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  • IEC 61188-6-1:2021

    Current The latest, up-to-date edition.

    Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  23-02-2021

    Publisher:  International Electrotechnical Committee

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    Abstract - (Show below) - (Hide below)

    IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

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    Committee TC 91
    Document Type Standard
    Product Note THIS STANDARD IS ALSO REFERES TO IEC 61188-6-2, IPC SM 782, IPC SM 782A
    Publisher International Electrotechnical Committee
    Status Current
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