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  • IEC 61249-2-13:1999

    Current The latest, up-to-date edition.

    Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English, English - French, Spanish, Castilian

    Published date:  26-02-1999

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Materials and construction
    4 Internal marking
    5 Electrical properties
    6 Non-electrical properties of the copper-clad
       laminate
    7 Non-electrical properties of the base material
       after complete removal of the copper foil
    8 Packaging and marking
    9 Acceptance testing
    Annex A (informative) Conversion table for test
            method reference numbers

    Abstract - (Show below) - (Hide below)

    Gives requirements for properties of cyanate ester non-woven aramid copper-clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Also numbered as BS EN 61249-2.13 (08/2004) Supersedes IEC 60249-2-13. (03/2008) Stability Date: 2018. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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