IEC 60294:2012
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Measurement of the dimensions of a cylindrical component with axial terminations |
BS EN 60115-2:2015
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Fixed resistors for use in electronic equipment Sectional specification: Leaded fixed low power film resistors |
EN 60115-2:2015
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Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
BS EN 61192-5:2007
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Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies |
IEC 60115-2:2014
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Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
BS EN 60717:2012
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Method for the determination of the space required by capacitors and resistors with unidirectional terminations |
BS EN 61192-4:2003
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Workmanship requirements for soldered electronic assemblies Terminal assemblies |
BS EN 61192-1:2003
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Workmanship requirements for soldered electronic assemblies General |
BS EN 61192-2:2003
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Workmanship requirements for soldered electronic assemblies Surface-mount assemblies |
BS EN 60068-2-82:2007
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Environmental testing Tests. Test Tx. Whisker test methods for electronic and electric components |
BS EN 61193-1:2002
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Quality assessment systems Registration and analysis of defects on printed board assemblies |
BS EN 60294:2012
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Measurement of the dimensions of a cylindrical component with axial terminations |
BS 6221-25:2000
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Printed wiring boards Guide to the rework and repair of soldered surface mounted printed board assemblies |
97/206324 DC : DRAFT MAY 1997
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97/230541 DC : DRAFT AUG 1997
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NF EN 60068-2-82 : 2013
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ENVIRONMENTAL TESTING - PART 2-82 : TESTS - TEST XW1 : WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
EN 61193-1:2002
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Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
EN 61192-5 : 2007
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WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
IEC 61192-1:2003
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Workmanship requirements for soldered electronic assemblies - Part 1: General |
IEC 61192-5:2007
|
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
EN 61192-2:2003
|
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
IEC 61193-1:2001
|
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
EN 60717:2012
|
Method for the determination of the space required by capacitors and resistors with unidirectional terminations |
EN 61192-1:2003
|
Workmanship requirements for soldered electronic assemblies - Part 1: General |
IEC 60068-2-82:2007
|
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
IEC 60717:2012
|
Method for the determination of the space required by capacitors and resistors with unidirectional terminations |
EN 61192-4:2003
|
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
EN 60068-2-82:2007
|
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
EN 60294:2012
|
Measurement of the dimensions of a cylindrical component with axial terminations |
IEC 61192-4:2002
|
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
IEC 61192-2:2003
|
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |