD ALLOYS - SPECIFICATION AND TEST METHODS |
I.S. EN 62149-4:2010
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
I.S. EN 60393-1:2009
|
POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 62246-1-1 : 2ED 2018
|
REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - BLANK DETAIL SPECIFICATION |
I.S. EN 61811-52:2002
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 52: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 20 MM X 10 MM BASE |
I.S. EN 61811-55:2002
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 55: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 11 MM X 7,5 MM (MAX.) BASE |
IEC 60748-23-1 : 1.0
|
SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 23-1: HYBRID INTEGRATED CIRCUITS AND FILM STRUCTURES - MANUFACTURING LINE CERTIFICATION - GENERIC SPECIFICATION |
IEC 61058-1 : 4.0
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
I.S. EN 62314:2006
|
SOLID-STATE RELAYS |
I.S. EN 140401:2009
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
I.S. EN 61643-331:2003
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 331: SPECIFICATION FOR METAL OXIDE VARISTORS (MOV) |
IEC 60238 REDLINE : 9ED 2016
|
EDISON SCREW LAMPHOLDERS |
IEC 61019-1-2 : 1.0
|
SURFACE ACOUSTIC WAVE (SAW) RESONATORS - GENERAL INFORMATION, STANDARD VALUES AND TEST CONDITIONS - TEST CONDITIONS |
I.S. EN 116000-3:1998
|
GENERIC SPECIFICATION: ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 3: TEST AND MEASUREMENT PROCEDURES |
IEC 60068-2-58 : 4.1
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
I.S. EN 60068-2-58:2015
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
IEC 60384-1 REDLINE : 5ED 2016
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60539-1:2016
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
IEC 60748-23-3 : 1.0
|
SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 23-3: HYBRID INTEGRATED CIRCUITS AND FILM STRUCTURES - MANUFACTURING LINE CERTIFICATION - MANUFACTURERS' SELF-AUDIT CHECKLIST AND REPORT |
IEC 61071 : 2.0
|
CAPACITORS FOR POWER ELECTRONICS |
I.S. EN 61020-1:2009
|
ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 61337-1-2 : 1.0
|
FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1-2: TEST CONDITIONS |
I.S. EN 140101:2008
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS |
I.S. EN 60838-1:2017
|
MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS |
I.S. EN 140401-802:2007
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
I.S. EN 140401-803:2007
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
I.S. EN 62391-1:2016
|
FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 61169-1:2013
|
RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS |
IEC 61191-1 : 2.0
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 62884-1 : 1ED 2017
|
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
IEC 60749-20 : 2.0
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
IEC 60326-10 : 1.0
|
PRINTED BOARDS - SPECIFICATION FOR FLEX-RIGID DOUBLE-SIDED PRINTED BOARDS WITH THROUGH CONNECTIONS |
IEC 60326-11 : 1.0
|
SPECIFICATION FOR FLEX-RIGID MULTI-LAYER PRINTED BOARDS WITH THROUGH CONNECTIONS |
I.S. EN 62878-1-1:2015
|
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
IEC 61007 : 2.0
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES |
IEC 60115-2 : 3.0
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
IEC 61196-8 : 1.0
|
COAXIAL COMMUNICATION CABLES - PART 8: SECTIONAL SPECIFICATION FOR SEMI-FLEXIBLE CABLES WITH POLYTETRAFLUOROETHYLENE (PTFE) DIELECTRIC |
I.S. EN 60068-2-54:2006
|
ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
I.S. EN 62149-6:2003
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 6: 650-NM 250-MBIT/S PLASTIC OPTICAL FIBRE TRANSCEIVERS |
IEC 60115-1 : 4.0
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 60115-8 : 2.0
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
IEC 61196-2 : 2.0
|
RADIO-FREQUENCY CABLES - PART 2: SECTIONAL SPECIFICATION FOR SEMI-RIGID RADIO-FREQUENCY AND COAXIAL CABLES WITH POLYTETRAFLUOROETHYLENE (PTFE) INSULATION |
IEC PAS 60747-17 : 1.0
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION |
I.S. EN 61984:2009
|
CONNECTORS - SAFETY REQUIREMENTS AND TESTS |
IEC PAS 62246-2-1 : 1.0
|
REED CONTACT UNITS - PART 2-1: HEAVY-DUTY REED SWITCHES - QUALITY ASSESSMENT SPECIFICATION |
I.S. EN 62319-1:2005
|
POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
IEC 61058-1 REDLINE : 4ED 2016
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
IEC 61196-9-1 : 1ED 2015
|
COAXIAL COMMUNICATION CABLES - PART 9-1: FLEXIBLE RF COAXIAL CABLES - BLANK DETAIL SPECIFICATION |
IEC 62326-4-1 : 1.0
|
PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B AND C |
IEC 60838-1 : 5.1
|
MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS |
I.S. EN 61189-3:2008
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
I.S. EN 60938-1:1999
|
FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
I.S. EN 60838-2-1:1997
|
MISCELLANEOUS LAMPHOLDERS - PART 2: PARTICULAR REQUIREMENTS - SECTION 1: LAMPHOLDERS S14 |
I.S. EN 61249-8-8:1999
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER |
IEC PAS 61076-3-119 : 1ED 2013
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 3-119: RECTANGULAR CONNECTORS - DETAIL SPECIFICATION FOR UNSHIELDED, FREE AND FIXED 10-WAY CONNECTORS WITH PUSH-PULL COUPLING FOR INDUSTRIAL ENVIRONMENTS WITH FREQUENCIES UP TO 100 MHZ |
IEC 61051-1:2007
|
VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60115-1:2011
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
IEC 60238 : 9.1
|
EDISON SCREW LAMPHOLDERS |
I.S. EN 62211:2017
|
INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
I.S. EN 61747-5:1999
|
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
IEC 61196-1-305 : 1ED 2015
|
COAXIAL COMMUNICATION CABLES - PART 1-305: MECHANICAL TEST METHODS - SOLDERABILITY AND RESISTANCE TO SOLDERING |
I.S. EN 61760-1:2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
I.S. EN 61196-2:2003
|
RADIO-FREQUENCY CABLES - PART 2: SECTIONAL SPECIFICATION FOR SEMI-RIGID RADIO-FREQUENCY AND COAXIAL CABLES WITH POLYTETRAFLUOROETHYLENE (PTFE) INSULATION |
IEC 60115-8-1 : 2.0
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
I.S. EN 140100:2008
|
SECTIONAL SPECIFICATION: FIXED LOW POWER FILM RESISTORS |
I.S. EN ISO 9455-16:2013
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
IEC 61643-331 : 2.0
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 331: PERFORMANCE REQUIREMENTS AND TEST METHODS FOR METAL OXIDE VARISTORS (MOV) |
I.S. EN 61191-2:2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
I.S. EN ISO 9455-10:2012
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD (ISO 9455-10:2012) |
EN 140401-803 : 2007 AMD 3 2017
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
EN 140101-806 : 2008 COR 2014
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
EN 61191-2 : 2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017) |
EN 61169-1 : 2013 COR 2016
|
RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS (IEC 61169-1:2013) |
EN 60938-1 : 1999 AMD 1 2007
|
FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
EN 60539-1 : 2016 COR 2017
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017) |
EN 60115-1 : 2011 AMD 11 2015
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
EN 140200 : 1996 AMD 1 2001
|
FIXED POWER RESISTORS (SECTIONAL SPECIFICATION) |
DIN EN ISO 9455-2 : 1995
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD |
DIN EN 14436 E : 2004
|
COPPER AND COPPER ALLOYS - ELECTROLYTICALLY TINNED STRIP |
DIN EN ISO 9455-10 : 2013
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD (ISO 9455-10:2012) |
DIN EN ISO 9455-16 : 2013
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
DIN EN 14436 : 2004
|
COPPER AND COPPER ALLOYS - ELECTROLYTICALLY TINNED STRIP |
BS EN 61189-5-1 : 2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES |
IEC 61189-5-2 : 1ED 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
BS EN 16602-70-10 : 2015
|
SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS |
BS EN 61191-3 : 2017
|
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017) |
BS PD IEC TS 62861 : 2017
|
GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TESTING FOR LED LIGHT SOURCES AND LED LUMINAIRES |
UNI EN ISO 9455-16 : 2013
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
IEC 61747-5 : 1.0
|
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
IEC 62211 :2017
|
INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
IEC 62246-1 : 3.0
|
REED SWITCHES - PART 1: GENERIC SPECIFICATION |
IEC 62319-1 : 1.0
|
POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
IEC 60127-2 : 3.0
|
MINIATURE FUSES - PART 2: CARTRIDGE FUSE-LINKS |
IEC 61810-7 : 2.0
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
IEC 60512-12-1 : 1.0
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD |
IEC 62326-20 : 1ED 2016
|
PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS |
IEC 61881 : 1.0
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS |
16/30350012 DC : 0
|
BS EN 60810 - LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
IEC 60738-1 : 3.1
|
THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
IEC 60938-1 : 2.1
|
FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
IEC 60689 : 2.0
|
MEASUREMENT AND TEST METHODS FOR TUNING FORK QUARTZ CRYSTAL UNITS IN THE RANGE FROM 10 KHZ TO 200 KHZ AND STANDARD VALUES |
IEC 61248-6 : 1.0
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 6: SECTIONAL SPECIFICATION FOR INDUCTORS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
IEC 60368-1 : 4.1
|
PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
IEC 61189-5 : 1.0
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
BS EN 61191-4 : 2017
|
PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES (IEC 61191-4:2017) |
IEC 60127-4 : 3.2
|
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
BS EN 14436 : 2004
|
COPPER AND COPPER ALLOYS - ELECTROLYTICALLY TINNED STRIP |
IEC 61169-1 : 2.0
|
RADIO FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS |
IEC 61881-3 : 1.1
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS |
IEC 61643-311 : 2.0
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 311: PERFORMANCE REQUIREMENTS AND TEST CIRCUITS FOR GAS DISCHARGE TUBES (GDT) |
IEC 61249-8-7 : 1.0
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS |
IEC 61204-6 : 1.0
|
LOW-VOLTAGE POWER SUPPLIES, D.C. OUTPUT - PART 6: REQUIREMENTS FOR LOW-VOLTAGE POWER SUPPLIES OF ASSESSED PERFORMANCE |
IEC 61189-5-4 : 1ED 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
IEC 62739-3 : 1ED 2017
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS |
UNE-EN ISO 9455-16:2013
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
IEC 60068-2-21 : 6.0
|
ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
IEC 61191-2 : 3.0
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
IEC 60749 : 2.2
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS |
IEC 61338-2 : 1.0
|
WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDELINES FOR OSCILLATOR AND FILTER APPLICATIONS |
14/30309696 DC : 0
|
BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
UNE-EN 60749-15:2011
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
IEC 61191-4 : 2.0
|
PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
BS EN 61191-1 : 2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
BS EN ISO 9455-16 : 2013
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
IEC 61249-5-4 : 1.0
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS - SECTION 4: CONDUCTIVE INKS |
IEC 62922 : 1ED 2016
|
ORGANIC LIGHT EMITTING DIODE (OLED) PANELS FOR GENERAL LIGHTING - PERFORMANCE REQUIREMENTS |
ISO 27874 : 2008(R2017)
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
IEC 60934 : 3.2
|
CIRCUIT-BREAKERS FOR EQUIPMENT (CBE) |
ISO 9455-16 : 2013
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TESTS, WETTING BALANCE METHOD |
IEC 60068-2-54 : 2.0
|
ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
IEC 60068-1 : 7.0
|
ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE |
IEC TS 62861 : 1ED 2017
|
GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TESTING FOR LED LIGHT SOURCES AND LED LUMINAIRES |
BS EN 61984 : 2009
|
CONNECTORS - SAFETY REQUIREMENTS AND TESTS |
IEC 60939-3 : 2015 COR 2 2018
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE |
ISO 9455-2 : 1993(R2014)
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD |
ISO 4521 : 2008(R2017)
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
IEC 60512-12-5 : 1.0
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-5: SOLDERING TESTS - TEST 12E: RESISTANCE TO SOLDERING HEAT, SOLDERING IRON METHOD |
IEC 61984 : 2.0
|
CONNECTORS - SAFETY REQUIREMENTS AND TESTS |
IEC 60384-26-1 : 1.0
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ |
IEC 61797-1 : 1.0
|
TRANSFORMERS AND INDUCTORS FOR USE IN TELECOMMUNICATION AND ELECTRONIC EQUIPMENT - MAIN DIMENSIONS OF COIL FORMERS - PART 1: COIL FORMERS FOR LAMINATED CORES |
IEC 62878-1-1 : 1ED 2015
|
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
15/30327712 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
BS EN 61191-2 : 2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017) |
IEC 60384-1 : 5.0
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
05/30128512 DC : DRAFT JAN 2005
|
IEC 61984 ED.2 - CONNECTORS - SAFETY REQUIREMENTS AND TESTS |
IEC 61811-53 : 2.0
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 53: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 14 MM X 9 MM BASE |
IEC 61189-5-1 : 1ED 2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES |
IEC 62435-5 : 1ED 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
IEC 61270-1 : 1.0
|
CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL |
IEC 61058-2-4 : 1.1
|
SWITCHES FOR APPLIANCES - PART 2-4: PARTICULAR REQUIREMENTS FOR INDEPENDENTLY MOUNTED SWITCHES |
11/30255124 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 62314 : 1.0
|
SOLID-STATE RELAYS |
IEC 61020-1 : 2.0
|
ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 61189-5-3 : 1ED 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
IEC 61881-2 : 1.0
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON-SOLID ELECTROLYTE |
IEC 61881-1 : 1.0
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS |
IEC 60838-2-1 : 1.0
|
MISCELLANEOUS LAMPHOLDERS - PART 2-1: PARTICULAR REQUIREMENTS - LAMPHOLDERS S14 |
(INACTIVE RECORD)IEC 62435-1 : 1ED 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
IEC 60939-1 : 3.0
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
IEC 61747-1 : 1.1
|
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |
IEC 60512-12-6 : 1.0
|
ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT - BASIC TESTING PROCEDURES AND MEASURING METHODS - SOLDERING TESTS - SEALING AGAINST FLUX AND CLEANING SOLVENTS IN MACHINE SOLDERING |
IEC 62739-1 : 1ED 2013
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING |
ISO 9455-17 : 2002(R2014)
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
IEC 60684-2 : 3.0
|
FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST |
IEC 61193-3 : 1ED 2013
|
QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING |
IEC 60862-1 : 3.0
|
SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
IEC 60512-12-2 : 1.0
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-2: SOLDERING TESTS - TEST 12B: SOLDERABILITY, WETTING, SOLDERING IRON METHOD |
IEC 61643-312 : 2013 COR 1 2013
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES |
BS EN 62149-6 : 2003
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 6: 650-NM 250-MBIT/S PLASTIC OPTICAL FIBRE TRANSCEIVER |
ISO 9455-10 : 2012(R2017)
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
IEC 60947-7-4 : 1ED 2013
|
LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS |
IEC 61169-8 : 1.0
|
RADIO-FREQUENCY CONNECTORS - PART 8: SECTIONAL SPECIFICATION - RF COAXIAL CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 6,5 MM (0,256 IN) WITH BAYONET LOCK - CHARACTERISTIC IMPEDANCE 50 OHMS (TYPE BNC) |
IEC 61248-1 : 1.0
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 62149-9 : 1ED 2014
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS |
IEC 62435-2 : 1ED 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
IEC 61811-55 : 2.0
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 55: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 11 MM X 7,5 MM (MAX.) BASE |
IEC 61811-51 : 2.0
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 51: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - NON-STANDARDIZED TYPES AND CONSTRUCTION |
IEC 61019-1 : 1.0
|
SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION |
IEC 62391-1 : 2.0
|
FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 61248-5 : 1.0
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 5: SECTIONAL SPECIFICATION FOR PULSE TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
IEC 61811-52 : 2.0
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 52: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 20 MM X 10 MM BASE |
IEC 60252-1 : 2.1
|
AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION |
IEC 60068-3-13 : 1ED 2016
|
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
IEC 60252-2 : 2.1
|
AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS |
IEC 61248-3 : 1.0
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 3: SECTIONAL SPECIFICATION FOR POWER TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
BS EN 60810 : 2015
|
LAMPS FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
BS EN ISO 9455-10 : 2012
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
IEC 61811-54 : 2.0
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 54: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 15 MM X 7,5 MM BASE |
IEC 61248-4 : 1.0
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 4: SECTIONAL SPECIFICATION FOR POWER TRANSFORMERS FOR SWITCHED MODE POWER SUPPLIES (SMPS) ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
IEC 61338-1 : 1.0
|
WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
BS EN 140402-801 : 2015
|
DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
UNE-EN 60400:2011
|
LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS |
IEC 60127-6 : 2.0
|
MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE FUSE-LINKS |
DIN EN ISO 9455-16 E : 2013
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
BS EN 62435-5 : 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
IEC 62149-4 : 2.0
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
IEC 61760-1 : 2.0
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
IEC 60068-2-82 : 1.0
|
ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST XW[1]: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
IEC 60749-15 : 2.0
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
IEC 61248-2 : 1.0
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 2: SECTIONAL SPECIFICATION FOR SIGNAL TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
IEC 61191-3 : 2.0
|
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
IEC 62025-2 : 1.0
|
HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
IEC 61337-2 : 1.0
|
FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE |
IEC 61189-3 : 2.0
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
IEC 60512-12-4 : 1.0
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
IEC 61337-1 : 1.0
|
FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
IEC 60068-2-83 : 1.0
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
BS EN ISO 9455-17 : 2006
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
IEC 61810-1 : 4.0
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
IEC 61747-10-1 : 1ED 2013
|
LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL |
DIN EN ISO 9455-10 E : 2013
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD (ISO 9455-10:2012) |
EN 60749-15 : 2010 COR 2011
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
EN 60749-20 : 2009
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
EN 61007 : 1997
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES |
EN 61760-1 : 2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |