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  • IEC 60749-6:2017

    Current The latest, up-to-date edition.

    Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French, English

    Published date:  03-03-2017

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Test apparatus
    5 Procedure
    6 Summary
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 60749-6:2017 is to test and determine the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied. This test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure methods and time-to-failure of solid state electronic devices, including non-volatile memory devices (data-retention failure mechanisms). This test is considered non-destructive but should preferably be used for device qualification. If such devices are used for delivery, the effects of this highly accelerated stress test will need to be evaluated. Thermally activated failure mechanisms are modelled using the Arrhenius equation for acceleration, and guidance on the selection of test temperatures and durations can be found in IEC 60749-43.
    This edition includes the following significant technical changes with respect to the previous edition:
    a) additional test conditions;
    b) clarification of the applicability of test conditions.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47
    Development Note Supersedes IEC PAS 62205 (08/2002) Supersedes IEC 60749. (03/2008) Stability Date: 2022. (03/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    17/30355772 DC : 0 BS EN 62047-33 ED.1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 33: MEMS PIEZORESISTIVE PRESSURE-SENSITIVE DEVICE
    BS EN 62149-2:2014 Fibre optic active components and devices. Performance standards 850 nm discrete vertical cavity surface emitting laser devices
    13/30277888 DC : 0 BS EN 62149-2 ED 2.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 2: 850 NM DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER DEVICES
    BS EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans
    I.S. EN 62572-3:2016 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
    IEC 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
    CEI EN 60747-15 : 2012 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
    EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
    EN 62149-8:2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices
    IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
    BS EN 62149-8:2014 Fibre optic active components and devices. Performance standards Seeded reflective semiconductor optical amplifier devices
    BS IEC 60747-14-5:2010 Semiconductor devices Semiconductor sensors. PN-junction semiconductor temperature sensor
    I.S. EN 60747-15:2012 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV))
    I.S. EN 62149-8:2014 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 8: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER DEVICES
    EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
    07/30162213 DC : 0 BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
    BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices Semiconductor accelerometers
    15/30323391 DC : 0 BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS PART 3: LASER MODULES USED FOR TELECOMMUNICATION
    13/30277892 DC : 0 BS EN 62572-3 ED 2.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
    BS EN 60747-15:2012 Semiconductor devices. Discrete devices Isolated power semiconductor devices
    IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    13/30264591 DC : 0 BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
    BS EN 62572-3:2016 Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication
    13/30277845 DC : 0 BS EN 62149-8 ED 1.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARD - PART 8: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER DEVICES
    15/30269562 DC : 0 BS EN 60749-43 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR LSI RELIABILITY QUALIFICATION PLANS
    13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
    IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
    CEI EN 60749-43 : 1ED 2018 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
    IEC 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
    IEC 62149-2:2014 Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices
    PD IEC/TS 62686-1:2015 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
    13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
    I.S. EN 62149-2:2014 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 2: 850 NM DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER DEVICES
    I.S. EN 60749-43:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
    IEC 60747-5-6:2016 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
    IEC 62149-8:2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices
    IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
    EN 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
    EN 62149-2:2014 Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    IEC 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
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