Skip to content
Please enter a keyword to search

  • IEC 61188-6-2:2021

    Current The latest, up-to-date edition.

    Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  04-02-2021

    Publisher:  International Electrotechnical Committee

    Add To Cart

    Abstract - (Show below) - (Hide below)

    IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective