IEC 61191-6 : 1.0

Current

Current The latest, up-to-date edition.

PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD

Publisher: International Electrotechnical Committee

Published: 14-01-2010

Available Formats: PDF - English - French, Hardcopy - English - French
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Voids in solder joints
5 Measurement
6 Void occupancy
7 Evaluation
Annex A (informative) - Experimental results and simulation
                        of voids and decrease of life due to
                        thermal stress
Annex B (informative) - X-ray transmission equipment
Annex C (informative) - Voids in BGA solder ball
Annex D (informative) - Measurement using X-ray transmission
                        imaging
Bibliography

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Describes the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation.

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Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 91

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
DS EN 61191-6 : 2010	Identical
NF EN 61191-6 : 2010	Identical
NEN EN IEC 61191-6 : 2010	Identical
I.S. EN 61191-6:2010	Identical
PN EN 61191-6 : 2010	Identical
UNE-EN 61191-6:2010	Identical
BS EN 61191-6 : 2010	Identical
CEI EN 61191-6 : 2011	Identical
EN 61191-6 : 2010	Identical
DIN EN 61191-6 : 2011	Identical
JIS C 61191-6:2011	Identical
NEN EN IEC 61191-6 : 2010	Identical
NF EN 61191-6 : 2010	Identical
DS EN 61191-6 : 2010	Identical
BS EN 61191-6 : 2010	Identical
DIN EN 61191-6 : 2011	Identical
CEI EN 61191-6 : 2011	Identical
UNE-EN 61191-6:2010	Identical
PN EN 61191-6 : 2010	Identical
I.S. EN 61191-6:2010	Identical

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60068-1 : 7.0	ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE
IEC 61191-1 : 2.0	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 60194 : 6.0	PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IEC 61190-1-3 : 2.1	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

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IEC 61191-6 : 1.0

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