EN 60664-3 : 2017
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION (IEC 60664-3:2016) |
BS EN 62137 : 2004
|
ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
BS EN 61189-5-4 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
11/30253280 DC : 0
|
BS EN 62326-20 ED.1 - ELECTRONIC CIRCUIT BOARD FOR HIGH-BRIGHTNESS LEDS |
BS IEC 61189-5-4 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
12/30271778 DC : 0
|
BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
BS EN 62137-4 : 2014
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
12/30239867 DC : 0
|
BS EN 62368-1 - AUDIO/VIDEO, INFORMATION AND COMMUNICATION TECHNOLOGY EQUIPMENT - PART 1: SAFETY REQUIREMENTS |
IEC 60664-3 REDLINE : 3ED 2016
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
I.S. EN 62137-4:2014
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
CEI EN 61249-4-1 : 2010
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
12/30274804 DC : 0
|
BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE |
14/30304003 DC : 0
|
BS EN 62899-1 ED.1 - PRINTED ELECTRONICS - MATERIALS - PART 1: SUBSTRATES |
BS EN 62326-4-1 : 1997
|
PRINTED BOARDS - RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS, A, B AND C |
BS EN 61249-2-13 : 1999
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - CYANATE ESTER NON-WOVEN ARAMID LAMINATE OF DEFINED FLAMMABILITY, COPPER-CLAD |
BS EN 61192-4 : 2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES |
BS EN 62326-20 : 2016
|
PRINTED BOARDS - PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS |
14/30309692 DC : 0
|
BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS |
BS EN 61249-4-1 : 2008
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
BS EN 61188-1-2 : 1998
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - GENERIC REQUIREMENTS - CONTROLLED IMPEDANCE |
BS IEC 61189-5-3 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
BS EN 61189-5 : 2006
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
BS EN 61189-11 : 2013
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS |
BS EN 61249-5-4 : 1997
|
MATERIALS FOR INTERCONNECTION STRUCTURES - SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS - CONDUCTIVE INKS |
96/205775 DC : 0
|
BS CECC 210003 - TECHNOLOGY APPROVAL SCHEDULE FOR PRINTED BOARDS |
BS IEC 61189-5-2 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
BS EN 61189-5-3 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
BS EN 62326-4 : 1997
|
PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION |
BS EN 62878-1-1 : 2015
|
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
BS EN 61189-5-2 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
BS EN 61192-1 : 2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL |
BS EN 61249-2-12 : 1999
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - EPOXIDE NON-WOVEN ARAMID LAMINATE OF DEFINED FLAMMABILITY, COPPER-CLAD |
NF EN 62326 4-1 : 1998
|
PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION PERFORMANCE LEVELS A, B AND C |
I.S. EN 61189-11:2013
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS (IEC 61189-11:2013 (EQV)) |
BS EN 61249-8-8 : 1997
|
MATERIALS FOR INTERCONNECTION STRUCTURES - SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER COATINGS |
NBR IEC 62326-1 : 2007
|
PRINTED BOARDS - PART 1: GENERIC SPECIFICATION |
12/30274800 DC : 0
|
BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE |
CEI EN 61249-8-7 : 1997
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS |
12/30258453 DC : 0
|
BS EN 62368-1 AMD - AUDIO/VIDEO, INFORMATION AND COMMUNICATION TECHNOLOGY EQUIPMENT - PART 1: SAFETY REQUIREMENTS |
16/30336979 DC : 0
|
BS EN 60664-3 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
BS EN 61193-3 : 2013
|
QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING |
BS EN 62326-1 : 2002
|
PRINTED BOARDS - PART 1: GENERIC SPECIFICATION |
BS EN 61249-8-7 : 1997
|
MATERIALS FOR INTERCONNECTION STRUCTURES - SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - MARKING LEGEND INKS |
NBR IEC 62326-4 : 2007 ERRATA 2007
|
PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION |
NF EN 62326-20 : 2016
|
PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS |
I.S. EN 61189-5-4:2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
09/30201707 DC : 0
|
BS EN 60664-3+A1 ED.2 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
BS EN 61190-1-1 : 2002
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
NF EN 60664-3 : 2017
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
NF EN 61189-5-4 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
NF EN 61249 8-8 : 1998
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS |
I.S. EN 61189-5-3:2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 61189-2:2006
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES |
BS IEC 62899-201 : 2016
|
PRINTED ELECTRONICS - PART 201: MATERIALS - SUBSTRATES |
I.S. EN 61189-5:2006
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
CEI EN 62878-1-1 : 2016
|
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
I.S. EN 61193-3:2013
|
QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING (IEC 61193-3:2013 (EQV)) |
I.S. EN 61192-1:2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
I.S. EN 62326-20:2016
|
PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
BS EN 60664-3 : 2017
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION (IEC 60664-3:2016) |
I.S. EN 61189-5-2:2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 60664-3:2017
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
UNE EN 60664-3 : 2004
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
CEI EN 62326-1 : 2002
|
PRINTED BOARDS - PART 1: GENERIC SPECIFICATION |
I.S. EN 61249-5-4:1999
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS - SECTION 4: CONDUCTIVE INKS |
CEI EN 61249-5-4 : 1997
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS SECTION 4: CONDUCTIVE INKS |
NF EN 61189-5 : 2008
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 62326-1:2002
|
PRINTED BOARDS - GENERIC SPECIFICATION |
12/30274796 DC : 0
|
BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX |
I.S. EN 61249-8-7:1999
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS |
I.S. EN 61249-4-1:2008
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
IEC 60664-3 : 3.0:2016
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
I.S. EN 61190-1-1:2002
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
I.S. EN 61192-4:2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES |
I.S. EN 62137:2005
|
ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
I.S. EN 62878-1-1:2015
|
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
IEC 61191-1 : 2.0
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 62326-4-1 : 1.0
|
PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B AND C |
I.S. EN 61249-8-8:1999
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER |
IEC 62899-201 : 1ED 2016
|
PRINTED ELECTRONICS - PART 201: MATERIALS - SUBSTRATES |
IEC 61189-5-2 : 1ED 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
16/30330036 DC : 0
|
BS EN 62788-2 - MEASUREMENT PROCEDURES FOR MATERIALS USED IN PHOTOVOLTAIC MODULES - PART 2: POLYMERIC MATERIALS USED FOR FRONTSHEETS AND BACKSHEETS |
07/30091745 DC : 0
|
BS IEC 62368 - AUDIO/VIDEO, INFORMATION AND COMMUNICATION TECHNOLOGY EQUIPMENT - SAFETY - REQUIREMENTS |
IEC 62326-20 : 1ED 2016
|
PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS |
IEC 61249-8-8 : 1.0
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS |
IEC 61189-5 : 1.0
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
BS PD IEC TS 62788-2 : 2017
|
MEASUREMENT PROCEDURES FOR MATERIALS USED IN PHOTOVOLTAIC MODULES - PART 2: POLYMERIC MATERIALS - FRONTSHEETS AND BACKSHEETS |
IEC 61189-5-4 : 1ED 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
IEC 62137 : 1.0
|
ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FGBA, BGA, FLGA, LGA, SON AND QFN |
IEC 62326-1 : 2.0
|
PRINTED BOARDS - PART 1: GENERIC SPECIFICATION |
BS EN 61191-1 : 2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
BS EN 61189-2 : 2006
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES |
IEC 61190-1-1 : 1.0
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
IEC 62878-1-1 : 1ED 2015
|
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
15/30327712 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
11/30255124 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 61188-1-2 : 1.0
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - GENERIC REQUIREMENTS - CONTROLLED IMPEDANCE |
IEC 61189-5-3 : 1ED 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
IEC 61192-1 : 1.0
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL |
IEC TS 62788-2 : 1ED 2017
|
MEASUREMENT PROCEDURES FOR MATERIALS USED IN PHOTOVOLTAIC MODULES - PART 2: POLYMERIC MATERIALS - FRONTSHEETS AND BACKSHEETS |
IEC 61193-3 : 1ED 2013
|
QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING |
IEC 61189-11 : 1ED 2013
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS |
IEC 61192-4 : 1.0
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES |
IEC 61189-2 : 2.0
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES |
IEC 61249-4-1 : 1.0
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
IEC 62137-4 : 1ED 2014
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
UNE EN 60664-3 : 2004
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |