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  • IEC 60191-6-22:2012

    Current The latest, up-to-date edition.

    Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  11-12-2012

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Terminal position numbering
    5 Code of package nominal dimensions
    6 Symbols and drawings
    7 Dimensions
    8 Combination list of D, E, M[D], and M[E]
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47D
    Development Note Stability date: 2022. (12/2012)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    17/30361860 DC : DRAFT JUL 2017 BS EN 62148-21 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 21: DESIGN GUIDE OF ELECTRICAL INTERFACE OF PIC PACKAGES USING SILICON FINE-PITCH BALL GRID ARRAY (S-FBGA) AND SILICON FINE-PITCH LAND GRID ARRAY (S-FLGA)

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    IEC 60191-6-12:2011 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
    IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
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