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  • IEC 60512-16-21:2012

    Current The latest, up-to-date edition.

    Connectors for electronic equipment - Tests and measurements - Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stresses

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  07-05-2012

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 Test equipment
    5 Preparation of the specimens
    6 Measurement of whisker length
    7 Test method
    8 Requirements
    9 Information to be recorded
    10 Details to be specified
    Annex A (informative) - Whisker growth due to
            mechanical stresses induced by
            assembly processes and intended
            usage

    Abstract - (Show below) - (Hide below)

    IEC 60512-16-21:2012 The object of this standard is to define a standard test method to assess the possibility of whisker growth by external mechanical stress on the tin and tin-alloy plated parts of a connector in its application (after wire termination, after soldering, after mounting, mated with counterpart). This standard does not cover internal stress type whisker. This part of IEC 60512, when required by the detail specification, is used for testing connectors within the scope of IEC technical committee 48. It may also be used for similar devices when specified in a detail specification. Keywords: Whisker growth, external mechanical stress

    General Product Information - (Show below) - (Hide below)

    Committee TC 48/SC 48B
    Development Note Stability Date: 2017. (10/2012)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-82:2007 Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    IEC 60512-1:2001 Connectors for electronic equipment - Tests and measurements - Part 1: General
    IEC 60050-581:2008 International Electrotechnical Vocabulary (IEV) - Part 581: Electromechanical components for electronic equipment
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