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  • IEC 60068-2-58:2015+AMD1:2017 CSV

    Current The latest, up-to-date edition.

    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English, English - French

    Published date:  28-07-2017

    Publisher:  International Electrotechnical Committee

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    Abstract - (Show below) - (Hide below)

    IEC 60068-2-58:2015+A1:2017 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. This edition includes the following significant technical changes with respect to the previous edition:
    - the addition of Sn-Bi low temperature solder alloy;
    - the addition of several reflow test conditions in Table 7 - Resistance to soldering heat - Test conditions and severity, reflow method;
    - introduction of reflow test method for Test Td3: Dewetting and resistance to dissolution of metallization;
    - implementation of guidance for the choice of a test severity in Clause B.3.
    This consolidated version consists of the fourth edition (2015) and its amendment 1 (2017). Therefore, no need to order amendment in addition to this publication.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Stability Date: 2022. (08/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

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    BS EN 60862-1:2015 Surface acoustic wave (SAW) filters of assessed quality Generic specification
    BS EN 62137-4:2014 Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
    16/30353588 DC : 0 BS EN 61020-1 ED 3.0 - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 61188-5-5:2007 Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
    NF EN 60393-5 : 2016 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 5: SECTIONAL SPECIFICATION - SINGLE-TURN ROTARY LOW-POWER WIREWOUND AND NONWIREWOUND POTENTIOMETERS
    02/206181 DC : DRAFT MAY 2002 IEC 61019-1. ED.1 - SURFACE ACOUSTIC WAVE RESONATORS (SAW) OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    BS EN 170000:1999 Harmonized system of quality assessment for electronic components. Generic specification: waveguide type dielectric resonators
    12/30258507 DC : 0 BS EN 62575-1 - RADIO FREQUENCY (RF) BUK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    05/30138794 DC : DRAFT SEP 2005
    17/30357139 DC : 0 BS EN 61760-4 + A1 - SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
    NF EN 60512-16-21 : 2012 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES
    BS EN 62575-1:2016 Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality Generic specification
    I.S. EN 62604-1:2015 SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    DSCC 09024 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0402
    15/30325282 DC : 0 BS EN 62884-1 - MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELETIRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT
    BS EN 171000:2001 Harmonized system of quality assessment for electronic components. Generic specification. Filters using waveguide type dielectric resonators
    BS EN 61338-2:2004 Waveguide type dielectric resonators Guidelines for oscillator and filter applications
    I.S. EN 61188-5-2:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    10/30240248 DC : 0 BS EN 60862-1 - SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    BS EN 61248-1:1997 Transformers and inductors for use in electronic and telecommunication equipment Generic specification
    BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies General
    DSCC 09027 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 1210
    BS EN 60539-1:2016 Directly heated negative temperature coefficient thermistors Generic specification
    04/30112662 DC : DRAFT APR 2004 IEC 61810-7 ED.2 - ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES
    14/30315320 DC : 0 BS EN 60384-15 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 15: SECTIONAL SPECIFICATION: FIXED TANTALUM CAPACITORS WITH NON-SOLID OR SOLID ELECTROLYTE
    BS EN 60738-1-2:2008 Thermistors. Directly heated positive step-function temperature coefficient Blank detail specification. Heating element application. Assessment level EZ
    BS EN 62884-1:2017 Measurement techniques of piezoelectric, dielectric and electrostatic oscillators Basic methods for the measurement
    NF EN 60384-1 : 2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    03/104227 DC : DRAFT MAY 2003 IEC 60393-6 ED.1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS
    06/30155911 DC : DRAFT SEP 2006 BS EN 140401-801 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    17/30355848 DC : 0 BS EN 60384-22 ED.3.0 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2
    BS EN 60384-1:2016 Fixed capacitors for use in electronic equipment Generic specification
    02/206102 DC : DRAFT MAY 2002 IEC 60384-21, ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC - CLASS 1 - ASSESSMENT LEVEL EZ
    05/30132097 DC : DRAFT JUNE 2005 IEC 60679-1 ED 3 - QUARTZ CRYSTAL CONTROLLED OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    BS EN 61051-1:2008 Varistors for use in electronic equipment Generic specification
    I.S. EN 60384-18:2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE
    BS EN 60738-1-1:2008 Thermistors. Directly heated positive step-function temperature coefficient Blank detail specification. Current limiting application. Assessment level EZ
    CEI EN 60068-2-21 : 2006 ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
    DSCC 11018 : 0 INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0603
    NF EN 62674-1 : 2013 HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT
    CEI EN 62211 : 2005 INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
    CEI EN 61760-1 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    I.S. EN 61051-1:2008 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 61810-7:2006 ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES
    I.S. EN 60738-1-4:2008 THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-4: BLANK DETAIL SPECIFICATION - SENSING APPLICATION - ASSESSMENT LEVEL EZ
    OVE/ONORM EN 61051-1 : 2009 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 140402-801:2015 DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
    IEC 62391-1:2015 Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification
    I.S. EN 62575-1:2016 RADIO FREQUENCY (RF) BULK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    I.S. EN 60539-1:2016 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
    I.S. EN 61248-1:1998 TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION
    EN 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    NF EN 62391-1 : 2018 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    PD IEC/TS 62861:2017 Guidelines for principal component reliability testing for LED light sources and LED luminaires
    BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    IEC 62211:2017 Inductive components - Reliability management
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
    EN 60738-1-3:2008 Thermistors - Directly heated positive step-function temperature coefficient - Part 1-3: Blank detail specification - Inrush current application - Assessment level EZ
    EN 60738-1-1:2008 Thermistors - Directly heated positive step-function temperature coefficient - Part 1-1: Blank detail specification - Current limiting application - Assessment level EZ
    IEC 60384-1:2016 RLV Fixed capacitors for use in electronic equipment - Part 1: Generic specification
    EN 60384-22:2012 Fixed capacitors for use in electronic equipment - Part 22: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2
    EN 61337-1:2004 Filters using waveguide type dielectric resonators - Part 1: Generic specification
    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    EN 60738-1-2:2008 Thermistors - Directly heated positive step-function temperature coefficient - Part 1-2: Blank detail specification - Heating element application - Assessment level EZ
    EN 61019-1 : 2005 Surface acoustic wave (SAW) resonators - Part 1: Generic specification
    EN 60384-18:2016 Fixed capacitors for use in electronic equipment - Part 18: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) and non-solid electrolyte
    EN 140402-801:2015 Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2
    EN 60384-3:2016 Fixed capacitors for use in electronic equipment - Part 3: Sectional specification - Surface mount fixed tantalum electrolytic capacitors with solid (MnO2) electrolyte
    EN 60127-4:2005/A2:2013 Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
    EN 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
    EN 60539-2:2004/A1:2010 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS
    EN 60738-1-4:2008 Thermistors - Directly heated positive step-function temperature coefficient - Part 1-4: Blank detail specification - Sensing application - Assessment level EZ
    EN 60068-2-44:1995 Environmental testing - Part 2: Tests - Guidance on Test T: Soldering
    EN 61051-1:2008 Varistors for use in electronic equipment - Part 1: Generic specification
    NF EN 62025-2 : 2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
    EN 60738-1:2006/A1:2009 THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
    EN 62604-1:2015 Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 1: Generic specification
    EN 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
    EN 62137:2004/corrigendum:2005 ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
    EN 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    EN 140401:2009 Blank Detail Specification: Fixed low power film surface mount (SMD) resistors
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    EN 140402:2015/A1:2016 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    EN 62674-1 : 2012 HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT (IEC 62674-1:2012)
    EN 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
    EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    A-A-59532-1 Revision A:2006 FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 63 VOLTS (V) AC/DC, QUICK ACTING
    A-A-59532-6 Revision A:2006 FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 250 VOLTS (V) AC/DC, TIME DELAY
    A-A-59532-4 Revision A:2006 FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 125 VOLTS (V) AC/DC, QUICK ACTING, HIGH BREAKING CAPACITY, WITH A FUSEHOLDER, BLOCK
    A-A-59532-3 Revision A:2006 FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 125 VOLTS (V) AC/DC, QUICK ACTING, HIGH BREAKING CAPACITY
    A-A-59532-5 Revision A:2006 FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 250 VOLTS (V) AC/DC, QUICK ACTING
    A-A-59532-2 Revision A:2006 FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 63 VOLTS (V) AC/DC, QUICK ACTING WITH FUSEHOLDER, BLOCK
    BS EN 61337-1:2004 Filters using waveguide type dielectric resonators Generic specification
    I.S. EN IEC 60810:2018 LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
    CEI EN 60512-12-3 : 2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING
    10/30237986 DC : 0 BS EN 140401-804 - DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    09/30214333 DC : 0 BS EN 60384-22 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION: FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2
    06/30157868 DC : 0 BS EN 60393-1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    DSCC 09023 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0201
    NF EN 61189-3-719 : 2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING
    12/30252220 DC : DRAFT MAR 2012 BS EN 62604-1 - SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS - PART 1: GENERIC SPECIFICATION
    BS EN 60384-21:2012 Fixed capacitors for use in electronic equipment Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1
    BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
    BS EN 60115-8:2012 Fixed resistors for use in electronic equipment Sectional specification. Fixed surface mount resistors
    15/30332490 DC : 0 BS EN 62211 - INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
    I.S. EN 60384-25:2015 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
    BS EN 62211:2004 Inductive components. Reliability management
    07/30165180 DC : 0 BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE
    BS EN 60512-12-1:2006 Connectors for electronic equipment. Tests and measurements Soldering tests - Test 12a. Solderability, wetting, solder bath method
    05/30129049 DC : DRAFT FEB 2005 IEC 62025-2 - HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
    03/103741 DC : DRAFT FEB 2003 IEC 61338-1 ED.1 - WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    BS EN 61810-7:2006 Electromechanical elementary relays Test and measurement procedures
    I.S. EN 60738-1-1:2008 THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-1: BLANK DETAIL SPECIFICATION - CURRENT LIMITING APPLICATION - ASSESSMENT LEVEL EZ
    07/30161526 DC : 0 BS EN 60115-8 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
    CSA E60384.1 : 2014 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 60068-2-83:2011 Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
    BS EN 60738-1-3:2008 Thermistors. Directly heated positive step-function temperature coefficient Blank detail specification. Inrush current application. Assessment level EZ
    BS EN 60747-5-5 : 2011 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS
    NF EN 61020-1 : 2009 ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    02/206104 DC : DRAFT MAY 2002 IEC 60384-22, ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC - CLASS 2 - ASSESSMENT LEVEL EZ
    IEC 61051-1:2007 Varistors for use in electronic equipment - Part 1: Generic specification
    BS EN 62674-1:2012 High frequency inductive components Fixed surface mount inductors for use in electronic and telecommunication equipment
    09/30186180 DC : 0 BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    09/30207307 DC : 0 BS EN 60115-2 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: FIXED LOW-POWER NON-WIREWOUND RESISTORS
    I.S. EN 61337-1:2005 FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION
    I.S. EN 60384-21:2012 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1 (IEC 60384-21:2011 (EQV))
    CEI EN 60393-1 : 2010 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 60115-8-1:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    I.S. EN 60384-1:2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    IEC 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
    IEC 60115-8-1:2014 Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
    IEC 60068-2-44:1995 Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
    IEC 60384-1 REDLINE : 5ED 2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 140402:2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    IEC TR 60068-3-12:2014 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
    CEI EN 60384-21 : 2013 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1
    CEI EN 60512-12-1 : 2007 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD
    I.S. EN 61019-1:2005 SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION
    I.S. EN 140401-802:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    EN 62884-1:2017 Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement
    I.S. EN 60115-8:2012 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD))
    I.S. EN 60512-12-1:2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING,
    I.S. EN 62674-1:2012 HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT (IEC 62674-1:2012 (EQV))
    IEC 62884-1:2017 Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement
    BS EN 60539-2 : 2004 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS
    I.S. EN 60068-2-82:2007 ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS
    I.S. EN 140401:2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    BS EN 60127-4 : 2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
    I.S. EN 60068-2-83:2011 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV))
    IEC 60539-1:2016 Directly heated negative temperature coefficient thermistors - Part 1: Generic specification
    I.S. EN 60384-22:2012 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2 (IEC 60384-22:2011 (EQV))
    I.S. EN 60512-12-4:2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD
    CEI EN 60384-22 : 2013 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2
    I.S. EN 60393-6:2016 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS
    I.S. EN 61189-3-719:2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING
    I.S. EN 60368-1:2000 PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    EN 60384-25:2015 Fixed capacitors for use in electronic equipment - Part 25: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with conductive polymer solid electrolyte
    I.S. EN 61188-5-4:2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
    I.S. EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 62137:2004 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
    IEC 60738-1-3:2008 Thermistors - Directly heated positive step-function temperature coefficient - Part 1-3: Blank detail specification - Inrush current application - Assessment level EZ
    IEC 61338-2:2004 Waveguide type dielectric resonators - Part 2: Guidelines for oscillator and filter applications
    I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
    EN 61760-3:2010 Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
    OVE/ONORM EN 61760-1 : 2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    CEI EN 60068-3-13 : 1ED 2017 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
    BS EN 60738-1-4:2008 Thermistors. Directly heated positive step-function temperature coefficient Blank detail specification. Sensing application. Assessment level EZ
    BS EN 60393-6:2016 Potentiometers for use in electronic equipment Sectional specification. Surface mount preset potentiometers
    BS EN 62137:2004 Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
    BS EN 61811-1:2015 Electromechanical telecom elementary relays of assessed quality Generic specification and blank detail specification
    13/30287806 DC : 0 BS EN 60539-1 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
    07/30162213 DC : 0 BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
    06/30153438 DC : DRAFT JULY 2006 BS IEC 60539-1 ED.2 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORES - PART 1: GENERIC SPECIFICATION
    CEI EN 62421 : 2008 ELECTRONICS ASSEMBLY TECHNOLOGY - ELECTRONIC MODULES
    11/30252855 DC : 0 BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING
    CEI EN 60115-8-1 : 2016 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    14/30312344 DC : 0 PD IEC/PAS 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
    97/231700 DC : DRAFT DEC 1997 IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    13/30289547 DC : 0 BS EN 60384-18 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO2) AND NON-SOLID ELECTROLYTE
    NF EN 60068-2-83 : 2012 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
    BS EN 61019-1:2005 Surface acoustic wave (SAW) resonators Generic specification
    DSCC 11017 : 0 INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0402
    DSCC 11019 : 0 INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0805
    BS EN 140401-801 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    BS EN 140401-803 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    04/30113172 DC : DRAFT MAY 2004 IEC 60384-24 ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
    I.S. EN 61337-2:2004 FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE
    BS EN 60068-2-54:2006 Environmental testing Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    BS EN 62025-2:2005 High frequency inductive components. Non-electrical characteristics and measuring methods Test methods for non-electrical characteristics
    BS EN 60368-1:2000 Piezoelectric filters Generic specification
    09/30209389 DC : 0 BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E
    CEI EN 60368-1 : 2006 PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    BS EN 61188-5-4:2007 Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
    17/30355844 DC : DRAFT JUL 2017 BS EN 60384-21 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1
    I.S. EN 61188-5-3:2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
    BS EN 61760-1:2006 Surface mounting technology Standard method for the specification of surface mounting components (SMDs)
    BS EN 61760-3:2010 Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering
    BS EN 61338-1:2005 Waveguide type dielectric resonators Generic specification
    09/30214329 DC : 0 BS EN 60384-21 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION: FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1
    BIS IS/IEC 60862-1 : 2003 SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    BS EN 61188-5-8:2008 Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
    04/30113200 DC : DRAFT MAY 2004 IEC 60384-25 ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
    BS EN 60512-16-21:2012 Connectors for electronic equipment. Tests and measurements Mechanical tests on contacts and terminations. Test 16u. Whisker test via the application of external mechanical stresses
    BS EN 60384-25:2015 Fixed capacitors for use in electronic equipment Sectional specification. Surface mount fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte
    16/30338234 DC : 0 BS EN 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
    06/30155905 DC : DRAFT SEP 2006 BS EN 140401-803 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    15/30329267 DC : 0 BS EN 60747-17 - SEMICONDUCTOR DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION
    14/30317306 DC : 0 BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    BS EN 60512-12-3:2006 Connectors for electronic equipment. Tests and measurements Soldering tests - Solderability, de-wetting
    CEI EN 62884-1 : 1ED 2018 MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT
    DSCC 09026 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0805
    IEC 61338-1-2:1998 Waveguide type dielectric resonators - Part 1-2: General information and test conditions - Test conditions
    BS EN 60115-1 : 2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    IEC 61760-4:2015 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
    BS EN 140402 : 2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    I.S. EN 140401-804:2011 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    I.S. EN 61188-5-6:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
    BS EN 60384-24:2015 Fixed capacitors for use in electronic equipment Sectional specification. Surface mount fixed tantalum electrolytic capacitors with conductive polymer solid electrolyte
    I.S. EN 60384-24:2015 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
    I.S. EN 61338-1:2005 WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION
    BS EN 140401-804 : 2011 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    I.S. EN 60512-12-3:2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING
    BS EN 140401:2009 Blank Detail Specification. Fixed low power film surface mount (SMD) resistors
    NF EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    I.S. EN 62884-1:2017 MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT
    I.S. EN 62211:2017 INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
    CEI EN 60068-2-83 : 2012 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
    NF EN 60393-6 : 2016 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS
    I.S. EN 60393-1:2009 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    IEC PAS 60747-17:2011 Semiconductor devices - Discrete devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation
    I.S. EN 60068-2-54:2006 ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
    IEC 60115-1:2008 Fixed resistors for use in electronic equipment - Part 1: Generic specification
    I.S. EN 61188-5-8:2008 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
    IEC 60393-1:2008 Potentiometers for use in electronic equipment - Part 1: Generic specification
    I.S. EN 60115-1:2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
    EN 61760-4:2015/A1:2018 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018)
    NF EN 60539-2 : 2005 AMD 1 2011 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS
    IEC 60368-1:2000+AMD1:2004 CSV Piezoelectric filters of assessed quality - Part 1: Genericspecification
    BS EN 61191-4:2017 Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
    IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types
    IEC 60384-24:2015 Fixed capacitors for use in electronic equipment - Part 24: Sectional specification - Fixed tantalum electrolytic surface mount capacitors with conductive polymer solid electrolyte
    IEC 60539-2:2003+AMD1:2010 CSV Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors
    IEC 60512-12-3:2006 Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting
    IEC 60393-6:2015 Potentiometers for use in electronic equipment - Part 6: Sectional specification - Surface mount preset potentiometers
    IEC 62137-4:2014 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
    IEC 61337-1:2004 Filters using waveguide type dielectric resonators - Part 1: Generic specification
    IEC 60068-2-83:2011 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
    IEC 62575-1:2015 Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality - Part 1: Generic specification
    EN 140401-804:2011/A1:2013 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    EN 61007:1997 Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures
    EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    IEC 61811-1:2015 Electromechanical telecom elementary relays of assessed quality - Part 1: Generic specification and blank detail specification
    02/203178 DC : 0 PREN 140101-806 - DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE WOUND RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS - ASSESSMENT LEVEL Z - VERSION A: WITH 100-%-TEST - VERSION E: WITH FAILURE RATE LEVEL AND 100-%-TEST - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    I.S. EN 61188-5-5:2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
    BS EN 62604-1:2015 Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality Generic specification
    12/30260802 DC : 0 BS EN 62391-1 - FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    07/30149142 DC : 0 BS IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    NF EN 60115-8 : 2013 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
    NF EN 61051-1 : 2013 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    DSCC 09025 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0603
    03/103740 DC : DRAFT FEB 2003 IEC 61337-1 ED.1 - FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    12/30260691 DC : 0 BS EN 60384-24 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
    14/30280850 DC : 0 BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    08/30186808 DC : DRAFT JULY 2008 BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS
    BS EN 60068-3-13:2016 Environmental testing Supporting documentation and guidance on Test T. Soldering
    BS EN 140401-802 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    CEI EN 60384-18 : 2007 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE
    EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    BS PD ISO/IEC PAS 60127-8 : 2014 MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
    13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
    BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
    BS EN 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
    CEI EN 61051-1 : 2010 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 61007:1997 Transformers and inductors for use in electronic and telecommunication equipment. Measuring methods and test procedures
    BS EN 60115-8-1:2015 Fixed resistors for use in electronic equipment Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
    12/30260721 DC : 0 BS EN 60384-25 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
    06/30149145 DC : DRAFT OCT 2006 IEC 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 60068-2-82:2007 Environmental testing Tests. Test Tx. Whisker test methods for electronic and electric components
    BS EN 61337-2:2004 Filters using waveguide type dielectric resonators Guide for use
    BS EN 60122-1 : 2002 QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    BS EN 60384-18:2016 Fixed capacitors for use in electronic equipment Sectional specification. Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) and non-solid electrolyte
    BS EN 60068-2-20:2008 Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads
    BS EN 61760-4 : 2015 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
    I.S. EN 60539-2:2004 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS
    I.S. EN 62326-20:2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
    NF EN 60384-18 : 2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE
    I.S. EN 60738-1:2006 THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 62137:2005 ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
    IEC 62391-1:2015 RLV Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification
    EN IEC 60810:2018 Lamps, light sources and led packages for road vehicles - Performance requirements
    I.S. EN 61760-3:2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    I.S. EN 60068-3-13:2016 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
    I.S. EN 60068-2-20:2008 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    I.S. EN 60747-5-5:2011 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS
    CEI EN 60068-2-54 : 2007 ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
    I.S. EN 60512-16-21:2012 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES (IEC 60512-16-21:2012 (EQV))
    EN 140401-802:2007/A3:2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    EN 60384-1:2016 Fixed capacitors for use in electronic equipment - Part 1: Generic specification
    CEI EN 61810-7 : 2006 ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES
    IEC 61337-1-2:1999 Filters using waveguide type dielectric resonators - Part 1-2: Test conditions
    I.S. EN 61020-1:2009 ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 140401-803:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    I.S. EN 62391-1:2016 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    IEC 61007:1994 Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    EN 60539-1:2016/AC:2017-09 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017)
    EN 60115-1:2011/A11:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    16/30350012 DC : 0 BS EN 60810 - LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
    IEC 60738-1:2006+AMD1:2009 CSV Thermistors - Directly heated positive temperature coefficient -Part 1: Generic specification
    BS EN 61188-5-6:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
    IEC 60384-3:2016 Fixed capacitors for use in electronic equipment - Part 3: Sectional specification - Surface mount fixed tantalum electrolytic capacitors with solid (MnO2) electrolyte
    IEC 62604-1:2015 Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 1: Generic specification
    IEC 60747-5-5:2007+AMD1:2013 CSV Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
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    IEC 61188-5-8:2007 Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
    IEC 60384-18:2016 Fixed capacitors for use in electronic equipment - Part 18: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) and non-solid electrolyte
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    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
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    IEC 61248-1:1996 Transformers and inductors for use in electronic and telecommunication equipment - Part 1: Generic specification
    IEC 60512-16-21:2012 Connectors for electronic equipment - Tests and measurements - Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stresses
    IEC 60738-1-1:2008 Thermistors - Directly heated positive step-function temperature coefficient - Part 1-1: Blank detail specification - Current limiting application - Assessment level EZ
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    IEC 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
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    IEC 61019-1:2004 Surface acoustic wave (SAW) resonators - Part 1: Generic specification
    IEC 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
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    IEC 61338-1:2004 Waveguide type dielectric resonators - Part 1: Generic specification
    BS EN 140402-801:2015 Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2
    IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    IEC 60384-22:2011 Fixed capacitors for use in electronic equipment - Part 22: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2
    IEC 62674-1:2012 High frequency inductive components - Part 1: Fixed surface mount inductors for use in electronic and telecommunication equipment
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    IEC 60068-2-82:2007 Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    IEC 62025-2:2005 High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics
    IEC 60738-1-2:2008 Thermistors - Directly heated positive step-function temperature coefficient - Part 1-2: Blank detail specification - Heating element application - Assessment level EZ
    IEC 61337-2:2004 Filters using waveguide type dielectric resonators - Part 2: Guidance for use
    IEC 60512-12-4:2006 Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method
    EN 61811-1:2015 Electromechanical telecom elementary relays of assessed quality - Part 1: Generic specification and blank detail specification
    EN 61337-2:2004 Filters using waveguide type dielectric resonators - Part 2: Guidance for use
    EN 60862-1:2015 Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification
    I.S. EN 61007:1998 TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES
    10/30237992 DC : DRAFT NOV 2010 BS IEC 60393-6 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS
    BS EN 60512-12-4:2006 Connectors for electronic equipment. Tests and measurements Soldering tests. Test 12d. Resistance to soldering heat, solder bath method
    I.S. EN 60738-1-3:2008 THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-3: BLANK DETAIL SPECIFICATION - INRUSH CURRENT APPLICATION - ASSESSMENT LEVEL EZ
    BS EN 60738-1 : 2006 THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
    09/30210454 DC : DRAFT SEP 2009 BS EN 60512-16-21 - CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES
    BS 9752:1989 Blank detail specification for fixed insulated (unshielded) r.f. inductors suitable for surface mounting at the full assessment level
    BS EN 60384-22:2012 Fixed capacitors for use in electronic equipment Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2
    DD IEC/PAS 60747-17:2011 Semiconductor devices. Discrete devices Magnetic and capacitive coupler for basic and reinforced isolation
    12/30271778 DC : 0 BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
    11/30243576 DC : DRAFT FEB 2011 BS EN 62643-1 - ELECTROSTATIC MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    I.S. EN 62137-4:2014 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
    BS EN 62421:2007 Electronics assembly technology. Electronic modules
    CEI EN 62391-1 : 2016 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 60393-1:2009 Potentiometers for use in electronic equipment Generic specification
    CEI EN 60068-2-82 : 2008 ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS
    CEI EN 140401 : 2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    12/30261600 DC : DRAFT MAR 2012 BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
    CEI EN 60115-8 : 2013 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
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    10/30219044 DC : 0 BS EN 62674-1 - HIGH FREQUENCY INDUCTIVE COMPONENTS - FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT
    13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
    IEEE C62.33-1982 IEEE Standard Test Specifications for Varistor Surge-Protective Devices
    I.S. EN 62025-2:2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
    PD IEC/TR 60068-3-12:2014 Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
    BS EN 60384-3:2006 Fixed capacitors for use in electronic equipment Sectional specification: Surface mount fixed tantalum electrolytic capacitors with manganese dioxide solid electrolyte
    I.S. EN 60068-2-44:1997 ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING
    BS EN 61188-5-3:2007 Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides
    CEI EN 60539-1 : 2009 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
    IEC 60115-8:2009 Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
    I.S. EN 60127-4:2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV))
    I.S. EN 60384-3:2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) ELECTROLYTE
    I.S. EN 60122-1:2002 AMD 1 2018 QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    I.S. EN 60862-1:2015 SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    I.S. EN 61811-1:2015 ELECTROMECHANICAL TELECOM ELEMENTARY RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION
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    I.S. EN 61760-4:2015 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
    BS EN 60068-2-21:2006 Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
    I.S. EN 60068-2-21:2006 ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
    NF EN 60127-4 : 2005 AMD 2 2013 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
    CEI EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    CEI EN 60512-16-21 : 2013 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES
    CEI EN 60512-12-4 : 2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS -PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD
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    I.S. EN 60738-1-2:2008 THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-2: BLANK DETAIL SPECIFICATION - HEATING ELEMENT APPLICATION - ASSESSMENT LEVEL EZ
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    I.S. EN 140401-801:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    IEC 60300-3-5:2001 Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles
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    IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
    BS EN 61188-5-2:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    IEC TS 62861:2017 Guidelines for principal component reliability testing for LED light sources and LED luminaires
    EN 61188-5-8:2008 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
    EN 62211:2017 Inductive components - Reliability management
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    EN 61248-1 : 1997 Transformers and inductors for use in electronic and telecommunication equipment - Part 1: Generic specification
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
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    EN 60068-2-83 : 2011 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011)
    EN 61810-7:2006 Electromechanical elementary relays - Part 7: Test and measurement procedures
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    EN 62137-4:2014/AC:2015 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)
    EN 60384-21:2012 Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1
    EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    EN 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    OVE/ONORM EN 62025-2 : 2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
    EN 60512-12-4:2006/corrigendum:2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD
    EN 60068-2-82:2007 Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
    EN 60115-8-1:2015 Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
    EN 62391-1:2016/AC:2016-12 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 62391-1:2015/COR1:2016)
    EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
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    EN 61338-1:2005 Waveguide type dielectric resonators - Part 1: Generic specification
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    EN 62025-2:2005 High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics
    EN 60393-1:2009 Potentiometers for use in electronic equipment - Part 1: Generic specification
    EN 60512-16-21:2012 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES
    EN 61020-1:2009 Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    ISO 9454-2:1998 Soft soldering fluxes Classification and requirements Part 2: Performance requirements
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    IEC 61760-4:2015 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
    IEC TR 60068-3-12:2014 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
    IEC 61760-3:2010 Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    IEC 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61249-2-35:2008 Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 61249-2-22:2005 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
    IPC J STD 075 : 0 CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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