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  • IEC 60068-2-69:2017

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  25-06-2019

    Language(s): 

    Published date:  07-03-2017

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General description of the method
    5 Description of the test apparatus
    6 Preparation of specimens
    7 Materials
    8 Procedure
    9 Presentation of results
    10 Information to be given in the relevant specification
    Annex A (normative) - Equipment specification
    Annex B (informative) - Use of the wetting balance for
            SMD solderability testing
    Annex C (normative) - Test methods for SMD components
            sizes 0603M (0201) or smaller
    Annex D (informative) - Evaluation criteria - Guidance
    Annex E (informative) - Method of calculating the
            maximum theoretical force and integrated value
            of the area of the wetting curve for leaded non-SMD
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.



    The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.



    This document provides the measurement procedures for solder alloys both with and without lead (Pb).



    This edition includes the following significant technical changes with respect to the previous edition:



    - integration of IEC 60068-2-54;



    - inclusion of tests of printed boards;



    - inclusion of new component types, and updating test parameters for the whole component list;



    - inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.



    The contents of the corrigendum of January 2018 have been included in this copy.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Supersedes IEC 60068-2-54. Stability Date: 2024. (03/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61051-1:2008 Varistors for use in electronic equipment Generic specification
    BS EN 60539-1:2016 Directly heated negative temperature coefficient thermistors Generic specification
    NF EN 60384-1 : 2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 60384-1:2016 Fixed capacitors for use in electronic equipment Generic specification
    OVE/ONORM EN 61051-1 : 2009 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 61051-1:2008 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 60749-21:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
    IEC 62391-1:2015 RLV Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification
    IEC 62391-1:2015 Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification
    NF EN 62391-1 : 2018 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    IEC 60384-1:2016 RLV Fixed capacitors for use in electronic equipment - Part 1: Generic specification
    EN 60749-21:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
    EN 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
    NF EN 62025-2 : 2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
    EN 61051-1:2008 Varistors for use in electronic equipment - Part 1: Generic specification
    11/30243259 DC : 0 BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    CSA E60384.1 : 2014 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 60115-1 : 2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 60068-2-83:2011 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV))
    IEC 60539-1:2016 Directly heated negative temperature coefficient thermistors - Part 1: Generic specification
    I.S. EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    CEI EN 60068-3-13 : 1ED 2017 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
    13/30287806 DC : 0 BS EN 60539-1 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
    11/30252855 DC : 0 BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING
    05/30129049 DC : DRAFT FEB 2005 IEC 62025-2 - HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
    BS EN 60068-2-54:2006 Environmental testing Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    BS EN 61760-1:2006 Surface mounting technology Standard method for the specification of surface mounting components (SMDs)
    I.S. EN 60384-1:2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    CEI EN 60068-2-83 : 2012 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
    I.S. EN 60068-2-54:2006 ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
    IEC 61051-1:2007 Varistors for use in electronic equipment - Part 1: Generic specification
    I.S. EN 60115-1:2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
    IEC 60068-2-83:2011 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
    EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    14/30280850 DC : 0 BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 60068-3-13:2016 Environmental testing Supporting documentation and guidance on Test T. Soldering
    EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
    I.S. EN 62025-2:2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
    CEI EN 61051-1 : 2010 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 62025-2:2005 High frequency inductive components. Non-electrical characteristics and measuring methods Test methods for non-electrical characteristics
    BS EN 60068-2-20:2008 Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads
    I.S. EN 60068-3-13:2016 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
    I.S. EN 60068-2-20:2008 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    CEI EN 60068-2-54 : 2007 ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
    EN 60384-1:2016 Fixed capacitors for use in electronic equipment - Part 1: Generic specification
    IEC 60300-3-5:2001 Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles
    I.S. EN 62391-1:2016 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    EN 60539-1:2016/AC:2017-09 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017)
    EN 60115-1:2011/A11:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    IEC 60384-1:2016 Fixed capacitors for use in electronic equipment - Part 1: Generic specification
    IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 62391-1 : 2.0 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    IEC 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    IEC 62025-2:2005 High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics
    BS EN 60068-2-58 : 2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
    BS EN 60749-21:2011 Semiconductor devices. Mechanical and climatic test methods Solderability
    CEI EN 60539-1 : 2009 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
    CEI EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    I.S. EN 60068-2-58:2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    IEC 60384-1 REDLINE : 5ED 2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 60539-1:2016 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    EN 60068-2-83 : 2011 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011)
    EN 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    OVE/ONORM EN 62025-2 : 2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
    EN 60068-2-58:2015/A1:2018 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017)
    EN 62391-1:2016/AC:2016-12 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 62391-1:2015/COR1:2016)
    EN 62025-2:2005 High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
    IEC 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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