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  • IEC 60326-10:1991

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Withdrawn date:  31-12-2021

    Language(s):  English - French

    Published date:  19-03-1991

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 General
    4 Test specimens
    5 Relevant specification
    6 Characteristics of printed boards
    7 Test patterns - Test boards
    Figures

    Abstract - (Show below) - (Hide below)

    Relates to flex-rigid double-sided printed boards with through connections irrespective of their method of manufacture. Intended as a basis on which agreements between purchaser and vendor can be made. Defines the characteristics to be assessed, the test methods to be used, and establishes uniform requirements for judging properties and dimensions.Not applicable to flat cables.

    General Product Information - (Show below) - (Hide below)

    Development Note Also numbered as BS 6221-10(1991) (09/2005)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    BS EN 123700:1997 Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid double sided printed boards with through connections
    EN 123700:1996 Sectional Specification: Flex-rigid double sided printed board with through connections

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
    IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 60326-3:1991 Printed boards - Part 3: Design and use of printed boards
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