IEC 60286-4 : 3.0

Current

Current The latest, up-to-date edition.

PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS

Available format(s): Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

Language(s): English - French

Published date: 26-07-2013

Publisher: International Electrotechnical Committee

Table of Contents - (Show below) - (Hide below)

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and conventions
4 Shape and cross-section of stick magazine
5 Dimensions of stick magazines
6 Mechanical stability
7 End stoppers and spacers
8 Orientation of the components in the
  stick magazine
9 Marking
Annex A (informative) - DIL packages for through-hole
        mount
Annex B (informative) - SO packages for surface mounting
Annex C (informative) - Leaded chip carrier packages
        (PLCC) for surface mounting
Annex D (normative) - Rule for the orientation of integrated
        circuit packages in handling and shipping carriers
        such as stick magazines and rails (from
        IEC 60191-3:1999, Annex G)
Bibliography

Abstract - (Show below) - (Hide below)

Pertains to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant.

General Product Information - (Show below) - (Hide below)

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Development Note	Stability Date: 2018. (10/2012)
Pages
ISBN
Committee	TC 40

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
DS EN 60286-4 : 2013	Identical
NBN EN 60286-4 : 2014	Identical
NEN EN IEC 60286-4 : 2013	Identical
PN EN 60286-4 : 2013	Identical
UNE EN 60286-4 : 2000	Identical
BS EN 60286-4 : 2013	Identical
CEI EN 60286-4 : 2014	Identical
EN 60286-4 : 2013	Identical
NF EN 60286-4 : 2014	Identical
DIN EN 60286-4:2014-04	Identical
UNE EN 60286-4 : 2000	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

BS ISO 21067-1 : 2016	PACKAGING - VOCABULARY - PART 1: GENERAL TERMS
BS EN 61188-5-4 : 2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
I.S. EN 61188-5-2:2003	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
BS EN 61760-2 : 2007	SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
BS EN 61760-1 : 2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
BS EN 61760-3 : 2010	SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
BS EN 62090 : 2017	PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO- DIMENSIONAL SYMBOLOGIES (IEC 62090:2017)
09/30186180 DC : 0	BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
16/30333617 DC : 0	BS EN 62090 - PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
CEI EN 61760-2 : 2008	SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
IPC 1758 : 0	DECLARATION REQUIREMENTS FOR SHIPPING, PACK AND PACKING MATERIALS
CEI EN 61760-1 : 2007	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
I.S. EN 62090:2017	PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
I.S. EN 61760-3:2010	SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
IEC 62090 : 2.0	PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
NF EN 61760-3 : 2010	SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
CEI EN 61760-3 : 2010	SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
ISO 21067-1 : 2016	PACKAGING - VOCABULARY - PART 1: GENERAL TERMS
I.S. EN 61760-2:2007	SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
I.S. EN 61188-5-4:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
I.S. EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
BS EN 61188-5-2 : 2003	PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
IEC 61760-2 : 2.0	SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
IEC 61188-5-4 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
IEC 61188-5-2 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
IEC 61760-1 : 2.0	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
EN 61760-1 : 2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
EN 61760-3 : 2010	SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING

Standards Referencing This Book - (Show below) - (Hide below)

ISO 11469 : 2016	PLASTICS - GENERIC IDENTIFICATION AND MARKING OF PLASTICS PRODUCTS
IEC 60191-2 : 1.0	MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 2: DIMENSIONS
IEC 60747-1 : 2.1	SEMICONDUCTOR DEVICES - PART 1: GENERAL
IEC 60191-3 : 2.0	MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF INTEGRATED CIRCUITS

Add To Cart

Product Format

Quantity

add to cart

IEC 60286-4 : 3.0

Table of Contents - (Show below) - (Hide below)

Abstract - (Show below) - (Hide below)

General Product Information - (Show below) - (Hide below)

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Standards Referenced By This Book - (Show below) - (Hide below)

Standards Referencing This Book - (Show below) - (Hide below)

Add To Cart

Publisher

Category

Sub Category

Looking for Subscription Services?