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  • IEC 60512-12-7:2001

    Current The latest, up-to-date edition.

    Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French, Spanish, Castilian

    Published date:  24-01-2001

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope and object
    2 Normative references
    3 Preparation of the specimen
    4 Procedure
      4.1 Accelerated ageing
      4.2 Flux
    5 Final measurement
    6 Requirements
    7 Details to be specified

    Abstract - (Show below) - (Hide below)

    Defines a standard test method to assess the solderability of the terminations of a component designed for use with printed boards or for other applications using similar soldering techniques.

    General Product Information - (Show below) - (Hide below)

    Committee TC 48/SC 48B
    Development Note Also numbered as BS EN 60512-12-7. (08/2001) Stability Date: 2017. (10/2012)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
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