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  • IEC 60191-2:2012 DB

    Current The latest, up-to-date edition.

    Mechanical standardization of semiconductor devices - Part 2: Dimensions

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s): 

    Published date:  21-09-2012

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    PREFACE
    Chapter 00 - PHILOSOPHY OF MECHANICAL STANDARDIZATION
    Chapter 0 - RECOMMENDED VALUES FOR CERTAIN DIMENSIONS
                OF DRAWINGS OF SEMICONDUCTOR DEVICES
    Chapter I - DEVICE OUTLINE DRAWINGS - TYPES OF SEMICONDUCTOR
                DEVICES GENERALLY MOUNTED IN THE PACKAGES OF
                CHAPTER I
    Chapter II - BASE DRAWINGS
    Chapter III - CASE OUTLINE DRAWINGS
    Chapter IV - GAUGE DRAWINGS
    Chapter V - TABLES SHOWING ASSOCIATIONS BETWEEN CASE OUTLINES
                AND BASES
    OBSOLETE DRAWINGS -
    ADDITIONS TO THE LISTS OF NATIONAL CODES APPEARING ON THE
    STANDARD SHEETS OF IEC PUBLICATION 191-2
    DELETIONS TO THE LISTS OF NATIONAL CODES APPEARING ON THE
    STANDARD SHEETS OF IEC PUBLICATION 191-2

    Abstract - (Show below) - (Hide below)

    Contains more than 220 standard sheets covering device outline drawings and the types of semiconductor devices generally mounted in the packages. Published in the IEC since 1966, the drawings given in this publication represent the unification of national standards. The database version of this publication avails the standard sheets in PDF format and it also provides search facilities for easy retrieval of the drawings.
    Following years subscription CHF 150.-

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47D
    Development Note Also available in CD-ROM format. Also available in Database format. (09/2012) Stability Date: 2020. (09/2017) New Child IEC 60191-2 : 1.0 : AMD 21 2020 is now added
    Document Type Standard
    Product Note New Child IEC 60191-2 : 1.0 : AMD 21 2020 is now added
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS CECC 00802:1991 Harmonized system of quality assessment for electronic components. Guidance document: CECC standard method for the specification of surface mounting components (SMDs) of assessed quality
    BS CECC 20005(1986) : 1986 AMD 8004 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION. PHOTODIODES, PHOTODIODE ARRAYS (NOT INTENDED FOR FIBRE OPTIC APPLICATIONS)
    BS E9376(1976) : 1976 AMD 7597 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION. VARIABLE CAPACITANCE DIODE(S)
    BS IEC 60191-1:2007 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of discrete devices
    EN IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
    BS CECC 50010(1983) : 1983 AMD 7591 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - AMBIENT RATED THYRISTORS
    13/30284025 DC : 0 BS EN 60191-6-13 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA)
    BS EN 60191-3:2000 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of integrated circuits
    BS CECC 50013(1984) : 1984 AMD 7594 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS BLANK DETAIL SPEC - CURRENT REGULATOR & CURRENT REFERENCE DIODES
    BS QC 720102:1997 Blank detail specification for laser diode modules with pigtail for fibre optic systems and subsystems
    BS IEC 62679-1-1:2014 Electronic paper displays Terminology
    BS EN 60747-16-10:2004 Semiconductor devices Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
    03/117620 DC : DRAFT NOV 2003 IEC 60747-1 ED.2 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 1: GENERAL
    BS QC 750111:1991 Specification for harmonized system of quality assessment for electronic components. Semiconductor discrete devices. Blank detail specification. Bidirectional triode thyristors (triacs), ambient or case-rated, up to 100 A
    OVE/ONORM EN 60191-1 : 2007 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
    CEI EN 60191-6-13 : 2009 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINEPITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA)
    I.S. EN 60191-6:2009 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
    BS IEC 60747-1 : 2006 SEMICONDUCTOR DEVICES - PART 1: GENERAL
    I.S. EN 60286-4:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS (IEC 60286-4:2013 (EQV))
    EN 60191-6-13:2016 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
    EN 60603-12 : 1998 Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
    EN 61964:1999 Integrated circuits - Memory devices pin configurations
    EN 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
    EN 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
    DIN IEC 60286-3:1992-11 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING; PACKAGING OF LEADLESS COMPONENTS ON CONTINUOUS TAPES
    BS EN 150012:1993 Specification for harmonized system of quality assessment for electronic components. Blank detail specification: single gate field-effect transistors
    BS QC 760201:1992 Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: capability approval
    BS EN 60191-6-13:2016 Mechanical standardization of semiconductor devices Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
    BS CECC 50012(1978) : 1978 AMD 7593 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - SINGLE GATE FIELD EFFECT TRANSISTORS
    BS EN 61964:1999 Integrated circuits. Memory devices pin configurations
    BS CECC 20003(1986) : 1986 AMD 8002 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION. PHOTOTRANSISTORS,PHOTODARLINGTON TRANSISTORS,PHOTOTRANSISTOR ARRAYS
    BS QC 760101:1992 Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: qualification approval procedure
    CEI EN 60747-16-10 : 2005 SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS
    IEC 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
    I.S. EN 60747-16-10:2004 SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS
    I.S. EN 60191-1:2007 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
    CEI EN 61747-1 : 2004 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
    IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
    BS CECC50008(1992) : 1992 AMD 7698 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BLANK DETAIL SPECIFICATION: AMBIENT RATED RECTIFIER DIODES
    BS CECC50009(1992) : 1992 AMD 7699 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: CASE RATED RECTIFIER DIODES
    BS 6062-3:1993 Packaging of electronic components for automatic handling Specification for packaging of leadless components on continuous tapes
    CEI EN 60191-1 : 2008 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
    07/30162213 DC : 0 BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
    BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
    BS CECC20002(1988) : 1988 AMD 8001 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: INFRARED EMITTING DIODES, INFRARED EMITTING DIODE ARRAYS
    BS CECC50001(1981) : 1981 AMD 7590 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: GENERAL PURPOSE SEMICONDUCTOR DIODES
    IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
    BS E9374(1976) : 1976 AMD 7596 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: BIPOLAR TRANSISTORS FOR SWITCHING APPLICATIONS
    09/30214337 DC : 0 BS EN 60286-3 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
    BS IEC 60748-23-1:2002 Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification
    BS QC 763000(1990) : AMD 6754 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION
    BS IEC 60748-11:2000 Semiconductor devices. Integrated circuits Sectional specification for semiconductor integrated circuits excluding hybrid circuits
    05/30132036 DC : DRAFT APR 2005 IEC 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TEST AND BURN-IN SOCKET FOR BGA, LGA, FBGA AND FLGA
    BS EN 60191-6:2009 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    BS EN 60603-12:1998 Connectors for frequencies below 3 MHz for use with printed boards Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
    BS 3934-1:1992 Mechanical standardization of semiconductor devices Recommendations for the preparation of drawings of semiconductor devices
    BS IEC 61747-1 : 1998 AMD 10788 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - GENERIC SPECIFICATION
    BS CECC20006(1988) : 1988 AMD 8005 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION. PIN PHOTODIODES FOR FIBRE OPTIC APPLICATIONS
    BS 3934-3:1992 Mechanical standardization of semiconductor devices Recommendations for the preparation of outline drawings of integrated circuits
    BS QC790100(1991) : 1991 AMD 10586 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS
    I.S. EN 61188-5-6:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
    I.S. EN 60191-6-13:2016 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA)
    I.S. EN 60286-3:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013 (EQV))
    IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
    I.S. EN 60191-6-16:2007 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA
    IEC 60748-11:1990 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
    IEC 62679-1-1:2014 Electronic paper displays - Part 1-1: Terminology
    IEC 60747-10:1991 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
    IEC 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
    BS EN 150015:1993 Harmonized system of quality assessment for electronic components. Blank detail specification: unidirectional transient overvoltage suppressor diodes
    12/30244653 DC : 0 BS EN 62679-1 - ELECTRONIC PAPER DISPLAY - PART 1:TERMINOLOGY AND GENERIC SPECIFICATION
    01/205674 DC : DRAFT JUL 2001 IEC 60747-16-10 ED.1 - TECHNOLOGY APPROVAL SCHEDULE FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS
    BS CECC 50011(1983) : 1983 AMD 7592 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - CASE RATED THYRISTORS
    IEC 61045-1:1991 Fixed film resistor networks for use in electronic equipment - Part 1: Generic specification
    DIN 41870-2:1983-07 CASES FOR SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS; SURVEY, TERMINAL COVERING
    BS EN 60191-6-16:2007 Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
    BS EN 60286-3:2013 Packaging of components for automatic handling Packaging of surface mount components on continuous tapes
    BS 6062-3:1988 Packaging of electronic components for automatic handling. Specification for packaging of leadless components on continuous tapes
    05/30129010 DC : DRAFT FEB 2005 IEC 60191-1 ED.2 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
    BS EN 60286-4:2013 Packaging of components for automatic handling Stick magazines for electronic components encapsulated in packages of different forms
    BS EN 61747-1:2000 Liquid crystal and solid-state display devices Generic specification
    CEI EN 60286-4 : 2014 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS
    I.S. EN IEC 60191-1:2018 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
    I.S. EN 61964:2000 INTEGRATED CIRCUITS - MEMORY DEVICES PIN CONFIGURATIONS
    CEI EN 60191-6 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    BS EN 61188-5-6:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
    IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
    IEC 60603-12:1992 Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    IEC 61964:1999 Integrated circuits - Memory devices pin configurations
    IEC 60747-16-10:2004 Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
    IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
    IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
    IEC 60191-6-13:2016 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
    EN 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
    05/30139061 DC : DRAFT SEP 2005 IEC 60286-3 - PACKING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
    13/30284029 DC : 0 BS EN 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA
    CEI EN 60191-6-16 : 2008 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA
    BS 3934-6:1992 Mechanical standardization of semiconductor devices Specification for the preparation of outline drawings of surface mounted semiconductor device packages
    BS E9377(1976) : 1976 AMD 7598 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: CASE RATED BIPOLAR TRANSISTORS FOR HIGH FREQUENCY AMPLIFICATION
    04/30122195 DC : DRAFT SEP 2004 IEC 60747-1 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 1: GENERAL
    05/30132033 DC : DRAFT APR 2005 IEC 60191-6-13 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP TYPE SOCKET FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA)
    IEC 60747-4-1:2000 Semiconductor devices - Discrete devices - Part 4-1: Microwave diodes and transistors - Microwave field effect transistors - Blank detail specification
    07/30167960 DC : 0 BS EN 60191-6 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
    IEC 60748-23-1:2002 Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
    EN 60747-16-10:2004 Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
    EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
    EN 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
    EN 61747-1:1999/A1:2003 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
    EN 60286-3:2013/AC:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
    EN 150012 : 1991 Blank Detail Specification: Single gate field-effect transistors
    BS CECC20001(1991) : 1991 AMD 8000 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: LIGHT EMITTING DIODES, LIGHT EMITTING DIODE ARRAYS, LIGHT EMITTING DIODE DISPLAYS WITHOUT INTEGRAL LOGIC AND RESISTORS
    BS CECC20004(1988) : 1988 AMD 8003 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - AMBIENT RATED PHOTOCOUPLERS WITH PHOTOTRANSISTOR OUTPUT

    Standards Referencing This Book - (Show below) - (Hide below)

    ISO 1101:2017 Geometrical product specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run-out
    ISO 370:1975 Toleranced dimensions Conversion from inches into millimetres and vice versa
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