IEC 60068-2-58 : 4.1

Current

Current The latest, up-to-date edition.

ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)

Publisher: International Electrotechnical Committee

Published: 28-07-2017

Available Formats: PDF - English, Hardcopy - English
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Table of Contents - (Show below) - (Hide below)

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Grouping of soldering processes and related
   test severities
5 Test equipment
6 Test Td[1]: Solderability of terminations
7 Test Td[2]: Resistance to soldering heat
8 Test Td[3]: Dewetting and resistance to dissolution
   of metallization
9 Final measurements
10 Information to be given in the relevant specification
Annex A (normative) - Criteria for visual examination
Annex B (informative) - Guidance
Annex C (normative) - Application of the test methods to through
        hole reflow soldering components (THR)
Annex X (informative) - Cross reference for references to the
        prior revision of this specification
Bibliography

Abstract - (Show below) - (Hide below)

Gives procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

General Product Information - (Show below) - (Hide below)

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 91

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
NEN EN IEC 60068-2-58 : 2015	Identical
CEI EN 60068-2-58 : 2016	Identical
VDE 0468-2-58 : 2016	Identical
OVE/ONORM EN 60068-2-58 : 2016	Identical
DS EN 60068-2-58 : 2015	Identical
NBN EN 60068 2-58 : 2015	Identical
BS EN 60068-2-58 : 2015	Identical
NF EN 60068-2-58 : 2015	Identical
DS EN 60068-2-58 : 2015	Identical
BS EN 60068-2-58 : 2015	Identical
DIN IEC 60068-2-58 : 1992	Corresponds
UNE-EN 60068-2-58:2006	Identical
NF EN 60068-2-58 : 2015	Identical
PN EN 60068-2-58 : 2015	Identical
DIN EN 60068-2-58 : 2016	Identical
VDE 0468-2-58 : 2016	Identical
OVE/ONORM EN 60068-2-58 : 2016	Identical
SN EN 60068-2-58 : 1999	Identical
UNE EN 60068-2-58 : 2006	Identical
NEN EN IEC 60068-2-58 : 2015	Identical
NBN EN 60068 2-58 : 2015	Identical
CEI 50-8/5 : 1ED 1999	Identical
CEI EN 60068-2-58 : 2016	Identical
NFC 20 758 : 1990	Identical
UNE 20501-2-58 : 1994	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

CEI EN 60068-3-13 : 1ED 2017	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
BS CECC00802(1991) : 1991	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. GUIDANCE DOCUMENT: CECC STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDs) OF ASSESSED QUALITY
02/203178 DC : 0	PREN 140101-806 - DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE WOUND RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS - ASSESSMENT LEVEL Z - VERSION A: WITH 100-%-TEST - VERSION E: WITH FAILURE RATE LEVEL AND 100-%-TEST - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
BS EN 61337-1 : 2004	FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION
I.S. EN IEC 60810:2018	LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
10/30237992 DC : DRAFT NOV 2010	BS IEC 60393-6 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS
I.S. EN 61188-5-5:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
CEI EN 60512-12-3 : 2006	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING
BS EN 62604-1 : 2015	SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
IEC 60122-1 : 3.1	QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
BS EN 60738-1-4 : 2008	THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-4: BLANK DETAIL SPECIFICATION - SENSING APPLICATION - ASSESSMENT LEVEL EZ
BS EN 60393-6 : 2016	POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS
BS EN 62137 : 2004	ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
BS EN 61811-1 : 2015	ELECTROMECHANICAL TELECOM ELEMENTARY RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION
BS EN 60512-12-4 : 2006	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD
12/30260802 DC : 0	BS EN 62391-1 - FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
07/30149142 DC : 0	BS IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
NF EN 60115-8 : 2013	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
NF EN 61051-1 : 2013	VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
13/30287806 DC : 0	BS EN 60539-1 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
07/30162213 DC : 0	BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
06/30153438 DC : DRAFT JULY 2006	BS IEC 60539-1 ED.2 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORES - PART 1: GENERIC SPECIFICATION
10/30237986 DC : 0	BS EN 140401-804 - DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
09/30214333 DC : 0	BS EN 60384-22 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION: FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2
BS EN 60862-1 : 2015	SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
BS EN 62137-4 : 2014	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
16/30353588 DC : 0	BS EN 61020-1 ED 3.0 - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS EN 61188-5-5 : 2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
NF EN 60393-5 : 2016	POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 5: SECTIONAL SPECIFICATION - SINGLE-TURN ROTARY LOW-POWER WIREWOUND AND NONWIREWOUND POTENTIOMETERS
I.S. EN 60738-1-3:2008	THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-3: BLANK DETAIL SPECIFICATION - INRUSH CURRENT APPLICATION - ASSESSMENT LEVEL EZ
BS EN 60738-1 : 2006	THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
09/30210454 DC : DRAFT SEP 2009	BS EN 60512-16-21 - CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES
BS 9752(1989) : 1989	BLANK DETAIL SPECIFICATION FOR FIXED INSULATED (UNSHIELDED) R.F. INDUCTORS SUITABLE FOR SURFACE MOUNTING AT THE FULL ASSESSMENT LEVEL
BS EN 60384-22 : 2012	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2
DD IEC PAS 60747-17 : 2011	SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION
12/30271778 DC : 0	BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
11/30243576 DC : DRAFT FEB 2011	BS EN 62643-1 - ELECTROSTATIC MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
DSCC 09025 : 0	CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0603
CEI EN 62421 : 2008	ELECTRONICS ASSEMBLY TECHNOLOGY - ELECTRONIC MODULES
11/30252855 DC : 0	BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING
CEI EN 60115-8-1 : 2016	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
14/30312344 DC : 0	PD IEC/PAS 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
06/30157868 DC : 0	BS EN 60393-1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
DSCC 09023 : 0	CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0201
NF EN 61189-3-719 : 2016	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING
05/30138794 DC : DRAFT SEP 2005
17/30357139 DC : 0	BS EN 61760-4 + A1 - SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
I.S. EN 62137-4:2014	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
BS EN 62421 : 2007	ELECTRONICS ASSEMBLY TECHNOLOGY - ELECTRONIC MODULES
CEI EN 62391-1 : 2016	FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS EN 60393-1 : 2009	POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
CEI EN 60068-2-82 : 2008	ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS
CEI EN 140401 : 2009	BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
03/103740 DC : DRAFT FEB 2003	IEC 61337-1 ED.1 - FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
12/30260691 DC : 0	BS EN 60384-24 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
14/30280850 DC : 0	BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
08/30186808 DC : DRAFT JULY 2008	BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS
97/231700 DC : DRAFT DEC 1997	IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
13/30289547 DC : 0	BS EN 60384-18 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO2) AND NON-SOLID ELECTROLYTE
BS EN 60384-21 : 2012	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1
BS EN 62326-20 : 2016	PRINTED BOARDS - PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS
BS EN 60115-8 : 2012	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
NF EN 60512-16-21 : 2012	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES
12/30261600 DC : DRAFT MAR 2012	BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
CEI EN 60115-8 : 2013	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
BS EN 61020-1 : 2009	ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS EN 60068-3-13 : 2016	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
BS EN 140401-802 : 2007	DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
CEI EN 60384-18 : 2007	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE
NF EN 60068-2-83 : 2012	ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
15/30332490 DC : 0	BS EN 62211 - INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
I.S. EN 60384-25:2015	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
BS EN 62575-1 : 2016	RADIO FREQUENCY (RF) BULK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
UNE EN 61020-1 : 2011	ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
10/30219044 DC : 0	BS EN 62674-1 - HIGH FREQUENCY INDUCTIVE COMPONENTS - FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT
13/30264596 DC : 0	BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
IEEE C62.33 : 1982	TEST METHODS AND PERFORMANCE VALUES FOR METAL-OXIDE VARISTOR SURGE PROTECTIVE COMPONENTS
I.S. EN 62025-2:2005	HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
BS PD ISO/IEC PAS 60127-8 : 2014	MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
BS EN 61019-1 : 2005	SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION
DSCC 11017 : 0	INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0402
DSCC 11019 : 0	INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0805
BS EN 140401-801 : 2007	DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
BS EN 140401-803 : 2007	DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
04/30113172 DC : DRAFT MAY 2004	IEC 60384-24 ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
I.S. EN 61337-2:2004	FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE
BS EN 62211 : 2004	INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
07/30165180 DC : 0	BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE
BS EN 60512-12-1 : 2006	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD
05/30129049 DC : DRAFT FEB 2005	IEC 62025-2 - HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
03/103741 DC : DRAFT FEB 2003	IEC 61338-1 ED.1 - WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
BS EN 61810-7 : 2006	ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES
I.S. EN 62604-1:2015	SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
DSCC 09024 : 0	CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0402
15/30325282 DC : 0	BS EN 62884-1 - MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELETIRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT
BS EN 62391-1 : 2016	FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 62391-1:2015)
13/30264600 DC : 0	BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
BS EN 62878-1-1 : 2015	DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
BS EN 61189-3-719 : 2016	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING
CEI EN 61051-1 : 2010	VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS EN 61007 : 1997	TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES
BS EN 60068-2-54 : 2006	ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
BS EN 62025-2 : 2005	HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
BS EN 60368-1 : 2000	PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
I.S. EN 60738-1-1:2008	THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-1: BLANK DETAIL SPECIFICATION - CURRENT LIMITING APPLICATION - ASSESSMENT LEVEL EZ
07/30161526 DC : 0	BS EN 60115-8 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
BS EN 171000 : 2001	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS
BS EN 61338-2 : 2004	WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDELINES FOR OSCILLATOR AND FILTER APPLICATIONS
I.S. EN 61188-5-2:2003	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
10/30240248 DC : 0	BS EN 60862-1 - SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
BS EN 61248-1 : 1997	TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS EN 61192-1 : 2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
BS EN 60115-8-1 : 2015	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
12/30260721 DC : 0	BS EN 60384-25 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
06/30149145 DC : DRAFT OCT 2006	IEC 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
09/30209389 DC : 0	BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E
CEI EN 60368-1 : 2006	PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
BS EN 61188-5-4 : 2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
17/30355844 DC : DRAFT JUL 2017	BS EN 60384-21 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1
I.S. EN 61188-5-3:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
BS EN 61760-1 : 2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
BS EN 61760-3 : 2010	SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
BS EN 61338-1 : 2005	WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION
09/30214329 DC : 0	BS EN 60384-21 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION: FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1
CSA E60384.1 : 2014	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS EN 60068-2-83 : 2011	ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
BS EN 60738-1-3 : 2008	THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-3: BLANK DETAIL SPECIFICATION - INRUSH CURRENT APPLICATION - ASSESSMENT LEVEL EZ
DSCC 09027 : 0	CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 1210
BS EN 60539-1 : 2016	DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016)
04/30112662 DC : DRAFT APR 2004	IEC 61810-7 ED.2 - ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES
14/30315320 DC : 0	BS EN 60384-15 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 15: SECTIONAL SPECIFICATION: FIXED TANTALUM CAPACITORS WITH NON-SOLID OR SOLID ELECTROLYTE
BS EN 60738-1-2 : 2008	THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-2: BLANK DETAIL SPECIFICATION - HEATING ELEMENT APPLICATION - ASSESSMENT LEVEL EZ
BS EN 62884-1 : 2017	MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT (IEC 62884-1:2017)
BS PD IEC/TR 60068-3-12 : 2014	ENVIRONMENTAL TESTING - PART 3-12: SUPPORTING DOCUMENTATION AND GUIDANCE - METHOD TO EVALUATE A POSSIBLE LEAD-FREE SOLDER REFLOW TEMPERATURE PROFILE
BS EN 60068-2-82 : 2007	ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS
BS EN 61337-2 : 2004	FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE
BIS IS/IEC 60862-1 : 2003	SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
BS EN 61188-5-8 : 2008	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
04/30113200 DC : DRAFT MAY 2004	IEC 60384-25 ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
BS EN 60512-16-21 : 2012	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES
BS EN 60747-5-5 : 2011	SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS
NF EN 61020-1 : 2009	ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
02/206104 DC : DRAFT MAY 2002	IEC 60384-22, ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC - CLASS 2 - ASSESSMENT LEVEL EZ
IEC 61051-1:2007	VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS EN 62674-1 : 2012	HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT
09/30186180 DC : 0	BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
NF EN 60384-1 : 2016	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
03/104227 DC : DRAFT MAY 2003	IEC 60393-6 ED.1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS
06/30155911 DC : DRAFT SEP 2006	BS EN 140401-801 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
BS EN 60384-3 : 2006	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3: SECTIONAL SPECIFICATION: SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) ELECTROLYTE
BS EN 60122-1 : 2002	QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
BS EN 60384-25 : 2015	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
16/30338234 DC : 0	BS EN 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
06/30155905 DC : DRAFT SEP 2006	BS EN 140401-803 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
15/30329267 DC : 0	BS EN 60747-17 - SEMICONDUCTOR DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION
09/30207307 DC : 0	BS EN 60115-2 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: FIXED LOW-POWER NON-WIREWOUND RESISTORS
17/30355848 DC : 0	BS EN 60384-22 ED.3.0 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2
BS EN 60384-1 : 2016	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
02/206102 DC : DRAFT MAY 2002	IEC 60384-21, ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC - CLASS 1 - ASSESSMENT LEVEL EZ
05/30132097 DC : DRAFT JUNE 2005	IEC 60679-1 ED 3 - QUARTZ CRYSTAL CONTROLLED OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
BS EN 61051-1 : 2008	VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 60384-18:2016	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE
I.S. EN 60068-2-44:1997	ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING
BS EN 60384-18 : 2016	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE
BS EN 60068-2-20 : 2008	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
BS EN 61760-4 : 2015	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
14/30317306 DC : 0	BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
BS EN 60512-12-3 : 2006	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING
CEI EN 62884-1 : 1ED 2018	MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT
I.S. EN 61337-1:2005	FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION
I.S. EN 60384-21:2012	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1 (IEC 60384-21:2011 (EQV))
CEI EN 60393-1 : 2010	POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS EN 60738-1-1 : 2008	THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-1: BLANK DETAIL SPECIFICATION - CURRENT LIMITING APPLICATION - ASSESSMENT LEVEL EZ
CEI EN 60068-2-21 : 2006	ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
DSCC 11018 : 0	INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0603
NF EN 62674-1 : 2013	HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT
BS EN 61188-5-3 : 2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
I.S. EN 60539-2:2004	DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS
DSCC 09026 : 0	CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0805
I.S. EN 60115-8-1:2015	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
I.S. EN 60384-1:2016	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
CEI EN 62211 : 2005	INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
CEI EN 60539-1 : 2009	DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
I.S. EN 62326-20:2016	PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
IEC 61338-1-2 : 1.0	WAVEGUIDE TYPE DIELECTRIC RESONATORS - GENERAL INFORMATION AND TEST CONDITIONS - TEST CONDITIONS
IEC 61188-5-6 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-6: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
IEC 60115-8-1 : 2.0	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
IEC 60068-2-44 : 2.0	ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING
IEC 60384-1 REDLINE : 5ED 2016	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 140402:2015	BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
IEC TR 60068-3-12 : 2.0	ENVIRONMENTAL TESTING - PART 3-12: SUPPORTING DOCUMENTATION AND GUIDANCE - METHOD TO EVALUATE A POSSIBLE LEAD-FREE SOLDER REFLOW TEMPERATURE PROFILE
IEC 60115-8 : 2.0	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
NF EN 60384-18 : 2016	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE
I.S. EN 60738-1:2006	THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
I.S. EN 62137:2005	ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
BS EN 60115-1 : 2011	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
IEC 61760-4 : 1ED 2015	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
CEI EN 60384-21 : 2013	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1
CEI EN 61760-1 : 2007	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
I.S. EN 61051-1:2008	VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 61810-7:2006	ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES
I.S. EN 60738-1-4:2008	THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-4: BLANK DETAIL SPECIFICATION - SENSING APPLICATION - ASSESSMENT LEVEL EZ
OVE/ONORM EN 61051-1 : 2009	VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 60127-4:2005	MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV))
I.S. EN 60384-3:2016	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) ELECTROLYTE
IEC 62391-1 REDLINE : 2ED 2015	FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS EN 140402 : 2015	BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
I.S. EN 140401-804:2011	DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
I.S. EN 61188-5-6:2003	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
BS EN 60384-24 : 2015	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE (IEC 60384-24:2015)
I.S. EN 60384-24:2015	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
CEI EN 60512-12-1 : 2007	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD
I.S. EN 61019-1:2005	SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION
I.S. EN 140401-802:2007	DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
EN 62884-1 : 2017	MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT (IEC 62884-1:2017)
I.S. EN 60115-8:2012	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD))
I.S. EN 60512-12-1:2006	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING,
I.S. EN 62674-1:2012	HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT (IEC 62674-1:2012 (EQV))
IEC 62884-1 : 1ED 2017	MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT
BS EN 60539-2 : 2004	DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS
I.S. EN 60068-2-82:2007	ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS
I.S. EN 140401:2009	BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
BS EN 60127-4 : 2005	MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
I.S. EN 140402-801:2015	DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
I.S. EN 61192-1:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
I.S. EN 60122-1:2002 AMD 1 2018	QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
I.S. EN 60862-1:2015	SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
I.S. EN 61811-1:2015	ELECTROMECHANICAL TELECOM ELEMENTARY RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION
CEI EN 60122-1 : 2004	QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
EN IEC 60810 : 2018	LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS (IEC 60810:2017)
I.S. EN 61760-3:2010	SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
I.S. EN 61338-1:2005	WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION
I.S. EN 62575-1:2016	RADIO FREQUENCY (RF) BULK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
I.S. EN 61760-4:2015	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
BS EN 60068-2-21 : 2006	ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
I.S. EN 60747-5-5:2011	SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS
CEI EN 60068-2-54 : 2007	ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
BS EN 140401-804 : 2011	DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
I.S. EN 60512-12-3:2006	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING
BS EN 140401 : 2009	BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
I.S. EN 60068-2-83:2011	ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV))
IEC 60539-1 : 3.0	DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
I.S. EN 60384-22:2012	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2 (IEC 60384-22:2011 (EQV))
I.S. EN 60512-12-4:2006	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD
CEI EN 60384-22 : 2013	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2
I.S. EN 60393-6:2016	POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS
I.S. EN 60539-1:2016	DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
I.S. EN 61248-1:1998	TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 60068-2-21:2006	ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
NF EN 60127-4 : 2005 AMD 2 2013	MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
I.S. EN 60512-16-21:2012	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES (IEC 60512-16-21:2012 (EQV))
I.S. EN 61189-3-719:2016	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING
CEI EN 60068-2-20 : 2009	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
CEI EN 60512-16-21 : 2013	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES
CEI EN 60512-12-4 : 2006	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS -PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD
EN 140401-802 : 2007 AMD 3 2017	DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
NF EN 61760-3 : 2010	SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
I.S. EN 62884-1:2017	MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT
I.S. EN 62211:2017	INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
NF EN 60747-5-5 : 2012 AMD 1 2015	SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS
CEI EN 61760-3 : 2010	SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
CEI EN 61810-7 : 2006	ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES
CEI EN 60068-2-83 : 2012	ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
NF EN 60393-6 : 2016	POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS
I.S. EN 60368-1:2000	PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
I.S. EN 60738-1-2:2008	THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-2: BLANK DETAIL SPECIFICATION - HEATING ELEMENT APPLICATION - ASSESSMENT LEVEL EZ
12/30252220 DC : DRAFT MAR 2012	BS EN 62604-1 - SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS - PART 1: GENERIC SPECIFICATION
02/206181 DC : DRAFT MAY 2002	IEC 61019-1. ED.1 - SURFACE ACOUSTIC WAVE RESONATORS (SAW) OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
BS EN 170000 : 1999	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: WAVEGUIDE TYPE DIELECTRIC RESONATORS
12/30258507 DC : 0	BS EN 62575-1 - RADIO FREQUENCY (RF) BUK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
I.S. EN 60068-3-13:2016	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
I.S. EN 60068-2-20:2008	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
I.S. EN 61007:1998	TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES
13/30283837 DC : 0	BS EN 62812 - METHOD OF MEASUREMENT OF LOW RESISTANCE
I.S. EN 60393-1:2009	POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 140401-801:2007	DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
IEC 60300-3-5 : 1.0	DEPENDABILITY MANAGEMENT - PART 3-5: APPLICATION GUIDE - RELIABILITY TEST CONDITIONS AND STATISTICAL TEST PRINCIPLES
IEC 61337-1-2 : 1.0	FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1-2: TEST CONDITIONS
I.S. EN 61020-1:2009	ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 140401-803:2007	DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
IEC PAS 60127-8 : 1ED 2014	MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
I.S. EN 62391-1:2016	FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 62878-1-1:2015	DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
IEC 61007 : 2.0	TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES
IEC 61191-1 : 2.0	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC PAS 60747-17 : 1.0	SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION
I.S. EN 60068-2-54:2006	ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
IEC 60115-1 : 4.0	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 61188-5-8:2008	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
IEC 60393-1 : 3.0	POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 60115-1:2011	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
EN 61760-4 : 2015 AMD 1 2018	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018)
I.S. EN 61188-5-4:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
I.S. EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
I.S. EN 61191-2:2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
EN 140401-803 : 2007 AMD 3 2017	DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
EN 140401-804 : 2011 AMD 1 2013	DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
EN 60747-5-5 : 2011 AMD 1 2015	SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS (IEC 60747-5-5:2007/A1:2013)
EN 140401-801 : 2007 AMD 1 2013	DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
EN 60384-24 : 2015 COR 2017	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE (IEC 60384-24:2015/COR1:2016)
EN 61191-2 : 2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
EN 60539-1 : 2016 COR 2017	DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017)
EN 60115-1 : 2011 AMD 11 2015	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
BS PD IEC TS 62861 : 2017	GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TESTING FOR LED LIGHT SOURCES AND LED LUMINAIRES
BS EN 61191-3 : 2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
BS EN 61189-5-1 : 2016	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
IEC 62211 :2017	INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
IEC 61810-7 : 2.0	ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES
IEC 60512-12-1 : 1.0	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD
IEC 62326-20 : 1ED 2016	PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS
16/30350012 DC : 0	BS EN 60810 - LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
IEC 60738-1 : 3.1	THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
BS EN 61188-5-6 : 2003	PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-6: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
IEC 60384-3 : 4.0	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) ELECTROLYTE
IEC 62604-1 : 1ED 2015	SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
IEC 60368-1 : 4.1	PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
BS EN 61191-4 : 2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES (IEC 61191-4:2017)
IEC 60127-4 : 3.2	MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
IEC 60384-24 : 2.0	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - FIXED TANTALUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
IEC 60539-2 : 1.1	DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS
IEC 60512-12-3 : 1.0	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING
IEC 60393-6 : 2.0	POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS
IEC 60068-2-21 : 6.0	ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
IEC 61191-2 : 3.0	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
IEC 62137 : 1.0	ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FGBA, BGA, FLGA, LGA, SON AND QFN
IEC 60738-1-3 : 2.0	THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-3: BLANK DETAIL SPECIFICATION - INRUSH CURRENT APPLICATION - ASSESSMENT LEVEL EZ
IEC 61338-2 : 1.0	WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDELINES FOR OSCILLATOR AND FILTER APPLICATIONS
IEC 61191-4 : 2.0	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
BS EN 61191-1 : 2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 61188-5-3 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
BS EN 61188-5-2 : 2003	PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
IEC 60068-2-54 : 2.0	ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
IEC TS 62861 : 1ED 2017	GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TESTING FOR LED LIGHT SOURCES AND LED LUMINAIRES
IEC 60747-5-5 : 1.1	SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS
IEC 61188-5-4 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
IEC 62878-1-1 : 1ED 2015	DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
15/30327712 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
EN 60512-12-3 : 2006 COR 2006	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING
IEC 60384-1 : 5.0	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
IEC 61189-5-1 : 1ED 2016	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
IEC 60384-25 : 2.0	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
11/30255124 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 61020-1 : 2.0	ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
IEC 61188-5-8 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
IEC 60384-18 : 3.0	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE
IEC 60738-1-4 : 2.0	THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-4: BLANK DETAIL SPECIFICATION - SENSING APPLICATION - ASSESSMENT LEVEL EZ
IEC 61747-1 : 1.1	LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
IEC 61192-1 : 1.0	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
IEC 60862-1 : 3.0	SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
IEC 61248-1 : 1.0	TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION
IEC 60512-16-21 : 1.0	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES
IEC 60738-1-1 : 3.0	THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-1: BLANK DETAIL SPECIFICATION - CURRENT LIMITING APPLICATION - ASSESSMENT LEVEL EZ
IEC 60068-2-20 : 5.0	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
IEC 61189-3-719 : 1ED 2016	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING
IEC 60384-21 : 2.0	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1
IEC 62391-1 : 2.0	FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
IEC 61019-1 : 1.0	SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION
IEC 60068-3-13 : 1ED 2016	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
IEC 61188-5-5 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
IEC 61338-1 : 1.0	WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION
BS EN 140402-801 : 2015	DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
IEC 61188-5-2 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
IEC 60384-22 : 2.0	FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2
IEC 62674-1 : 1.0	HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT
IEC 61760-1 : 2.0	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 60068-2-82 : 1.0	ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST XW[1]: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS
IEC 61191-3 : 2.0	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
IEC 62025-2 : 1.0	HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
IEC 60738-1-2 : 2.0	THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-2: BLANK DETAIL SPECIFICATION - HEATING ELEMENT APPLICATION - ASSESSMENT LEVEL EZ
IEC 61337-2 : 1.0	FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE
IEC 60512-12-4 : 1.0	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD
IEC 62137-4 : 1ED 2014	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
IEC 61337-1 : 1.0	FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION
IEC 60068-2-83 : 1.0	ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
IEC 62575-1 : 1ED 2015	RADIO FREQUENCY (RF) BULK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
EN 140401-804 : 2011 AMD 1 2013	DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
EN 61007 : 1997	TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES
EN 61760-1 : 2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)

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IEC 60749-20 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
IEC 60068-1 : 7.0	ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE
IEC 60068-2-20 : 5.0	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
IEC 61190-1-2 : 3.0	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
ISO 9454-2 : 1998(R2014)	SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS
IEC 61760-1 : 2.0	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-4 : 1ED 2015	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
IEC TR 60068-3-12 : 2.0	ENVIRONMENTAL TESTING - PART 3-12: SUPPORTING DOCUMENTATION AND GUIDANCE - METHOD TO EVALUATE A POSSIBLE LEAD-FREE SOLDER REFLOW TEMPERATURE PROFILE
IEC 61760-3 : 1.0	SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
IEC 60068-2-54 : 2.0	ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
IEC 60068-3-13 : 1ED 2016	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
IEC 61190-1-1 : 1.0	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
IEC 60194 : 6.0	PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
IEC 61249-2-35 : 1.0	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
IEC 61191-2 : 3.0	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
IEC 61249-2-22 : 1.0	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
J STD 075 : 0	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
J STD 020 : D-1	MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
IEC 60068-2-69 : 3.0	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
IEC 61190-1-3 : 2.1	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

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IEC 60068-2-58 : 4.1

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