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  • IEC 60191-6-4:2003

    Current The latest, up-to-date edition.

    Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English, English - French

    Published date:  11-06-2003

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Reference character and drawings
      4.1 Ball grid array package (BGA) Type 1 - Ball datum
      4.2 Ball grid array package (BGA) Type 2 - Body datum
    5 Measuring method
      5.1 Datum S as pertaining to ball coplanarity
      5.2 Datum A, B
      5.3 Definition of specified dimensions and measuring method
      5.4 Profile of a package edge surface v
      5.5 Mounting height A
      5.6 First stand-off A1
      5.7 Second stand-off A4
      5.8 Ball diameter b
      5.9 Ball centre position X
      5.10 Ball coplanarity y
      5.11 Package top flatness y1

    Abstract - (Show below) - (Hide below)

    IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47D
    Development Note Stability Date: 2017. (10/2012) A Bilingual edition has been published. (12/2012)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 60191-6-18:2010 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
    EN 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
    IEC PAS 60191-6-18:2008 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
    CEI EN 60191-6-18 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
    I.S. EN 60191-6-18:2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
    IEC 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
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