CEI EN 60068-3-13 : 1ED 2017
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ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
BS CECC00802(1991) : 1991
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HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. GUIDANCE DOCUMENT: CECC STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDs) OF ASSESSED QUALITY |
02/203178 DC : 0
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PREN 140101-806 - DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE WOUND RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS - ASSESSMENT LEVEL Z - VERSION A: WITH 100-%-TEST - VERSION E: WITH FAILURE RATE LEVEL AND 100-%-TEST - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
BS EN 61337-1 : 2004
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FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
I.S. EN IEC 60810:2018
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LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
10/30237992 DC : DRAFT NOV 2010
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BS IEC 60393-6 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS |
I.S. EN 61188-5-5:2007
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES |
CEI EN 60512-12-3 : 2006
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CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING |
BS EN 62604-1 : 2015
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SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
IEC 60122-1 : 3.1
|
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 60738-1-4 : 2008
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THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-4: BLANK DETAIL SPECIFICATION - SENSING APPLICATION - ASSESSMENT LEVEL EZ |
BS EN 60393-6 : 2016
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POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS |
BS EN 62137 : 2004
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ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
BS EN 61811-1 : 2015
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ELECTROMECHANICAL TELECOM ELEMENTARY RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION |
BS EN 60512-12-4 : 2006
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CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
12/30260802 DC : 0
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BS EN 62391-1 - FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
07/30149142 DC : 0
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BS IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
NF EN 60115-8 : 2013
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FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
NF EN 61051-1 : 2013
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VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
13/30287806 DC : 0
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BS EN 60539-1 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
07/30162213 DC : 0
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BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
06/30153438 DC : DRAFT JULY 2006
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BS IEC 60539-1 ED.2 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORES - PART 1: GENERIC SPECIFICATION |
10/30237986 DC : 0
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BS EN 140401-804 - DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
09/30214333 DC : 0
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BS EN 60384-22 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION: FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2 |
BS EN 60862-1 : 2015
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SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 62137-4 : 2014
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ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
16/30353588 DC : 0
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BS EN 61020-1 ED 3.0 - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 61188-5-5 : 2007
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES |
NF EN 60393-5 : 2016
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POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 5: SECTIONAL SPECIFICATION - SINGLE-TURN ROTARY LOW-POWER WIREWOUND AND NONWIREWOUND POTENTIOMETERS |
I.S. EN 60738-1-3:2008
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THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-3: BLANK DETAIL SPECIFICATION - INRUSH CURRENT APPLICATION - ASSESSMENT LEVEL EZ |
BS EN 60738-1 : 2006
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THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
09/30210454 DC : DRAFT SEP 2009
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BS EN 60512-16-21 - CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
BS 9752(1989) : 1989
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BLANK DETAIL SPECIFICATION FOR FIXED INSULATED (UNSHIELDED) R.F. INDUCTORS SUITABLE FOR SURFACE MOUNTING AT THE FULL ASSESSMENT LEVEL |
BS EN 60384-22 : 2012
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FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2 |
DD IEC PAS 60747-17 : 2011
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SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION |
12/30271778 DC : 0
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BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
11/30243576 DC : DRAFT FEB 2011
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BS EN 62643-1 - ELECTROSTATIC MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
DSCC 09025 : 0
|
CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0603 |
CEI EN 62421 : 2008
|
ELECTRONICS ASSEMBLY TECHNOLOGY - ELECTRONIC MODULES |
11/30252855 DC : 0
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BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING |
CEI EN 60115-8-1 : 2016
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
14/30312344 DC : 0
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PD IEC/PAS 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
06/30157868 DC : 0
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BS EN 60393-1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
DSCC 09023 : 0
|
CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0201 |
NF EN 61189-3-719 : 2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING |
05/30138794 DC : DRAFT SEP 2005
|
|
17/30357139 DC : 0
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BS EN 61760-4 + A1 - SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
I.S. EN 62137-4:2014
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
BS EN 62421 : 2007
|
ELECTRONICS ASSEMBLY TECHNOLOGY - ELECTRONIC MODULES |
CEI EN 62391-1 : 2016
|
FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 60393-1 : 2009
|
POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
CEI EN 60068-2-82 : 2008
|
ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
CEI EN 140401 : 2009
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
03/103740 DC : DRAFT FEB 2003
|
IEC 61337-1 ED.1 - FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
12/30260691 DC : 0
|
BS EN 60384-24 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
14/30280850 DC : 0
|
BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
08/30186808 DC : DRAFT JULY 2008
|
BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS |
97/231700 DC : DRAFT DEC 1997
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IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
13/30289547 DC : 0
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BS EN 60384-18 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO2) AND NON-SOLID ELECTROLYTE |
BS EN 60384-21 : 2012
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1 |
BS EN 62326-20 : 2016
|
PRINTED BOARDS - PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS |
BS EN 60115-8 : 2012
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
NF EN 60512-16-21 : 2012
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
12/30261600 DC : DRAFT MAR 2012
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BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
CEI EN 60115-8 : 2013
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
BS EN 61020-1 : 2009
|
ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 60068-3-13 : 2016
|
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
BS EN 140401-802 : 2007
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
CEI EN 60384-18 : 2007
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE |
NF EN 60068-2-83 : 2012
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
15/30332490 DC : 0
|
BS EN 62211 - INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
I.S. EN 60384-25:2015
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
BS EN 62575-1 : 2016
|
RADIO FREQUENCY (RF) BULK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
UNE EN 61020-1 : 2011
|
ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
10/30219044 DC : 0
|
BS EN 62674-1 - HIGH FREQUENCY INDUCTIVE COMPONENTS - FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT |
13/30264596 DC : 0
|
BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
IEEE C62.33 : 1982
|
TEST METHODS AND PERFORMANCE VALUES FOR METAL-OXIDE VARISTOR SURGE PROTECTIVE COMPONENTS |
I.S. EN 62025-2:2005
|
HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
BS PD ISO/IEC PAS 60127-8 : 2014
|
MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
BS EN 61019-1 : 2005
|
SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION |
DSCC 11017 : 0
|
INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0402 |
DSCC 11019 : 0
|
INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0805 |
BS EN 140401-801 : 2007
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
BS EN 140401-803 : 2007
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
04/30113172 DC : DRAFT MAY 2004
|
IEC 60384-24 ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
I.S. EN 61337-2:2004
|
FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE |
BS EN 62211 : 2004
|
INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
07/30165180 DC : 0
|
BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE |
BS EN 60512-12-1 : 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD |
05/30129049 DC : DRAFT FEB 2005
|
IEC 62025-2 - HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
03/103741 DC : DRAFT FEB 2003
|
IEC 61338-1 ED.1 - WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 61810-7 : 2006
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
I.S. EN 62604-1:2015
|
SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
DSCC 09024 : 0
|
CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0402 |
15/30325282 DC : 0
|
BS EN 62884-1 - MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELETIRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
BS EN 62391-1 : 2016
|
FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 62391-1:2015) |
13/30264600 DC : 0
|
BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
BS EN 62878-1-1 : 2015
|
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
BS EN 61189-3-719 : 2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING |
CEI EN 61051-1 : 2010
|
VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 61007 : 1997
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES |
BS EN 60068-2-54 : 2006
|
ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
BS EN 62025-2 : 2005
|
HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
BS EN 60368-1 : 2000
|
PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 60738-1-1:2008
|
THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-1: BLANK DETAIL SPECIFICATION - CURRENT LIMITING APPLICATION - ASSESSMENT LEVEL EZ |
07/30161526 DC : 0
|
BS EN 60115-8 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
BS EN 171000 : 2001
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS |
BS EN 61338-2 : 2004
|
WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDELINES FOR OSCILLATOR AND FILTER APPLICATIONS |
I.S. EN 61188-5-2:2003
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
10/30240248 DC : 0
|
BS EN 60862-1 - SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 61248-1 : 1997
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 61192-1 : 2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL |
BS EN 60115-8-1 : 2015
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
12/30260721 DC : 0
|
BS EN 60384-25 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
06/30149145 DC : DRAFT OCT 2006
|
IEC 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
09/30209389 DC : 0
|
BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E |
CEI EN 60368-1 : 2006
|
PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 61188-5-4 : 2007
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
17/30355844 DC : DRAFT JUL 2017
|
BS EN 60384-21 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1 |
I.S. EN 61188-5-3:2007
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES |
BS EN 61760-1 : 2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
BS EN 61760-3 : 2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
BS EN 61338-1 : 2005
|
WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
09/30214329 DC : 0
|
BS EN 60384-21 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION: FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1 |
CSA E60384.1 : 2014
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 60068-2-83 : 2011
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
BS EN 60738-1-3 : 2008
|
THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-3: BLANK DETAIL SPECIFICATION - INRUSH CURRENT APPLICATION - ASSESSMENT LEVEL EZ |
DSCC 09027 : 0
|
CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 1210 |
BS EN 60539-1 : 2016
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016) |
04/30112662 DC : DRAFT APR 2004
|
IEC 61810-7 ED.2 - ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
14/30315320 DC : 0
|
BS EN 60384-15 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 15: SECTIONAL SPECIFICATION: FIXED TANTALUM CAPACITORS WITH NON-SOLID OR SOLID ELECTROLYTE |
BS EN 60738-1-2 : 2008
|
THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-2: BLANK DETAIL SPECIFICATION - HEATING ELEMENT APPLICATION - ASSESSMENT LEVEL EZ |
BS EN 62884-1 : 2017
|
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT (IEC 62884-1:2017) |
BS PD IEC/TR 60068-3-12 : 2014
|
ENVIRONMENTAL TESTING - PART 3-12: SUPPORTING DOCUMENTATION AND GUIDANCE - METHOD TO EVALUATE A POSSIBLE LEAD-FREE SOLDER REFLOW TEMPERATURE PROFILE |
BS EN 60068-2-82 : 2007
|
ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
BS EN 61337-2 : 2004
|
FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE |
BIS IS/IEC 60862-1 : 2003
|
SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 61188-5-8 : 2008
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA) |
04/30113200 DC : DRAFT MAY 2004
|
IEC 60384-25 ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
BS EN 60512-16-21 : 2012
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
BS EN 60747-5-5 : 2011
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS |
NF EN 61020-1 : 2009
|
ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
02/206104 DC : DRAFT MAY 2002
|
IEC 60384-22, ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC - CLASS 2 - ASSESSMENT LEVEL EZ |
IEC 61051-1:2007
|
VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 62674-1 : 2012
|
HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT |
09/30186180 DC : 0
|
BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
NF EN 60384-1 : 2016
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
03/104227 DC : DRAFT MAY 2003
|
IEC 60393-6 ED.1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS |
06/30155911 DC : DRAFT SEP 2006
|
BS EN 140401-801 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
BS EN 60384-3 : 2006
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3: SECTIONAL SPECIFICATION: SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) ELECTROLYTE |
BS EN 60122-1 : 2002
|
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 60384-25 : 2015
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
16/30338234 DC : 0
|
BS EN 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
06/30155905 DC : DRAFT SEP 2006
|
BS EN 140401-803 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
15/30329267 DC : 0
|
BS EN 60747-17 - SEMICONDUCTOR DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION |
09/30207307 DC : 0
|
BS EN 60115-2 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: FIXED LOW-POWER NON-WIREWOUND RESISTORS |
17/30355848 DC : 0
|
BS EN 60384-22 ED.3.0 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2 |
BS EN 60384-1 : 2016
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
02/206102 DC : DRAFT MAY 2002
|
IEC 60384-21, ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC - CLASS 1 - ASSESSMENT LEVEL EZ |
05/30132097 DC : DRAFT JUNE 2005
|
IEC 60679-1 ED 3 - QUARTZ CRYSTAL CONTROLLED OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 61051-1 : 2008
|
VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60384-18:2016
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE |
I.S. EN 60068-2-44:1997
|
ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING |
BS EN 60384-18 : 2016
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE |
BS EN 60068-2-20 : 2008
|
ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
BS EN 61760-4 : 2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
14/30317306 DC : 0
|
BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
BS EN 60512-12-3 : 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING |
CEI EN 62884-1 : 1ED 2018
|
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
I.S. EN 61337-1:2005
|
FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
I.S. EN 60384-21:2012
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1 (IEC 60384-21:2011 (EQV)) |
CEI EN 60393-1 : 2010
|
POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 60738-1-1 : 2008
|
THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-1: BLANK DETAIL SPECIFICATION - CURRENT LIMITING APPLICATION - ASSESSMENT LEVEL EZ |
CEI EN 60068-2-21 : 2006
|
ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
DSCC 11018 : 0
|
INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0603 |
NF EN 62674-1 : 2013
|
HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT |
BS EN 61188-5-3 : 2007
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES |
I.S. EN 60539-2:2004
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
DSCC 09026 : 0
|
CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0805 |
I.S. EN 60115-8-1:2015
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
I.S. EN 60384-1:2016
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
CEI EN 62211 : 2005
|
INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
CEI EN 60539-1 : 2009
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
I.S. EN 62326-20:2016
|
PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
IEC 61338-1-2 : 1.0
|
WAVEGUIDE TYPE DIELECTRIC RESONATORS - GENERAL INFORMATION AND TEST CONDITIONS - TEST CONDITIONS |
IEC 61188-5-6 : 1.0
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-6: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES |
IEC 60115-8-1 : 2.0
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
IEC 60068-2-44 : 2.0
|
ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING |
IEC 60384-1 REDLINE : 5ED 2016
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 140402:2015
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
IEC TR 60068-3-12 : 2.0
|
ENVIRONMENTAL TESTING - PART 3-12: SUPPORTING DOCUMENTATION AND GUIDANCE - METHOD TO EVALUATE A POSSIBLE LEAD-FREE SOLDER REFLOW TEMPERATURE PROFILE |
IEC 60115-8 : 2.0
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
NF EN 60384-18 : 2016
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE |
I.S. EN 60738-1:2006
|
THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 62137:2005
|
ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
BS EN 60115-1 : 2011
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 61760-4 : 1ED 2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
CEI EN 60384-21 : 2013
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1 |
CEI EN 61760-1 : 2007
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
I.S. EN 61051-1:2008
|
VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 61810-7:2006
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
I.S. EN 60738-1-4:2008
|
THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-4: BLANK DETAIL SPECIFICATION - SENSING APPLICATION - ASSESSMENT LEVEL EZ |
OVE/ONORM EN 61051-1 : 2009
|
VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60127-4:2005
|
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV)) |
I.S. EN 60384-3:2016
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) ELECTROLYTE |
IEC 62391-1 REDLINE : 2ED 2015
|
FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 140402 : 2015
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
I.S. EN 140401-804:2011
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
I.S. EN 61188-5-6:2003
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES |
BS EN 60384-24 : 2015
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE (IEC 60384-24:2015) |
I.S. EN 60384-24:2015
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
CEI EN 60512-12-1 : 2007
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD |
I.S. EN 61019-1:2005
|
SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION |
I.S. EN 140401-802:2007
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
EN 62884-1 : 2017
|
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT (IEC 62884-1:2017) |
I.S. EN 60115-8:2012
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD)) |
I.S. EN 60512-12-1:2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, |
I.S. EN 62674-1:2012
|
HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT (IEC 62674-1:2012 (EQV)) |
IEC 62884-1 : 1ED 2017
|
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
BS EN 60539-2 : 2004
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
I.S. EN 60068-2-82:2007
|
ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
I.S. EN 140401:2009
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
BS EN 60127-4 : 2005
|
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
I.S. EN 140402-801:2015
|
DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
I.S. EN 61192-1:2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
I.S. EN 60122-1:2002 AMD 1 2018
|
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 60862-1:2015
|
SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 61811-1:2015
|
ELECTROMECHANICAL TELECOM ELEMENTARY RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION |
CEI EN 60122-1 : 2004
|
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
EN IEC 60810 : 2018
|
LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS (IEC 60810:2017) |
I.S. EN 61760-3:2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
I.S. EN 61338-1:2005
|
WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
I.S. EN 62575-1:2016
|
RADIO FREQUENCY (RF) BULK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 61760-4:2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
BS EN 60068-2-21 : 2006
|
ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
I.S. EN 60747-5-5:2011
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS |
CEI EN 60068-2-54 : 2007
|
ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
BS EN 140401-804 : 2011
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
I.S. EN 60512-12-3:2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING |
BS EN 140401 : 2009
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
I.S. EN 60068-2-83:2011
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV)) |
IEC 60539-1 : 3.0
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
I.S. EN 60384-22:2012
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2 (IEC 60384-22:2011 (EQV)) |
I.S. EN 60512-12-4:2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
CEI EN 60384-22 : 2013
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2 |
I.S. EN 60393-6:2016
|
POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS |
I.S. EN 60539-1:2016
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
I.S. EN 61248-1:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60068-2-21:2006
|
ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
NF EN 60127-4 : 2005 AMD 2 2013
|
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
I.S. EN 60512-16-21:2012
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES (IEC 60512-16-21:2012 (EQV)) |
I.S. EN 61189-3-719:2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING |
CEI EN 60068-2-20 : 2009
|
ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
CEI EN 60512-16-21 : 2013
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
CEI EN 60512-12-4 : 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS -PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
EN 140401-802 : 2007 AMD 3 2017
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
NF EN 61760-3 : 2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
I.S. EN 62884-1:2017
|
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
I.S. EN 62211:2017
|
INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
NF EN 60747-5-5 : 2012 AMD 1 2015
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS |
CEI EN 61760-3 : 2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
CEI EN 61810-7 : 2006
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
CEI EN 60068-2-83 : 2012
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
NF EN 60393-6 : 2016
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POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS |
I.S. EN 60368-1:2000
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PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 60738-1-2:2008
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THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-2: BLANK DETAIL SPECIFICATION - HEATING ELEMENT APPLICATION - ASSESSMENT LEVEL EZ |
12/30252220 DC : DRAFT MAR 2012
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BS EN 62604-1 - SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS - PART 1: GENERIC SPECIFICATION |
02/206181 DC : DRAFT MAY 2002
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IEC 61019-1. ED.1 - SURFACE ACOUSTIC WAVE RESONATORS (SAW) OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 170000 : 1999
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HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: WAVEGUIDE TYPE DIELECTRIC RESONATORS |
12/30258507 DC : 0
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BS EN 62575-1 - RADIO FREQUENCY (RF) BUK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 60068-3-13:2016
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ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
I.S. EN 60068-2-20:2008
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ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
I.S. EN 61007:1998
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TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES |
13/30283837 DC : 0
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BS EN 62812 - METHOD OF MEASUREMENT OF LOW RESISTANCE |
I.S. EN 60393-1:2009
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POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 140401-801:2007
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DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
IEC 60300-3-5 : 1.0
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DEPENDABILITY MANAGEMENT - PART 3-5: APPLICATION GUIDE - RELIABILITY TEST CONDITIONS AND STATISTICAL TEST PRINCIPLES |
IEC 61337-1-2 : 1.0
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FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1-2: TEST CONDITIONS |
I.S. EN 61020-1:2009
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ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 140401-803:2007
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DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
IEC PAS 60127-8 : 1ED 2014
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MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
I.S. EN 62391-1:2016
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FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 62878-1-1:2015
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DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
IEC 61007 : 2.0
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TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES |
IEC 61191-1 : 2.0
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PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC PAS 60747-17 : 1.0
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SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION |
I.S. EN 60068-2-54:2006
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ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
IEC 60115-1 : 4.0
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FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 61188-5-8:2008
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA) |
IEC 60393-1 : 3.0
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POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60115-1:2011
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FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
EN 61760-4 : 2015 AMD 1 2018
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SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018) |
I.S. EN 61188-5-4:2007
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
I.S. EN 61760-1:2006
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SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
I.S. EN 61191-2:2017
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PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
EN 140401-803 : 2007 AMD 3 2017
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DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
EN 140401-804 : 2011 AMD 1 2013
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DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
EN 60747-5-5 : 2011 AMD 1 2015
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SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS (IEC 60747-5-5:2007/A1:2013) |
EN 140401-801 : 2007 AMD 1 2013
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DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
EN 60384-24 : 2015 COR 2017
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FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE (IEC 60384-24:2015/COR1:2016) |
EN 61191-2 : 2017
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PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017) |
EN 60539-1 : 2016 COR 2017
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DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017) |
EN 60115-1 : 2011 AMD 11 2015
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FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
BS PD IEC TS 62861 : 2017
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GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TESTING FOR LED LIGHT SOURCES AND LED LUMINAIRES |
BS EN 61191-3 : 2017
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PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017) |
BS EN 61189-5-1 : 2016
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES |
IEC 62211 :2017
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INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
IEC 61810-7 : 2.0
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ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
IEC 60512-12-1 : 1.0
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CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD |
IEC 62326-20 : 1ED 2016
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PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS |
16/30350012 DC : 0
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BS EN 60810 - LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
IEC 60738-1 : 3.1
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THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
BS EN 61188-5-6 : 2003
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PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-6: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES |
IEC 60384-3 : 4.0
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FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) ELECTROLYTE |
IEC 62604-1 : 1ED 2015
|
SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
IEC 60368-1 : 4.1
|
PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 61191-4 : 2017
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PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES (IEC 61191-4:2017) |
IEC 60127-4 : 3.2
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MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
IEC 60384-24 : 2.0
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FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - FIXED TANTALUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
IEC 60539-2 : 1.1
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
IEC 60512-12-3 : 1.0
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING |
IEC 60393-6 : 2.0
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POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS |
IEC 60068-2-21 : 6.0
|
ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
IEC 61191-2 : 3.0
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PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
IEC 62137 : 1.0
|
ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FGBA, BGA, FLGA, LGA, SON AND QFN |
IEC 60738-1-3 : 2.0
|
THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-3: BLANK DETAIL SPECIFICATION - INRUSH CURRENT APPLICATION - ASSESSMENT LEVEL EZ |
IEC 61338-2 : 1.0
|
WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDELINES FOR OSCILLATOR AND FILTER APPLICATIONS |
IEC 61191-4 : 2.0
|
PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
BS EN 61191-1 : 2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 61188-5-3 : 1.0
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES |
BS EN 61188-5-2 : 2003
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PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
IEC 60068-2-54 : 2.0
|
ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
IEC TS 62861 : 1ED 2017
|
GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TESTING FOR LED LIGHT SOURCES AND LED LUMINAIRES |
IEC 60747-5-5 : 1.1
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS |
IEC 61188-5-4 : 1.0
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
IEC 62878-1-1 : 1ED 2015
|
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
15/30327712 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
EN 60512-12-3 : 2006 COR 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING |
IEC 60384-1 : 5.0
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 61189-5-1 : 1ED 2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES |
IEC 60384-25 : 2.0
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
11/30255124 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 61020-1 : 2.0
|
ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 61188-5-8 : 1.0
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA) |
IEC 60384-18 : 3.0
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE |
IEC 60738-1-4 : 2.0
|
THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-4: BLANK DETAIL SPECIFICATION - SENSING APPLICATION - ASSESSMENT LEVEL EZ |
IEC 61747-1 : 1.1
|
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |
IEC 61192-1 : 1.0
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL |
IEC 60862-1 : 3.0
|
SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
IEC 61248-1 : 1.0
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 60512-16-21 : 1.0
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
IEC 60738-1-1 : 3.0
|
THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-1: BLANK DETAIL SPECIFICATION - CURRENT LIMITING APPLICATION - ASSESSMENT LEVEL EZ |
IEC 60068-2-20 : 5.0
|
ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
IEC 61189-3-719 : 1ED 2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING |
IEC 60384-21 : 2.0
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1 |
IEC 62391-1 : 2.0
|
FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 61019-1 : 1.0
|
SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION |
IEC 60068-3-13 : 1ED 2016
|
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
IEC 61188-5-5 : 1.0
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES |
IEC 61338-1 : 1.0
|
WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
BS EN 140402-801 : 2015
|
DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
IEC 61188-5-2 : 1.0
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
IEC 60384-22 : 2.0
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2 |
IEC 62674-1 : 1.0
|
HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT |
IEC 61760-1 : 2.0
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
IEC 60068-2-82 : 1.0
|
ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST XW[1]: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
IEC 61191-3 : 2.0
|
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
IEC 62025-2 : 1.0
|
HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
IEC 60738-1-2 : 2.0
|
THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-2: BLANK DETAIL SPECIFICATION - HEATING ELEMENT APPLICATION - ASSESSMENT LEVEL EZ |
IEC 61337-2 : 1.0
|
FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE |
IEC 60512-12-4 : 1.0
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
IEC 62137-4 : 1ED 2014
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
IEC 61337-1 : 1.0
|
FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
IEC 60068-2-83 : 1.0
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
IEC 62575-1 : 1ED 2015
|
RADIO FREQUENCY (RF) BULK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
EN 140401-804 : 2011 AMD 1 2013
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
EN 61007 : 1997
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES |
EN 61760-1 : 2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |